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Diodes Product Change Notices

Welcome to our Product/Process Change Notification (PCN) pages dating back to year 2002. To locate PCNs, please select year from the menu on this page.

Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.

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PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2248 2017-05-09 Analog - Automotive Lead Frame Supplier Change and Datasheet Change for High Level Gate Driver Output Voltage Minimum and Typical Values on Select Analog Automotive Parts This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified lead frames from supplier ASM for below listed products. The current supplier of lead frames will cease production. The base material, dimensions and plating of the lead frame are not changing.

Additionally a change will be made to the ZXLD1371QESTTC datasheet as follows: Change of VGateH min limit from 10V to 9.5V @ 12V Vin. See Figures 1 & 2 in this PCN.
PCN-2188 2017-08-08 Discrete Device End of Life (EOL) Products listed in Tables 1 – 3 will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. For some products, a life-time buy opportunity is available until the last order date of 8 August, 2017, with the last ship date of 8 February, 2018.
PCN-2257 2017-05-06 Analog Datasheet Change for High Level Gate Driver Output Voltage Minimum and Typical Values on Select Analog Parts This PCN is being issued to notify customers that there will be changes to the datasheet as described in the Figures in this PCN.
PCN-2259 2017-02-02 Discrete Qualification of Additional Wafer Sources for Select Discrete Products This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified additional wafer sources, JiLin Magic Semiconductor Co., Ltd. (JMSC) in JiLin, China, Lite-On Semiconductor Corporation (LSC) in Keelung, Taiwan, or Phenitec Semiconductor Corp. in Okayama, Japan for devices as indicated in the tables in this PCN.
PCN-2253 2017-07-26 Analog Device End of Life (EOL) Products listed in Tables 1 – 3 will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. For some products, a life-time buy opportunity is available until the last order date of 26 July, 2017 with a last ship date of 25 January, 2018.
PCN-2195 2017-04-17 Analog Bill of Materials (BOM) Changes for Select Analog Devices This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified additional Bill of Materials (BOM) on selected devices. Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2250 2017-03-07 Analog Change of Assembly Materials/Process, and Mechanical Specifications for Various Parts This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified the changes identified below on selected Analog devices. Full electrical characterization and reliability testing have been completed to ensure that no changes in product reliability, device functionality or data sheet electrical specifications exist. There will be no change to the Function of affected products.
PCN-2254 2017-03-06 Analog Addition of New Fab/Assembly Site and Design Change This PCN is being issued to notify customers that in order to assure continuity of supply for select parts, Diodes has qualified additional Assembly and Test sites, Tianshui Huatian Technology Co (TSHT) and JCET ChuZhou, and for other select parts Diodes has qualified an additional wafer fab, Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd (SFAB2).
PCN-2244 2017-02-20 Discrete Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, and Conversion to Copper Bond Wire on Select Products at Diodes Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai (SAT) This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified "Diodes Technology (Cheng Du) Company Limited" (CAT) located in Chengdu, China as an additional Assembly & Test (A/T) Site for select parts using Copper bond wire. In addition, the conversion from Gold to Copper bond wire on select Discrete products at Diodes Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai (SAT).
PCN-2193 2017-02-04 Analog Device End of Life Products listed in Tables 1 & 2 will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. Please contact your local Diodes representatives for any questions or additional information. UPDATE: No Life-time buy is being offered. Last date to place orders for EOL devices in inventory is 4th November, 2016. Replacement device part numbers in red text in Table 1 have been updated.
PCN-2208 2017-01-09 Discrete Qualification of New Lead Frame and Mold Compound and Conversion to Copper Bond Wire on Selected Zener Products This PCN is being issued to notify customers that in order to improve product manufacturability, Diodes Incorporated has qualified a new lead frame (with corresponding change in contact layout as pictured below) and mold compound as well as Copper bond wire for Zener diode products listed below. The package type will be changed from POWERDI-323 (Current) to POWERDI-323B (Future) due to the lead frame change. There is no change to Package Outline Dimensions and Suggested Pad Layout specified in the device data sheet.Full electrical characterization and reliability testing has been completed on representative part numbers built with new lead frame, mold compound and Cu wire to ensure there is no change to product reliability, device functionality or electrical specifications in the device datasheet. There will be no change to the Fit or Function of affected products.
PCN-2224 2016-12-01 Discrete Wafer Diameter Change from 5 inch to 6 inch at Diodes FabTech (KFAB) on selected Automotive “Q” parts This PCN is being issued to notify customers that our internal wafer fabrication source (Diodes FabTech) will discontinue manufacturing 5 inch wafers on September 30th, 2016. To satisfy continuing customer demand, the wafer fabrication source (Diodes FabTech) will convert the wafer diameter from 5 inch to 6 inch. Full electrical characterization and reliability testing have been completed using representative devices built with 6 inch wafer materials to ensure there is no change in product reliability, device functionality or data sheet electrical specifications exist. There will be no change to the Form, Fit, or Function of affected products.
PCN-2221 2016-11-18 Discrete Addition of A Passivation Layer Over The Top Metal of The Die for Selected BJT Devices This PCN is being issued to notify customers that in order to improve product manufacturability, Diodes Incorporated has qualified the addition of a passivation layer over the top metal of the die for selected BJT devices. Full electrical characterization and reliability testing has been completed on representative part numbers built with the additional passivation layer to ensure there is no change to product reliability, device functionality or electrical specifications in the datasheet. There will be no change to the Form, Fit, or Function of affected products.
PCN-2239 2016-10-16 Analog Additional FAB Source (TPSCo), Additional Assembly/Test Site (SAT) and BOM (Bill of Materials) on select devices This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified an additional wafer Fab source (TPSCo) TowerJazz Panasonic Semiconductor Co., Ltd. located in Japan, and BOM (Bill of Materials) on selected devices manufactured in (SAT) Diodes Incorporated / Shanghai, China. Full electrical characterization and high reliability testing has been completed on representative part numbers.
PCN-2196 2016-10-10 Analog Additional Qualified (FAB) Wafer Fabrication / (AT) Assembly Test Sites on selected devices This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified additional FAB/AT Sites on selected devices. Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2236 2016-09-26 Discrete Die Attach Material and Back Metal Composition changes to improve product performance This PCN is being issued to notify customers that in order to improve product performance, Diodes Incorporated has qualified an enhanced die attach material and back metal composition for the part number(s) listed in this PCN. Full electrical characterization and reliability testing have been completed to ensure that no changes in product reliability, device functionality or data sheet electrical specifications exist. There will be no change to the Form, Fit, or Function of affected products.
PCN-2231 2016-09-19 Analog Additional Qualified Assembly/Test (A/T) Site This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified an additional A/T site, Diodes Technology (Chengdu) Company Limited (CAT) in Chengdu, China. Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2235 2016-09-13 Discrete Qualification of Palladium Coated Copper Bond Wire or Bare Copper Bond Wire for Selected SOT-23, SOT-223 and SM-8 Packaged Products This PCN is being issued to notify customers that Diodes has qualified palladium coated copper bond wire or bare copper bond wire as alternative wire bond materials for the part numbers listed in this PCN. Full electrical characterization and reliability testing has been completed on representative part numbers built using palladium coated copper bond wire or bare copper bond wire to ensure there is no change to device functionality or electrical specifications in the datasheet. There will be no change to the Form, Fit, or Function of affected products.
PCN-2230 2016-09-01 Analog Additional FAB Source (TPSCo) and BOM (Bill of Materials) on select Analog Automotive devices This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified additional wafer fab source (TPSCo) TowerJazz Panasonic Semiconductor Co., Ltd. located in Japan and BOM (Bill of Materials – bond wire) on selected Analog Automotive devices manufactured in (SAT) Diodes Incorporated / Shanghai, China. Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2220 2016-08-24 Analog Additional FAB Source (SFAB) and Assembly/Test Site (CAT) on select Analog devices This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified additional wafer fab source, Diodes internal BCD (Shanghai) Micro-electronics Limited in Shanghai, China (SFAB) and additional assembly/test site, Diodes Incorporated / Chengdu, China (CAT) on selected Analog devices. Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the device datasheets.
PCN-2223 2016-07-11 Discrete Qualification of Additional Wafer Fabrication Source, and Conversion to Green Mold Compound This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified Diodes internal BCD (Shanghai) Micro-electronics Limited (SFAB) as an additional wafer fabrication facility for the devices listed below. In addition, the mold compound for the products listed below is being converted from non-Green to Green. The green encapsulate will contain no halogens or Sb2O3 fire retardants. The products will remain 94-V0 compliant with a 260°C maximum reflow temperature for 30 sec (total) and MSL 1. Full electrical characterization and reliability testing have been completed using representative devices built with wafer materials from the additional wafer fabrication source and/or with green mold compound to ensure there is no change to device functionality, electrical specifications in the datasheet, or package performance.
PCN-2212 2016-06-10 Analog Conversion to Automatic Wafer Singulation Process for Selected TVS Products This PCN is being issued to notify customers that in order to improve die manufacturability, Diodes Incorporated has qualified an automatic wafer singulation process utilizing automatic die saw and automatic die pick & place process for selected TVS products assembled at ERIS. Full electrical characterization and reliability testing have been completed on representative devices built using new automatic wafer singulation process to ensure that no changes in product reliability, device functionality or data sheet electrical specifications. There will be no change to the Form, Fit, or Function of affected products.
PCN-2181 2016-05-22 Discrete Conversion to Copper Bond Wire, Additional A/T site, and/or Additional Wafer Source with Smaller Die Size on Selected Discrete Products This PCN is being issued to notify customers that Diodes has qualified Copper bond wire for the selected Discrete products listed in this PCN. In order to accomm date the Copper bond wire, the top metal composition and/or top metal thickness of the wafer has been modified. Diodes Incorporated has also qualified an additional wafer source with smaller die size, Diodes internal FabTech Inc. (KFAB) or external Phenitec Semiconductor (*), and qualified “Diodes Technology (Chengdu) Company Limited” (CAT) as an additional Assembly & Test Site (A/T Site) for the selected Discrete products. Full electrical characterization and high reliability testing has been completed on representative part numbers built using Copper bond wire, alternative wafer source and/or additional A/T site to ensure no change to device functionality or electrical specifications in the datasheet. There will be no change to the Form, Fit, or Function of affected products.
PCN-2214 2016-01-21 Analog Qualification of additional assembly/test site JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China for select analog devices in HSOP, MSOP, PSOP, SOIC, SSOP, and TSSOP packages This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China for select analog devices in HSOP, MSOP, PSOP, SOIC, SSOP, and TSSOP packages. The current product lines have begun the necessary production equipment transfer from the Jiangsu, China facility to the Suqian, China facility to support necessary growth using existing production equipment and BOM. Full electrical characterization and reliability testing have been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2202 2016-01-21 Analog Qualification of additional assembly/test site JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China for select analog devices in SOIC-8 packages This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China for SOIC-8 packages. The current SOIC-8 product line has begun the necessary production equipment transfer from the Jiangsu, China facility to the Suqian, China facility to support necessary growth using existing production equipment and BOM. Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2217 2016-04-18 Analog Top Metal Thickness Change on Selected Analog Products This PCN is being issued to notify customers that Diodes has qualified affected part numbers listed in this PCN with a thicker top metal layer in order to improve the assembly bonding process. Full electrical characterization and reliability testing have been completed using representative devices built with the increased top metal thickness to ensure there is no change to device functionality or data sheet electrical specifications. There will be no change to the Form, Fit, or Function of affected products.
PCN-2218 2016-04-10 Analog Additional Qualified BOM (Bill of Materials) on selected devices manufactured at JCET in the DIP-7 package This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified additional BOM (Bill of Materials) on selected devices manufactured at JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China for the DIP-7 package. Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2219 2016-02-29 Analog Additional FAB Source (TPSCo) and BOM (Bill of Materials) on select devices in SOT25 and MSOP8 packages This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified additional wafer fab source (TPSCo) TowerJazz Panasonic Semiconductor Co., Ltd. located in Japan and BOM (Bill of Materials) on selected devices manufactured at (SAT) Diodes Incorporated/Shanghai Assembly/Test, China. Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2209 2016-03-03 Discrete Datasheet Revision Due to Maximum IR Specification Limits Change This PCN is being issued to notify customers that Diodes Incorporated is adjusting the IR Max values at the temperature test conditions shown in the attached file. Full electrical characterization has been completed on a representative device to ensure that the affected device meets the new IR specifications as indicated.
PCN-2204 2015-10-27 Discrete Part Marking Polarity Identifier Change In order to standardize product marking, Diodes Incorporated is in the process of changing the polarity identifier from “dot” type to “bar” type for below listed part numbers. Affected products are manufactured in DFN1006-2 and DFN1006-3 packages at Diodes internal Assembly & Test sites. Diodes Incorporated began to phase in this change beginning at Date Code 1527 (week 27 of 2015). Parts currently using the dot type of polarity identifier on the part marking will continue to ship until existing supply is exhausted. The corresponding device data sheets will be revised accordingly as well. There is no change to fit or function of the affected products.
PCN-2133 2015-12-23 Discrete/Analog Semiconductors Qualification of "Diodes Zetex Neuhaus GmbH" as an Additional Assembly & Test Site and Conversion to Palladium Coated Copper Bond Wire for Selected SOT-23F Packaged Products This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified "Diodes Zetex Neuhaus GmbH" (NAT) located in Neuhaus, Germany as an additional Assembly & Test Site for selected SOT-23F packaged products using palladium coated copper bond wire.Full electrical characterization and high reliability testing has been completed or will be completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet. There will be no change to the Form, Fit, or Function of affected products.
PCN-2150 2015-08-07 Discrete/Analog Semiconductors Conversion to Diodes Incorporated standard logo on BCD branded products This PCN is being issued to notify customers that in order to standardize our logo symbol, Diodes Incorporated is in the process of changing from the BCD logo to the Diodes Incorporated standard logo on BCD branded products. Please see examples in the PCN PDF. Parts currently using the BCD logo on the part marking will continue to ship until existing supply is exhausted. The corresponding device data sheets will be revised accordingly, as well.
PCN-2197 2015-10-27 Discrete/Analog Semiconductors Qualification of "Diodes Technology (Chengdu) Company Limited" (CAT) as an Additional Plating Site. This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified "Diodes Technology (Chengdu) Company Limited" (CAT) located in Chengdu, China as an additional plating site. Full electrical characterization and high reliability testing has been completed on representative part numbers built using CAT plating service to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2156 2015-09-01 Discrete Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site for Discrete parts, and Conversion to Copper Bond Wire on select Discrete products at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) Assembly & Test Sites (SAT). This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified "Diodes Technology (Cheng Du) Company Limited" (CAT) located in Chengdu, China as an additional Assembly & Test Site for select Discrete parts using Copper bond wire at CAT.
PCN-2141 2015-10-25 Analog Device End of Life Products listed in Tables 1 – 2 will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders as specified must be placed by 27th July, 2015. All shipments will be made on or before 25th Oct, 2015. Please contact your local Diodes representatives for life-time buy opportunities and further information.
PCN-2187 2015-06-12 Discrete Datasheet Revision Due to Relaxation of Maximum Forward Voltage (VF) Specification Limits This PCN is being issued to notify customers that Diodes Incorporated is relaxing the Forward Voltage (VF) Max values. Please also refer to the table below for the new values. Full electrical characterization has been completed on a representative device to ensure that the affected devices meet the new VF specifications as indicated. The description of the change is provided in the table below.
PCN-2180 2015-08-19 Discrete Device End of Life Products listed in Table 1, Table 2 or Table 3 will no longer be available from Diodes Incorporated. For some products replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 19th May, 2015. All shipments will be made on or before 19th August, 2015. Please contact your local Diodes representatives for life-time buy opportunities and further information.
PCN-2166 2015-02-12 Discrete Addition of Date Code Information to Part Marking In order to improve product traceability, Diodes will add date code information to the part marking of below listed part numbers. Affected products are manufactured in SM-8, SOT-26 or SOT-223 packages at Diodes’ internal Assembly & Test sites. There is no change to fit or function of the affected products. No other changes will be made.
PCN-2169 2015-04-09 Discrete Lead Frame Structure, Mold Compound and Solder Type changes to enhance PowerDI-5 package This PCN is being issued to notify customers that in order to improve PowerDI-5 package body strength and gain better device power dissipation capability, Diodes Incorporated has qualified an enhanced lead frame structure, mold compound and solder materials for PowerDI-5 packaged products.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2165 2015-05-23 Discrete Device End of Life Products listed in Table 1, Table 2 or Table 3 will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 22nd February, 2015. All shipments will be made on or before 23rd May, 2015. Please contact your local Diodes representatives for life-time buy opportunities and further information.
PCN-2171 2015-02-05 Discrete Qualify Additional Supplier of Leadframe and Clip Bond for PowerDI5SP and PowerDI5SP-B packages This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified Ningbo Kangqiang Electronics Corporation Limited as additional leadframe and clip bond source for the PowerDI5SP and PowerDI5SP-B packaged devices listed in the Products Affected section of this letter. Full electrical characterization and high reliability testing has been completed using a representative device to ensure there is no change to device functionality, package performance, or electrical specifications in the datasheet.
PCN-2143 2014-12-29 Analog Adding Qualified BOM Sets and Die Design Improvements This PCN is being issued to notify customers that Diodes has qualified additional bill of material (BOM) sets and die design improvements for the devices listed in Products Affected Section. Full electrical characterization and high reliability testing has been completed to ensure there are no changes in product Reliability.
PCN-2139 2014-08-29 Discrete Qualification of New Wafer Source and Die Shrink for UF5A400D1-13 This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified a new wafer source with a smaller die size due to an unexpected immediate discontinuity of the original wafer source for UF5A400D1-13. Full electrical characterization and high reliability testing has been completed to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2136 2014-10-08 Discrete Qualification of "Yangzhou YangJie Electronic Technology Company Limited" as an Additional Assembly & Test Site and "J & V Semiconductor" as an Additional Wafer Source for Selected Discrete Devices, and Qualification of New Lead Frame and Clip for Selected GBJ Devices This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified Yangzhou YangJie Electronic Technology Company Limited" as an Additional Assembly & Test Site and "J & V Semiconductor" as an Additional Wafer Source for selected discrete devices. Additionally, in order to improve GBJ package body strength and gain better device power dissipation capability, Diodes Incorporated has qualified a new lead frame structure and clip layout for selected GBJ products.
PCN-2140 2014-04-09 Analog and Discrete Leadframe material change for SOT-25, SOT-26 and TSOT25 packages One of Diodes’ tier-two suppliers of raw material for the manufacture of copper leadframes recently experienced a disaster resulting in plant closure. Having thoroughly reviewed all aspects of our supply chain and to assure continuity of supply to our customers we will be converting the leadframe material for devices packaged in SOT-25, SOT-26, and TSOT25 at the Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) Assembly & Test Sites to CDA 194 alloy starting immediately.
PCN-2126 2014-08-20 Discrete Products identified in this PCN will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. Products listed in Tables 1 to Table 4 will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 20th May, 2014.
PCN-2130 2014-05-12 Analog Qualification of Alternative Copper Bond Wire, BOM Change, A/T Site and Die Shrink In order to assure continuity of supply, this PCN is being issued to notify customers of a qualified alternative copper bond wire, BOM change, A/T site and die shrink on devices listed below. Alternative A/T Site is Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) Assembly & Test Sites. Full electrical characterization and high reliability testing has been completed on representative parts to ensure no change to device functionality or data sheet electrical specifications. There will be no change to the Form, Fit, or Function of affected products.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2132 2013-11-28 Discrete and Analog Conversion to Diodes Incorporated standard product label on all parts currently using the BCD product label This PCN is being issued to notify customers that in order to standardize our label format, Diodes Incorporated is in the process of changing from the BCD product label to the Diodes standard product label on BCD branded products. Parts currently using the BCD Product Label will ship until supply is exhausted. During an interim transition period, some shipments may also have both labels attached.
PCN-2128 2014-05-07 Analog Products identified in this PCN will no longer be available from Diodes Incorporated. For most products, replacement parts are being offered and are available for immediate substitution. Products listed in Tables 1 & 2 will no longer be available from Diodes Incorporated. For most products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 30th Jan, 2014.
PCN-2113 2014-02-06 Discrete Conversion to Copper Bond Wire and Qualification of Additional Wafer Source on Selected Discrete Products This PCN is being issued to notify customers that Diodes has qualified Copper bond wire for the part numbers listed in this PCN. In order to accommodate the Copper bond wire, the top metal composition and/or top metal thickness of the wafer has also been modified. Diodes Incorporated has also qualified an additional wafer source, Diodes internal FabTech Inc. (KFAB), for the products listed in Table 1.
PCN-2125 2013-12-31 Analog Device End of Life / Assembly Site Transfer Due to GTM Shanghai Factory Discontinuance of TO92/DIP (PDIP-8L)/SIP4/TO252/MSOP8 Packages. Products listed in Tables 1 – 5 will no longer be available from Diodes Incorporated, or will be transferred to another assembly site (HD) Nantong HuaDa Microelectronics Co. Ltd. or (SKE/DSH) Shanghai KaiHong Electronics Co. Ltd./Diodes Shanghai Co. Ltd. GTM will discontinue production of these devices on 12/31/2013. For some products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 23rd Nov, 2013. Please contact your local Diodes representatives for life-time buy opportunities and further information.
PCN-2123 2014-01-16 Select SMA, SMB and SMC Package Products Qualification of Additional Assembly and Test Site for Select SMA, SMB, and SMC Packaged Discrete Products. This PCN is being issued to notify customers that Diodes Incorporated has qualified E-tech Semiconductor Co., Ltd. in China as an additional assembly and test site for select SMA, SMB and SMC packaged Discrete products. Full electrical characterization and high reliability testing have been completed on representative devices from the affected package families to ensure there is no change to device functionality, data sheet electrical specifications, or package performance.
PCN-2117 2014-01-02 Discrete Qualification of Additional Wafer Fabrication Sources This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified additional wafer Fabrication facilities for the devices listed in the Products Affected section of this letter. The alternate wafer manufacturing sites are CSMC Technologies Corporation (CSMC), HHGrace, and/or Diodes internal Oldham Fab (OFAB).
PCN-2094 2013-07-28 Discrete and Analog Qualification of "Diodes Technology (Cheng Du) Company Limited" (DTC) as an Additional Assembly & Test Site for SOP-8, SOT-23, SOT-223, SOT-323, SOT-363, SSOT-23, and SOD-323 Packaged Parts, Qualification of Alternative Die, and Conversion to Copper Bond Wire on Select Discrete Products at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai). This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified "Diodes Technology (Cheng Du) Company Limited" (DTC) located in Chengdu, China as an additional Assembly & Test Site for select SOP-8, SOT-23, SOT-223, SOT-323, SOT-363, SSOT-23, and SOD-323 packaged parts using Copper bond wire. For part numbers marked with (*) in Table 2, Diodes has qualified Copper bond wire at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) Assembly & Test Sites. In addition, for part numbers marked with (**) in Table 2, Diodes has also qualified alternative die from the existing wafer fabrication source (Diodes internal FabTech Inc. – KFAB).
PCN-2102 2013-07-24 Discrete Products identified in this PCN will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. Products listed in Tables 1 – 4 will no longer be available from Diodes Incorporated. For some products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 24th July, 2013. All shipments will be made on or before 24th October, 2013. However, for those part numbers marked with an (*), Life-time buy orders must be placed by 9th May, 2013. Please contact your local Diodes representatives for life-time buy opportunities and further information.
PCN-2111 2013-07-16 Analog Additional Die Source, Die Shrink, and/or Copper Wire Conversion on Select Analog Products This PCN is being issued to notify customers that Diodes is qualifying an additional die source, die shrink, and /or copper wire for the devices listed in Products Affected Section. Devices with additional die sources are highlighted as (*) in Table A. Full electrical characterization and high reliability testing has either already been completed or will be completed using representative devices. Diodes will be able to provide qualification data that already exists, or, for ongoing qualifications, as soon as it becomes available.
PCN-2110 2013-07-10 Analog Conversion to Copper Bond Wire on Selected Analog Products This PCN is being issued to notify customers that Diodes is qualifying Copper bond wire for the part numbers listed in this PCN. Full electrical characterization and high reliability testing has either already been completed or will be completed using representative devices. Diodes will be able to provide qualification data that already exists, or, for ongoing qualifications, as soon as it becomes available.
PCN-2108 2013-07-07 Discrete Qualification of Additional Wafer Fabrication Sources and Conversion to Copper Bond Wire on Select Discrete Products This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated is in the process of qualifying additional wafer Fabrication facilities for the devices listed in the Products Affected section of this letter. The alternate wafer manufacturing sites are Sumpro Electronics Corporation (Sumpro), Hua Hong NEC (HHNEC), and/or Maxchip Electronics Corporation (Maxchip). In addition, part numbers marked with an (*) are being converted to Copper bond wire. Full electrical characterization and high reliability testing has either already been completed or will be completed using representative devices built with wafer materials from the additional wafer fabrication sources and/or built using Copper bond wire (as identified above) to ensure there is no change to device functionality or electrical specifications in the datasheet. Diodes will be able to provide qualification data that already exists, or, for ongoing qualifications, as soon as it becomes available.
PCN-2105 2013-04-23 Select TO263-5L Packaged Devices Qualification and Site Transfer of Select TO263-5L Packaged Devices to Diodes SKE/DSH The current assembly and test facility for TO263-5L packaged products is discontinuing manufacturing of these products. This PCN is being issued to notify customers that in order to maintain continuity of supply, Diodes is in the process of qualifying Diodes' internal SKE/DSH (Shanghai Kaihong Electronic Co. / Diodes Inc. Shanghai) assembly and test sites and will transfer the assembly and testing of the parts listed in the Products Affected section below to these sites by above mentioned implementation date.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2089 2013-03-11 MOSFET Qualification of Alternate Lead Frame Type and Die Bond Material for A Selected Device This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified a new lead frame type for the SOT-26 package, and 8200TI as a die bond material for the device listed in the Products Affected section of this letter.
PCN-2041 2012-02-09 Discrete Conversion to Copper Bond Wire on Selected Discrete Products This PCN is being issued to notify customers that Diodes is in the process of qualifying Copper bond wire for the part numbers listed in this PCN. Full electrical characterization and high reliability testing will be completed using representative devices built using Copper bond wire to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2088 2012-12-29 Discrete Specification Change This PCN is being issued to notify customers that Diodes Incorporated is relaxing the VR Min, VF Max and/or IR Max values. Please also refer to the table below for the new values.
PCN-2087 2012-09-19 Discrete & Analog Conversion to Diodes Standard Product Label on all parts currently using Diodes Zetex Product Label This PCN is being issued to notify customers that in order to standardize our label format, Diodes Incorporated is in the process of changing from the Diodes Zetex Product Label to the Diodes Standard Product Label on selected Zetex branded products. Parts currently using the Diodes Zetex Product Label will ship until supply is exhausted.
PCN-2084 2012-11-06 Select Discrete Devices Qualification of Additional Wafer Fabrication Sources This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated is in the process of qualifying additional wafer Fabrication facilities for the devices listed in the Products Affected section of this letter. The alternate wafer manufacturing sites are Sumpro Electronics Corporation (Sumpro), Hua Hong NEC (HHNEC), CSMC Technologies Corporation (CSMC), or Maxchip Electronics Corporation (Maxchip) as indicated in the PCN.
PCN-2078 2012-10-21 Select Discrete Devices Qualification of Die Shrink In order to assure continuity of supply, this PCN is being issued to notify customers of a qualified shrink die from the existing wafer fabrication source (Diodes internal FabTech Inc. - KFAB) for the parts listed in the attached table.
PCN-2083 2012-06-14 Analog TA Max Specification Update on the AP2501M8-13 and AP2511M8-13 Products This PCN is being issued to notify customers that Diodes is amending the Operating Ambient Temperature (TA) range as shown in 'Note 5' of the applicable device data sheet.
PCN-2074 2012-08-12 Analog Additional Die Source, Die Shrink, and/or Copper Wire Conversion on Select Analog Products This PCN is being issued to notify customers that Diodes is qualifying an additional die source, die shrink, and /or copper wire for the devices listed in the Products Affected Section. The changes described will only be implemented after completion of full electrical characterization and high reliability testing. Qualification is conducted using representative devices built with the new bill of materials to ensure there is no change to device functionality or data sheet electrical specifications.
PCN-2076 2012-07-15 Selected Analog Devices Discontinuance of Selected Analog Devices with Suggested Drop-in Replacements The parts listed below (with non-green mold compound) are being discontinued and replaced by already existing and previously qualified part numbers with green mold compound. These parts have been in high-volume production. Green mold compound does not contain any halogens or Sb2O3 flame retardants. Products will remain 94-V0 compliant, 260ºC maximum reflow temperature for 30 sec (Total) and MSL 1. Full electrical characterization and high reliability testing was completed on representative replacement devices built with the green mold compound material to ensure no change to device functionality or data sheet electrical specification before shipment. A life-time buy opportunity is being provided until 15th July, 2012. The last shipment date for non-Green product is 15th August, 2012.
PCN-2077 2012-04-06 Selected Discrete Devices Discontinuance of Selected Discrete Devices with Suggested Drop-in Replacements If Available The parts listed below are being discontinued. Some parts can be replaced immediately by already existing and previously qualified part numbers. These parts have been in high-volume production. No life-time buy opportunity is being offered.
PCN-2062 2012-04-22 Discrete Qualification of Additional Wafer Source and Additional Top Metal Wafer Process Additional, equivalent wafer fab and fabrication processes have been established and qualified to ensure continuity of supply. For select part numbers in PowerDI®123, PowerDI®5, SMA packages (see table 1): Qualification of CSMC in addition to the currently qualified wafer fabrication sources, Qualification of an additional solderable top metal process at the current wafer fabrication site, Diodes internal Oldham Fab (OFAB). For select part numbers in TO-220AB packages (see table 2): Qualification of an additional solderable top metal process at the current wafer fabrication site, Diodes internal Oldham Fab (OFAB). Affected products are listed in the attached tables.
PCN-2072 2012-04-12 Analog Conversion to Copper Bond Wire on Selected Analog Products This PCN is being issued to notify customers that Diodes is in the process of qualifying Copper bond wire for the part numbers listed in this PCN. In order to accommodate the Copper bond wire, the top metal thickness in the die on selected devices has been increased.
PCN-2070 2012-04-09 Discrete Qualification of "Diodes Technology (Cheng Du) Company Limited" (DTC) as an Additional Assembly & Test Site for SOT-23 Packaged Parts and Conversion to Copper Bond Wire on Select Discrete Products at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified "Diodes Technology (Cheng Du) Company Limited" (DTC) located in the Chengdu Hi-Tech Industrial Development Zone (CDHT) in Chengdu, China as an additional Assembly & Test Site for select SOT-23 packaged parts using Copper bond wire. Established in December 2010, as a joint venture between Diodes Incorporated and Chengdu Ya Guang Electronic Company Limited, Diodes Technology (Chengdu) Company Limited (DTC) was formed to perform semiconductor manufacturing assembly and test functions, and is an expansion of the Company's existing manufacturing presence in China. Ramp to high volume production began in May of 2011.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2058 2012-03-16 Analog EOL Notification for Select Analog Devices Affected Part numbers are being discontinued. No alternative parts are being offered at this time. Customers are requested to place their LTB (Life-Time Buy) orders by 16th November, 2011. Last shipments of these products will be made on or before 16th March, 2012.
PCN-2026 2011-12-13 Analog Conversion to Copper Bond Wire on Selected Analog Products This PCN is being issued to notify customers that Diodes has qualified Copper bond wire for the part numbers listed in this PCN. The top metal stack was enhanced to accommodate the Copper bond wire.
PCN-2061 2011-11-17 Discrete Qualification of "Diodes Technology (Cheng Du) Company Limited" (DTC) as an Additional Assembly & Test Site for SOT-23 Packaged Parts This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified "Diodes Technology (Cheng Du) Company Limited" (DTC) located in the Chengdu Hi-Tech Industrial Development Zo
PCN-2049 2011-11-08 Analog Qualification and Site Transfer of Select MSOP-10L and QSOP-16 Packaged Devices to Diodes SKE/DSH This PCN is being issued to notify customers that in order to maintain continuity of supply, Diodes has qualified assembly and test sites SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) and will transfer the assembly and testing of the parts listed in the Products Affected section to these sites by the PCN's implementation date.
PCN-2048 2011-08-29 Analog Conversion to Copper Bond Wire on Selected Analog Products This PCN is being issued to notify customers that Diodes has qualified Copper bond wire for the part numbers listed in this PCN. In order to accommodate the Copper bond wire, the top metal in the die has been increased from 2.0μm to 3.0μm.
PCN-2040 2011-08-01 Discrete Conversion to Copper Bond Wire on Selected Discrete Products This PCN is being issued to notify customers that Diodes has qualified Copper bond wire for the part numbers listed in this PCN. Full electrical characterization and high reliability testing was completed using representative devices built using Copper bond wire to ensure there is no change to device functionality or electrical specifications in the datasheet. There will be no change to the Form, Fit, or Function of affected products.
PCN-2020 2011-05-07 Discrete Qualification of Additional Wafer Fabrication Sources Having thoroughly reviewed all aspects of our supply chain we have identified a potential risk of a supply interruption by a certain wafer supplier due to the recent earthquake and tsunami in Japan. Therefore, this PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated is in the process of qualifying dies from additional wafer fabrication facilities for the devices listed in the Products Affected section of this letter. In the past, these products were built using die from Phenitec Semiconductor Corporation, Japan.
PCN-2038 2011-04-18 Discrete Qualification of Additional Wafer Fabrication Source This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes is in the process of qualifying an additional wafer FAB source Diodes FabTech (KFAB) for the devices listed in the Products Affected section of this letter. Full electrical characterization and high reliability testing will be completed using representative devices built with dies from the additional wafer Fab source to ensure there is no change to device functionality or electrical specifications in the datasheet. There will be no change to the Form, Fit, or Function of products affected.
PCN-2021 2011-06-09 AP1084 3.3V Version in the TO252 and TO263 Package Qualify Silan as an Additional FAB Source and consolidate the mold compound to EME-G700 (Green) Diodes is qualifying Silan as an additional wafer source and converting the mold compound for the AP1084D33L-13 and AP1084K33L-13 to EME-G700. AP1084D33G-13 and AP1084K33G-13 already use the EME-G700 mold compound. Full electrical characterization and high reliability testing have been completed on representative devices from the affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package performance.
PCN-2033 2011-06-09 Analog Qualification of BRIGHT HORIZON TECHNOLOGY (ZHONGSHAN) LIMITED as an Additional Assembly/Test Site This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified BRIGHT HORIZON TECHNOLOGY (ZHONGSHAN) LIMITED as an additional assembly/test site for the devices listed in the Products Affected section of this letter. Full electrical characterization and high reliability testing has been completed on the AP431VG-A to ensure there is no change to device functionality or electrical specifications in the datasheet.
PCN-2034 2011-06-09 Select SMA, SMB, SMC, and TO220AB Packaged Devices Qualification of Additional Assembly and Test Site for Select SMA, SMB, SMC, and TO220AB Packaged Devices This PCN is being issued to notify customers that Diodes is in the process of qualifying: (1) Eris Technology Corp - Taiwan as an additional assembly and test site for select SMA, SMB, and SMC packaged devices; (2) Eris Technology Corp - Taiwan and Eris Technology Corp - MIC as additional assembly and test sites for select TO220AB packaged devices. Part numbers marked with (*) will also be qualified with a new die from the existing wafer fab source. Full electrical characterization and high reliability testing will be completed on representative devices from the affected package families to ensure there is no change to device functionality, data sheet electrical specifications, or package performance.
PCN-2036 2011-06-09 Analog SLL EOL notification for ZSCT1555N8TA, ZSD100N8TA, ZXCT1030X8TA, ZXFV4089N8TA, and ZXFV4089N8TC Affected part numbers are being discontinued. No alternative parts are being offered at this time. Customers are requested to place their Life-Time Buy (LTB) orders by 9th June, 2011. Last shipments of these products will be made on or before 7th September, 2011. Please contact your local Diodes representatives for life-time buy opportunities and further information.
PCN-2037 2011-05-16 MOSFET Products Qualification of Epoxy as Alternate Die Attach Material for SOT223 Packaged In order to assure continuity of supply, this PCN is being issued to notify customers that Diodes Incorporated has qualified epoxy die attach material as an alternate to the existing die attach methodology using soft solder for SOT223 packaged products.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2028 2011-03-28 Select TSOT23-5 Packaged Devices Qualification of Select TSOT23-5 Packaged Devices at Diodes SKE/DSH. This PCN is being issued to notify customers that Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) has been qualified as additional assembly and test location for select TSOT23-5 packaged devices. Full electrical characterization and high reliability testing has been completed on representative devices from the affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package performance.
PCN-2029 2011-03-20 Discrete Package End of Life for the MLP322 and MLP832 Packages Products listed in the table on the following page will no longer be available from Diodes Incorporated because the MLP332 and MLP832 packages are being discontinued. To ensure continued supply, Diodes Incorporated has pin-to-pin replacement parts with the same footprint (*) as the MLP packages being offered in DFN packages (DFN2020B-3 and DFN3020B-8) which are available for immediate substitution. Life-time buy orders must be placed by 20th March, 2011. All shipments will be made on or before 20th June, 2011.
PCN-2031 2011-03-15 Analog Qualification of Additional Wafer Fabrication Source This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified an additional wafer FAB source for the devices listed in the Products Affected section of this letter.
PCN-2024 2010-12-19 PNP Bipolar Junction Transistors Qualification of Additional Wafer Fabrication Facility for PNP Bipolar Junction Transistors and Qualification of Alternate Die Attach Material for SOT223 Packaged Products. In order to assure continuity of supply, this PCN is being issued to notify customers that Diodes Incorporated has qualified an additional wafer fabrication facility, Diodes FabTech (KFAB), for the manufacture of Diodes PNP Bipolar Junction Transistors, as listed in the attached table.
PCN-2022 2010-08-16 Discrete Products identified in this PCN will no longer be available from Diodes Inc. For some products, replacement parts are being offered and are available for immediate substitution. Products listed in Tables 1 - 3 will no longer be available from Diodes Inc. For some products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 8th October, 2010. All shipments will be made on or before 7th November, 2010. Please contact your local Diodes representatives for life-time buy opportunities and further information.
PCN-2013 2010-09-10 Analog and Discrete Device End of Life Products listed in Table 1-4 will not longer be available from Diodes Inc. For some products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 31st July, 2010. All shipments will be made on or before 30th August, 2010. Please contact your local Diodes representatives for life-time buy opportunities and further information.
PCN-2007 2010-11-10 NPN Bipolar Junction Transistors Qualification of Additional Wafer Fabrication Facility for NPN bipolar junction transistors In order to assure continuity of supply, this PCN is being issued to notify customers that Diodes Incorporated has qualified an additional wafer fabrication facility, Diodes FabTech (KFAB), for the manufacture of Diodes NPN Bipolar Junction Transistors, as listed in the attached table.
PCN-2017 2010-10-13 Discrete Qualification of Additional Wafer Sources or Die Shrink In order to assure continuity of supply, this PCN is being issued to notify customers of the qualification of Diodes FabTech (KFAB) and Diodes/Zetex (OFAB) wafer fabrication sites in addition to the currently qualified wafer fabrication site (Phenitec). Some select devices will be qualified with a smaller die size within the existing wafer fabrication site (Phenitec). Affected products are listed in the attached table.
PCN-2000 2010-09-12 Discrete Devices in SOT23 Package Additional Assembly Location AUK Dalian, China for SOT23 Package This PCN is being issued to notify customers that Diodes Incorporated has qualified AUK in Dalian, China as a new assembly facility in order to assure continuity of supply for the SOT23 packages. Full electrical characterization and high reliability testing will be completed on representative devices from the affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package performance.
PCN-2010 2010-07-30 NPN RF Transistors EOL (End of Life) notification for BFS17HTA, FST634TA, and ZUMTS17HTA Die used in the manufacturing of the BFS17HTA, FST634TA, and ZUMTS17HTA are no longer available. Alternate part numbers using a different die are available as a replacement option. Performance differences between the devices being discontinued and the replacement devices are highlighted in the attached document. The datasheets for the suggested replacement part numbers are also attached. No life-time buy opportunity is available for the affected EOL part numbers.
PCN-2015 2010-09-02 SBR ITO-220AB and TO-220AB Packages Qualify Treasurestar as an Additional Assembly and Test Site for Super Barrier Rectifiers (SBR) products in ITO-220AB and TO-220AB Packages In order to maintain continuity of supply, Treasurestar is being qualified as an additional assembly and test site for the SBR TO-220AB and ITO-220AB Packages. Customers will receive parts from Treasurestar along with the currently approved suppliers. Full electrical characterization and high reliability testing will be completed on representative devices from the affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package performance.
PCN-2015 2010-09-02 SBR ITO-220AB and TO-220AB Packages Qualify Treasurestar as an Additional Assembly and Test Site for Super Barrier Rectifiers (SBR) products in ITO-220AB and TO-220AB Packages In order to maintain continuity of supply, Treasurestar is being qualified as an additional assembly and test site for the SBR TO-220AB and ITO-220AB Packages. Customers will receive parts from Treasurestar along with the currently approved suppliers. Full electrical characterization and high reliability testing will be completed on representative devices from the affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package performance.
PCN-2016 2010-09-01 AH28x and AH29x Series Conversion of AH28x and AH29x Series to Green Mold Compound The mold compound for the products listed below is being converted from non-Green to Green. Non-Green part numbers will become obsolete by 1st September, 2010. Full electrical characterization and high reliability testing have been completed on representative devices from the affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package performance.
PCN-2014 2010-07-30 D2PAK Package EOL (End of Life) Notification and Assembly and Test Site Transfer for the D2PAK Package Products The current assembly and test facility for the D2PAK packaged products (listed below) is discontinuing manufacturing of these products. In order to maintain continuity of supply, assembly and test of some part numbers is being qualified at Diodes' SKE/DSH facility (Table 1). The remainder of the parts will no longer be available, but Diodes Incorporated is offering replacement parts for some of these devices (Table 3). For parts that will no longer be available without replacement parts, a life-time buy opportunity is being provided until June 30th, 2010 (Table 2). The last shipment date for all parts from the current assembly and test site is July 30th, 2010.
PCN-2001 2010-04-14 Schottky Diodes ZLLS1000TA, ZLLS2000TA, and ZLLS410TA Datasheet Specification Change Updates to the manufacturing environments have led to the necessity of an increase of specification limits for certain parameters to aid in manufacturability and capability. Differences between the previous version and the current version are high-lighted in the attached documents.
PCN-1158 2010-01-13 Discrete Device EOL The products listed below are discontinued and no last-time-buy opportunity can be offered.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-1153 2009-12-11 Discrete Datasheet Revision Due to Relaxation of Max Rds(On) Specification Limit This PCN is being issued to notify our customers that Diodes Incorporated is relaxing the Rds(On) Max values effective immediately. Please also refer to the device Datasheet for the new values. Full electrical characterization has been completed on representative devices to ensure that the affected devices meet the new Rds(On) specifications as indicated in the Datasheet. The description of the change is provided in the table below.
PCN-1155 2010-03-11 Discrete COPPER BOND WIRE IMPLEMENTATION To improve selected electrical and mechanical properties by changing from gold to copper bond wire. Copper wire devices will be phased in gradually from the date of implementation.
PCN-1148 2010-02-22 Discrete Qualification of Diodes FabTech as an additional wafer fabrication source This is issued to notify customers that Diodes Incorporated is in the process of qualifying Diodes FabTech as an additional wafer fabrication source in order to assure continuity of supply to our customers. Affected products are listed in the attached table. Full electrical characterization and high reliability testing will be completed on representative devices built with the dice from Diodes FabTech in order to ensure no change to device functionality or data sheet electrical specifications before shipment to our customers.
PCN-1152 2010-01-20 Discrete Qualification of Additional Manufacturing Facility and Mold Compound for Bridge Devices This PCN is being issued to notify our customers that Diodes Incorporated plans to qualify an additional assembly site and convert the mold compound for the Bridge Devices in order to maintain continuity of supply. The mold compound vendor is discontinuing manufacturing of the current mold compound. Affected products are listed on Page 2 of this PCN. Full electrical characterization and high reliability testing will be completed on representative samples ensuring that device functionality and
data sheet electrical specifications will not be affected.
PCN-1147 2009-12-15 Analog and Discrete Additional Assembly Location AUK Dalian, China for SOT23F Package Issued to notify customers that Diodes Incorporated has qualified a new assembly facility AUK in Dalian, China in order to assure continuity of supply for the SOT23F packages. Full electrical characterization and high reliability testing has been completed on representative devices from the affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package performance.
PCN-1150 2009-11-22 Discrete Change of Die Attach Method from Eutectic to Soft Solder This PCN is to notify customers of the qualification of soft solder die attach material in order to improve overall package performance. Affected products are listed below. Full electrical characterization and high reliability testing has been completed on representative devices assembled with the soft solder die attach material in order to ensure no change to device functionality or data sheet electrical specifications before shipment to our customers.
PCN-1151 2009-11-10 Analog Qualification of additional die for AP1534SG-13 and additional Wafer Fab for AP1534SG-13, AP1538SG-13, AP1538SDPG-13, AP1539SDPG-13, and AP1542SG-13 Issued to notify customers that in order to assure continuity of supply, Diodes has qualified an additional die for the AP1534SG-13. Diodes is also in the process of qualifying an additional FAB for the AP1534SG-13, AP1538SG-13, AP1538SDPG-13, AP1539SDPG-13, and AP1542SG-13. Affected products are listed. Full electrical characterization and high reliability testing will be completed using representative devices built with dies from the additional Wafer Fab source to ensure no change to device functionality or data sheet electrical specifications.
PCN-1144 2009-11-04 Discrete Qualification of additional wafer fabrication sources This notifies customers of the qualification of additional wafer fabrication sites in order to assure continuity of supply to our customers. Affected products are listed in the attached table. Full electrical characterization and high reliability testing will be completed on representative devices built with the dice from the additional fab sources in order to ensure no change to device functionality or data sheet electrical specifications before shipment to our customers.
ICN-1140 2009-07-24 Analog Date Code Marking Update In order to provide a higher level of device level traceability for our products, Diodes Incorporated is changing the format of the date code marking for package types listed within the PCN.
PCN-1143 2009-10-14 Analog Qualification of Additional Assembly/Test Site for QSOP16 and QSOP20 Packages Issued to notify our customers that Diodes, Inc. plans to qualify assembly/test (A/T) sites SKE (Diodes KaiHong Shanghai) and DSH (Diodes Shanghai) for QSOP16 and QSOP20 packages. The addition of SKE and DSH will increase Diodes assembly and test capacity for the QSOP16 and QSOP20 packages. Affected products are listed on Page 2 of this PCN. Full electrical characterization and high reliability testing will be completed on representative samples ensuring that device functionality and data sheet electrical specification will not be affected.
ICN-1141 2009-08-03 Logistics Warehouse Location Change This notice is to inform you that Diodes Incorporated will be moving our warehouse facility from Westlake Village, California to a third-party logistics warehouse in Fort Worth, Texas. The transition will begin August 3, 2009 and we anticipate completing the process by August 31, 2009. During this transition period, you may receive shipments from both locations. Please work with your Salesperson to update your shipment routing instructions in case they change due to the move. Our new warehouse will be located at:

c/o Exel Logistics
13601 Independence Pkwy
Fort Worth, TX 76177 USA
PCN-1137 2009-07-30 Discrete End of Life (EOL) of Packing Option The STOA (reeled) packing option for products listed in this PCN will be discontinued on July 30, 2009. To satisfy continuing customer requirements, Diodes Inc. is offering a non-cancelable last time buy (LTB) for the products listed. The last time buy order needs to be received on or before July 30, 2009. All shipments will be made on or before Oct 28, 2009. All EP3 products will continue to be available in the existing STZ (Ammo Pack) packing option.
PCN-1134 2009-05-30 Material Change Conversion of Sumitomo mold compound EME-6300H (being discontinued by manufacturer) to Sumitomo equivalent mold compound EME6600CSP and additional die attach qualification of 84-1LMISR4 This PCN is being issued to notify customers that Diodes is currently in the process of qualifying EME-6300CSP mold compound. The mold compound supplier for the current mold compound is discontinuing manufacturing of EME-63000H. EME-6600CSP will replace EME-6300H.
PCN-1135 2009-06-17 Discrete Addition of Diodes Zetex Semiconductors as an alternate fab source for the devices listed in the attachment below. This PCN is to notify customers of the qualification of the Diodes Zetex Semiconductors wafer fabrication site in addition to the previously qualified wafer fabrication site. Affected product part numbers are listed in the attached table. Full electrical characterization and high reliability testing will be completed on representative devices built with dice from the additional fab source in order to ensure no changes to device functionality or data sheet electrical specifications before shipment to our customers.
PCN-1112 2009-06-07 Discrete Conversion of SMA, SMB and SMC packages to Green Encapsulate (molding compound) Beginning with Date Code 0924 or later, products on the attached list will be converted to green molding compound. Always check product labeling on each reel to determine actual version. Previous versions will be shipped until inventory is exhausted.
PCN-1136 2009-06-04 Discrete Addition of Diodes FabTech as an alternate wafer fab source for devices listed in the attachment below. To notify customers of the qualification of Diodes FabTech wafer fabrication site in addition to the previously qualified wafer fabrication site in order to assure continuity of supply to our customers.
PCN-1133 2009-05-28 Discrete Qualification of additional fab sources for devices (listed). To notify customers of the qualification of additional wafer fabrication sites in order to assure continuity of supply to our customers.
PCN-1128 2009-05-14 Discrete Device EOL and Product Name Change The products listed in table 1 and table 2 below will be discontinued on May 14, 2009. In an attempt to satisfy any continuing requirements customers may have, Diodes, Inc. is offering a non-cancelable lifetime buy for the products listed. The lifetime buy order needs to be received on or before May 5, 2009. All shipments will be made on or before August 2, 2009. (*) Products listed in table 3 below are subject to a part number change. The affected products and their new part numbers are described in the attached table. The name change is effective immediately. Please inquire to your Diodes Inc Sales Representative for specific details.
PCN-1114 2009-04-09 Discrete Qualification of alternate dice from the current fab source for devices are listed. Alternate Discrete DIce Description Summary: To notify customers of qualification for alternate dice in discrete devices from the current fab source.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-1131 2009-03-30 Analog Qualification of Diodes Zetex Limited as additional fab source for devices listed in the attachement below This PCN is to notify customers of the qualification of the Diodes Zetex Limited wafer fabrication site in addition to the previously qualified wafer fabrication site (Liteon Semiconductor Corp) in order to assure continuity of supply to our customers. Affected products are listed in the attachment. Full electrical characterization and high reliability testing have been completed on this device type using the AP1117DG and AP1117EG package options to ensure no change to device functionality or datasheet electrical specifications.
PCN-1122 2009-01-01 Schottky Diodes Introduction of additional wafer manufacturing location (DFT) for Zetex schottky diodes Introduction of additional wafer manufacturing location (DFT) for Zetex schottky diodes
PCN-1121 2008-12-20 Analog Copper bond wire implementation Improve selected electrical and mechanical properties by changing from gold to copper bond wire. Copper wire devices will be phased in gradually from the date of implementation.
PCN-1126 2008-11-18 Discrete Device EOL Products listed herein have been discontinued. The affected products and their recommended replacements are described in the attached parts list. The discontinuance is effective immediately.
PCN-1127 2009-02-11 Discrete Qualification of FabTech as additional wafer fab source for discrete devices Notifies customers of the qualification of Fabtech as an additional wafer fab source for discrete devices in addition to Phenitec.
PCN-1120 2008-10-31 Analog New assembly manufacturing location for SOT23-6 (Unisem) Introduction of new manufacturing location (Unisem) for SOT23-6 products.
PCN-1119 2008-11-13 Integrated Circuits and Discrete Introduction of new assembly manufacturing location (SKE)
Addition of new mould compounds at existing manufacturing locations (ZNG, ZCEL & Unisem)
Introduction of new manufacturing location (SKE) for SOT23, SOT223, SOT89, DPAK, SOD323, SOD523, SOT323, SC70, MSOP8, SO8, SOT23-6, SOT23-5 packages for Bipolar, MOS and IC products. Addition of new mould compounds for use by ZNG (GE1030M), ZCEL (KTMC1050G) and Unisem (G600 / G600KA).
PCN-1118 2008-10-26 Analog New assembly manufacturing location for SO8 Products (Unisem) Introduction of new manufacturing location (Unisem) for SO8 products
PCN-1116 2008-12-15 Discrete Copper Bond Wire Implementation Improve selected electrical and mechanical properties by changing from gold to copper bond wire. Copper wire devices will be phased in gradually from the date of implementation.
PCN-1115 2008-09-17 Analog ANALOG COPPER BOND WIRE IMPLEMENTATION Improve selected electrical and mechanical properties by changing from gold to copper bond wire. Copper wire devices will be phased in gradually from the date of implementation.
PCN 1098 2008-06-05 Analog Device EOL Diodes, Inc has made a business decision to discontinue the product listed herein in all package options, effective immediatly. All on-hand inventories are available to sell as NCNR only and cannot be scheduled. No replacements are planned for this product.
PCN-1111 2008-06-21 Discrete COPPER BOND WIRE IMPLEMENTATION Improve selected electrical and mechanical properties by changing from gold to copper bond wire. Copper wire devices will be phased in gradually from the date of implementation.
PCN-1108 2008-08-13 Material Change Conversion of SOD-123 and SOD-323 Packages to Green Encapsulate (molding compound) Conversion of listed part numbers in SOD-123 and SOD-323 packages to green molding compound. No form, fit or function change.
PCN-1109 2008-08-13 Material Change Conversion of SOT-23 Packages to Green Encapsulate (molding compound) Beginning with Date Code 0833, encapsulate will contain no halogens or Sb2O3 fire retardants in SOT-23 packages (Selected products). Products will remain 94-V0 compliant, 260 degrees C maximum reflow temperature for 30 sec (Total) and MSL 1. No change to Form, Fit or Function.
PCN-1090 2008-07-31 Discrete Expansion of Product Approvals of Assembly & Test Site H This notifies customers of qual for an alt test site and assembly factory (H) for discrete devices currently being produced at other facilities. Expansion of SMA Package into this test and assembly site will add capacity and improve delivery time for products specified per attached parts listing.
PCN-1105 2008-06-30 Analog ANALOG COPPER BOND WIRE IMPLEMENTATION Improve selected electrical and mechanical properties by changing from gold to copper bond wire.
PCN-1102 2008-06-25 Analog Qualification of Packages in Factory DX Diodes Inc products listed herein will be qualified in Diodes Inc., factory DX, Shanghai P.R.C. and assembled in Diodes Inc., factory DX, Shanghai P.R.C. or the current qualified assembly sites upon the implementation date shown.
PCN 1096 2008-06-19 Discrete Alternate Discrete Dice from FA This PCN notifies customers of qualification for an alternate source (FA) for dice in Discrete devices curently produced in our Shanghai, PRC factories. Alternate dice will improve the delivery time and provide added capacity for parts listed in attachment.
PCN 1097 2008-06-19 Analog Alternate Dice from EP This PCN notifies customers of qualification for an alternate source (EP) for dice in Analog devices. Alternate dice will improve the delivery time and provide added capacity for parts listed in attachment.
PCN-1095 2008-06-09 Discrete Alternate Discrete Die Sources From CS & FA This is to notify customers of qualification for additional sources of specific dice in discrete devices currently being produced at our Factory in Shanghai, PRC.
PCN-1093 2008-05-25 Discrete Copper Bond Wire Implementation Improve selected electrical and mechanical properties by changing from gold to copper bond wire.
PCN-1086 2008-05-22 Discrete Bridge Rectifier Alternate Dice Qualification Alternate Wafer Qualification HD Bridge Series
PCN-1092 2008-01-17 Discrete Device EOL Products listed herein have been discontinued. For affected products and their recommended replacements, see Table 1. Discontinuance is effective immediately. LTB (last time buy) opportunity is available for 30 days. All new orders are subject to required factory minimums. Please ask your Diodes' Sales Rep for specific details.
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN 1084 2008-02-01 Discrete Bridge Rectifier Alternate Dice Qualification Alternate dice approval for use in subject part families GBJ, GBU, KBJ and KBP Bridges. Testing has been completed. There is no change in device functionality, reliability or Data Sheet specifications.
PCN 1085 2008-02-01 Discrete 4.0A Bridge Rectifier Conversion from Potted to Molded Construction Current potting material is being converted to molding compound due to environmental restrictions in China. Molded construction provides improved package form factor.
PCN 1065 2007-09-27 Discrete Alternate Discrete Die Sources Revised PCN to add additional fab sources (FA) to the existing fab sources of G and SL
PCN 1074 2007-09-28 Analog AH280-PL-B Discontinuance Diodes, Inc. will no longer manufacture the AH280-PL-B products in the next few months.
PCN 1077 2007-09-30 Discrete SOT-563 Copper Lead Frame Change Certain SOT-563 parts with Alloy 42 lead frames will only be available in copper. Lead finish changed from 7.5 - 15 um matte Sn, annealed over Alloy 42, to 7.5 - 15um matte Sn, annealed over 3 um Ni underplaying on Copper Alloy.
PCN 1078 2007-10-01 Discrete Conversion of SOT-363, SOT-523, SOT-563, SC59 and SC70 Packages to Green Encapsulate (molding compound) Beginning with Date Code 0740, encapsulate will contain no halogens or Sb2O3 fire retardants. Product will remain 94-V0 compliant, 260 C max reflow temperature for 30 sec and MSL 1. Encapsulate has successfully passed Hi-Rel testing and has been used in other product types successfully for more than 24 months.
PCN 1072 2007-05-03 PLD PLD Product Family Termination Diodes, Inc. has made the decision to discontinue the PLD Product line - Effective Immediately. All on hand inventory is available to sell as
NCNR only and cannot be scheduled.
PCN 1070 2007-07-13 Discrete Alternate Dice Qualified Alternate dice have successfully completed High Reliability testing and device qualification.
PCN 1069 2007-03-30 PLD PLD Device and Package Termination Diodes, Inc. has made the decision to discontinue the above part numbers from PLD Product Family - Effective Immediately.
PCN 1067 2007-02-12 PLD PLD device discontinuance list Certain products within the PLD product line are no longer available
PCN 1066 2007-05-08 Discrete ITO-220AB Part Number Change Suffix changed from "CTF" to "CTFP" for the ITO-220AB type packages
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN 1056 2007-01-01 Discrete Conversion to Diodes' Logo on Parts, Carton, Inner Box, Label for Certain APD Technology Devices
PCN 1053 2007-01-27 Discrete Surface Mount Small Signal Transistor Alternate Die Alternate dice have past 1,000 hours of high reliabilit testing per AEC-Q101 and are qualified for use in the transistors listed in the PCN.
PCN 1055 2006-10-26 Discrete WU-Xi Plant Begins Operations
PCN 1071 2007-04-18 Discrete PD3S Family Marking Change Device marking code on topside of part has been changed due to the limited amount on space of the device topside surface.
PCN 1046 2006-08-01 Discrete Improved Marking Upgrade part marking to Laser marking from ink markings
PCN 1048 2006-07-18 Analog Anachip Brand Name Change
PCN 1047 2006-07-08 Analog VFD Product Production Termination
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN 1043 2006-03-01 Discrete Introduction of Product in certain SOD/SOT/SC Packages that are RoHS compliant with Green Encapsulate Lead Plating of listed products is 100% Matte Sn. and Beginning DC of 0627, Encapsulate will contain no Halogens or Sb2O3 Fire Retardants. Product will remain 94-V0 compliant, 260 deg. C maximum reflow temperature for 30 sec and MSL 1.
PCN 1044 2005-12-01 Discrete Introduction of Product in certain D2PAK, GBJ, MELF, PM3, SMA, SMB,SMC,SOD/SOT Packages that are RoHS compliant. Lead Plating of listed products is 100% Matte Sn.
PCN 1040 2005-07-15 Discrete Discontinuation of Certain DPAK Products Due to disqualification of source, products listed below in the DPAK Package have been discontinued. Availability is limited to stock on hand.
PCN-1039 2005-02-04 Discrete Qual of Fab Site for Switching, Zener & Sm Sig Trans Wafer
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN 1042 2005-07-15 Discrete Assembly & Test Site
PCN-1037 2004-07-17 Discrete Notice of Facility Expansion Diodes Inc. will expand its Manufacturing Subsidiary, Shanghai Kaihong Electronics Co., Ltd. (Diodes China) into a second facility on or about July 17, 2004. The expansion is being made to increase capacity for our small outline Surface Mount products and to improve our export efficiency from China.
PCN-1036 2004-07-16 Discrete Notice of Product Discontinuation
PCN-1035 2004-07-15 Discrete Conversion to Lead Free Terminal Plating Mini Melf, DO-35 and DO-41 Axials Lead finish plating was SnPb, is Sn
Lead free plating will phase in after April 26, 2004
SnPb finished product will ship until supply is exhausted unless specifically ordered otherwise
All product shipping after July 15, 2004 is expected to be Lead Free
PCN-1033 2004-03-10 Discrete Changes to SMC Package Dimension Block
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2003-1031 2003-05-01 Discrete Availability of Product with Pb Free Lead Finish
PCN-2003-1029 2003-04-01 Discrete Elec Char Rating Corrections
PCN-1026 2003-04-12 Discrete Discrete
PCN-1027 2003-03-07 Discrete Spec Change
PCN # Implementation Date Alert Category Title
(Abbreviated)
Description Summary
PCN-2002-1020 2002-12-16 Discrete Electrical Characteristic Specification Corrections and Clarifications
PCN-2002-1019 2002-11-11 Discrete Operating Temperature Range (Tj) and Storage Temperature Range (TSTG) Correction Operating Temperature Range (Tj) was -65 to +175ºC, is -55 to + 125ºC
Storage Temperature Range (TSTG) was -65 to + 175ºC, is -55 to + 150ºC
PCN-2003-1028 2003-03-27 Product Status Product Status DB10X Bridge Family Status Change
PCN-2002-1017 2002-10-01 Discrete Bond Wire Size Change Internal Bond Wire diameter change from 1.0 mil to 0.8 mil. No change in device specification will result.
PCN-2002-1014 2002-08-08 Discrete Marking Code Change MMBZ15VAL Corrected Marking Information on Data Sheet, was K9K s/b K9K, KDJ. Parts may be marked K9K or KDJ.
PCN-2002-1015 2002-08-08 Discrete Marking Code Change BAV19WS Corrected Marking Information on Data Sheet, was BAV19WS Marking: A8 or T3, s/b BAV19WS Marking: A8 or T2 or T3. Parts may be marked A8, T2 or T3.
PCN-2002-1013 2002-08-07 Discrete Marking Code Change 1N4148WS/BAV16WS Corrected Marking Information on Data Sheet, was T4 s/b T4, T6. Parts may be marked T4 or T6.
PCN-2002-1016 2002-08-07 Discrete Marking Code Change 1N4148WS Corrected Marking Information on Data Sheet, was T4 s/b T4, T6. Parts may be marked T4 or T6.
PCN-2002-1012 2002-08-01 Discrete Marking Code Change TLC363C6V4 Corrected Marking Information on Data Sheet, was K04, s/b K03. Parts are marked K03.
PCN-2002-1010 2002-08-15 Discrete Wafer change MMBTA42 Wafer change. Added guard ring and changed mask pattern.
Qualification Package available on request
PCN-2002-1007 2002-07-10 Discrete Obsolescence Notice BAV301-BAV303 Status Inactive
PCN-2002-1008 2002-07-10 Discrete Obsolescence Notice BZM5221B – BZM5267B Status Inactive
PCN-2002-1009 2002-07-10 Discrete Obsolescence Notice TZQ5221B – TZQ5267B Status Inactive
PCN-2002-1006 2002-07-07 Discrete 2N4124 Status Inactive
PCN-2002-1011 2002-06-24 Discrete Specification Change, Marking Change MMBT3904 Case material clarification, Data Sheet now indicates UL Flammability Rating Classification of 94V-0.
Discontinued build at alternate assembly and test sites indicated by markings R1A, 1AM and 1A
All assembly and test now performed at Shanghai Kaihong Electronic Co., Ltd., Diodes Inc. Subsidiary
PCN-1004 2002-06-06 Discrete SD103A-SD103C Elec Ratings Change
PCN-1003 2002-05-21 Discrete BAS70H/-04/-05/-06 Status Inactive
PCN-1001 2002-05-17 PCN Alt Assem / Test Loc