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Diodes Product Change Notices

Welcome to our Product/Process Change Notification (PCN) pages dating back to year 2016. To locate PCNs, please select year from the menu on this page.

Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.

To Automatically Receive PCN Notification / E-mail Alerts

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2546 2021-09-23 2021-12-23 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan for Select Lite-On Semiconductor (LSC) Brand Automotive Products.
PCN-2543 2021-08-30 2021-11-30 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products in SMA Package
PCN-2542 2021-08-30 2021-11-30 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package
PCN-2540 2021-08-08 2021-11-08 Analog Semiconductors Qualified Additional Fab Site, Assembly/Test (A/T) Sites, Bill of Material (BOM) and updated Device Data Sheets
PCN-2539 2021-09-09 2022-03-09 Analog Device End of Life (EOL)
PCN-2536 2021-08-06 2021-08-06 Discrete Device End of Life (EOL)
PCN-2534 2021-07-29 2021-10-29 Analog Semiconductors Qualified Additional BUMP Site (LBS) and Assembly/Test (A/T) Site (CAT)
PCN-2533 2021-09-02 2022-03-02 Discrete Device End of Life (EOL)
PCN-2531 2021-07-30 2021-11-15 Analog Additional Die Revision, Redistribution Layer (RDL), BUMP Sites (SJSEMI and LBS), as well as Assembly/Test (A/T) Site (CAT)
PCN-2530 2021-09-03 2021-12-03 Discrete Addition of a Passivation Layer Over the Top Metal of the Die for Select Lite-On Semiconductor (LSC) Brand Products
PCN-2529 2021-06-01 2021-06-01 Discrete and Analog Conversion to Diodes Incorporated standard product labels and shipping boxes for products currently using Lite-On Semiconductor product labels and boxes.
PCN-2528 2021-07-20 2022-01-20 Discrete Device End of Life (EOL)
PCN-2527 2021-06-09 2021-09-09 Analog Semiconductors Additional Wafer Source (GFAB, JKFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Additional Assembly/Test
(A/T) Site (CAT)
PCN-2526 2021-06-09 2021-09-09 Analog Semiconductors - Automotive Additional Wafer Source (GFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Additional Assembly/Test Site (CAT)
PCN-2522 2021-08-24 2021-11-24 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products
PCN-2521 2021-05-27 2021-08-27 Analog Semiconductors - Automotive Qualified Additional Bill of Materials (BOM) - Automotive
PCN-2520 2021-05-27 2021-08-27 Analog Semiconductors Qualified Additional Bump Site and Assembly/Test (A/T) Sites
PCN-2519 2021-05-20 2021-11-20 Analog Device End of Life (EOL)
PCN-2518 2021-06-29 2021-09-29 Discrete Semiconductors Qualification of Additional Diodes Internal Assembly & Test (A/T) Site (SAT)
PCN-2517 2021-05-24 2020-11-24 Discrete Device End of Life (EOL)
PCN-2514 2021-03-09 2021-06-09 Analog Additional Wafer Source JKFAB
PCN-2513 2021-03-08 2021-06-08 Analog - Automotive Additional Wafer Source GFAB - Automotive
PCN-2512 2021-04-16 2021-07-16 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Site
PCN-2511 2021-09-13 2021-12-13 Discrete Wafer Diameter Change from 3 inch to 4 inch at Diodes Shanghai Seefull Electronic Co., Ltd. (SSEC FAB) on Select Products
PCN-2510 2021-02-26 2021-05-26 Analog Semiconductors Qualified Additional A/T Sites, Fab Site and Data Sheet Change
PCN-2509 2021-02-09 2021-05-09 Analog Semiconductors (Automotive) Qualified Additional FL Series Package (Automotive)
PCN-2508 2021-03-17 2021-03-18 Discrete Change Date Code Marking Information from “YM” (Year/Month) to “YW” (Year/Week)
PCN-2507 2021-02-03 2021-05-03 Discrete and Analog Semiconductors Qualification of Additional Wafer Backside Material Supplier
PCN-2506 2021-02-09 2021-05-09 Analog Semiconductors Qualified Additional FL Series Package
PCN-2505 2021-01-26 2021-07-26 Analog Device End of Life (EOL)
PCN-2502 2021-03-15 2021-09-15 Discrete Device End of Life (EOL)
PCN-2501 2021-01-13 2021-04-13 Analog Semiconductors Qualified Additional A/T Sites
PCN-2500 2021-03-24 2021-06-24 Discrete Semiconductors Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products
PCN-2499 2021-06-23 2021-09-23 Discrete Products Change DBF Package Outline Dimensions for Select Products
PCN-2498 2021-04-07 2021-04-07 Discrete Qualification of Additional Wafer Source, and Additional Assembly and Test (A/T) Site for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Discrete Semiconductors Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2493 2020-12-28 2021-03-28 Analog Semiconductors Qualified Additional A/T Sites and Bill of Materials (BOM)
PCN-2492 2020-11-04 2021-05-04 Analog Device End of Life (EOL)
PCN-2491 2020-11-17 2021-05-17 Discrete Device End of Life (EOL)
PCN-2490 2020-10-22 2021-01-22 Analog Additional Wafer Source (LiteOn Semiconductor Corp.)
PCN-2488 2020-10-20 2021-01-20 Analog Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and BOM Change
PCN-2487 2020-10-07 2021-01-07 Analog Fab Porting from Global Foundries to Magnachip, Assembly & Test Site Transfer, and Datasheet Change
PCN-2485 2020-12-04 2021-03-04 Discrete (Automotive) Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Qualification of Additional Wafer Source for Select Discrete Automotive Products
PCN-2484 2020-11-04 2021-02-04 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Standardization of Assembly Bill of Materials At The Existing CAT Site for Select Discrete Products
PCN-2481 2020-08-26 2021-02-26 Analog Device End of Life (EOL)
PCN-2480 2020-10-21 2021-01-21 Analog Semiconductors Additional Qualified (AT) Assembly Test Site SIMAT
PCN-2478 2020-08-13 2021-06-06 Discrete - Automotive Additional Wafer Source (GFAB)
PCN-2477 2020-08-17 2021-05-09 Discrete Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2475 2020-08-06 2020-11-06 Discrete Qualification of Assembly & Test Site Transfer for Select Discrete Products
PCN-2474 2020-12-16 2021-03-16 Discrete Qualification of Additional Wafer Source for Select Discrete Products