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Diodes Product Change Notices

Welcome to our Product/Process Change Notification (PCN) pages from the last five  years. To locate PCNs, please select year from the menu on this page.

Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.

To Automatically Receive PCN Notification / E-mail Alerts

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2601 2022-10-28 2023-01-28 Discrete Additional Wafer Source for Select Discrete Products
PCN-2600 2022-10-03 2023-04-03 Discrete Device End of Life (EOL)
PCN-2599 2022-10-11 2023-01-11 Discrete Additional Wafer Source for Select Discrete Products
PCN-2598 2022-08-25 2022-08-25 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan
PCN-2597 2022-09-16 2022-12-16 Discrete Change GBPC (W) Package Outline Dimensions for Select Products
PCN-2596 2022-09-08 2022-12-08 Analog – Automotive Qualified Additional Wafer Fab “Key Foundry” Source located in Cheongju, Korea - Automotive
PCN-2595 2022-09-08 2022-12-08 Analog Qualified Additional Wafer Fab Source, Die Revisions, Bill of Materials, and Data Sheet Changes
PCN-2594 2022-08-31 2023-02-28 Analog Device End of Life (EOL)
PCN-2593 2022-11-02 2023-05-02 Discrete Device End of Life (EOL)
PCN-2592 2022-09-12 2022-12-12 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site Using PdCu Bond Wire and New Lead Frame for Select Products
PCN-2591 2022-06-21 2022-09-21 Discrete Semiconductors Change of Lead Frame Type for Select Automotive Products
PCN-2590 2022-06-01 2022-09-01 Discrete - Automotive Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2589 2022-05-11 2022-08-11 Discrete - Automotive Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH) - Automotive
PCN-2588 2022-06-01 2022-09-01 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products
PCN-2587 2022-05-13 2022-11-13 Analog Device End of Life (EOL)
PCN-2586 2022-06-08 2022-09-08 Analog - Automotive Qualified Additional Wafer Fab Backend IMD Material and Process - Automotive
PCN-2585 2022-06-08 2022-09-08 Analog Semiconductors Qualified Additional Assembly/Test (A/T) Sites, Wafer Fab IMD Backend, and Package Outline Dimension Change
PCN-2584 2022-05-19 2022-11-19 Discrete Device End of Life (EOL)
PCN-2582 2022-05-17 2022-08-17 Discrete Semiconductors Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH)
PCN-2581 2022-05-10 2022-08-10 Discrete Additional Wafer Source for Select Discrete Products
PCN-2579 2022-08-29 2023-02-28 Discrete Device End of Life (EOL)
PCN-2578 2022-04-26 2022-06-30 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan, and Device End of Life
(EOL)
PCN-2576 2022-03-01 2022-06-01 Discrete - Automotive Wafer Diameter Change from 6 inch to 8 inch at Diodes Internal BCD (Shanghai) Micro-Electronics Limited (SFAB2) in Shanghai, China for Select Automotive Products
PCN-2575 2022-04-05 2022-07-05 Analog Semiconductors Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH)
PCN-2574 2022-04-05 2022-07-05 Analog - Automotive Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH)
PCN-2572 2022-02-15 2022-02-15 Discrete Qualification of Additional Wafer Source
PCN-2571 2022-03-17 2022-06-17 Discrete Qualification of Additional Diodes Internal Assembly & Test Site (SAT)
PCN-2570 2022-03-02 2022-06-02 Discrete - Automotive Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire, New Mold Compound Type, and New Die Attach Material for Select Automotive Products
PCN-2568 2022-03-29 2022-03-29 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Sites, Bill of Material, and updated Data Sheets for Package Outline Dimension Change
PCN-2567 2022-03-30 2022-09-30 Analog Semiconductors Device End of Life (EOL)
PCN-2566 2022-03-31 2022-09-30 Discrete Device End of Life (EOL)
PCN-2564 2021-12-30 2021-12-30 Discrete Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Discrete Products
PCN-2563 2021-12-29 2022-03-29 Discrete - Automotive Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Automotive Products
PCN-2562 2022-01-04 2022-04-04 Discrete Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2561 2022-02-17 2022-08-17 Discrete Device End of Life (EOL)
PCN-2560 2021-12-16 2021-12-16 Discrete Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT)
PCN-2559 2021-12-01 2022-03-01 Discrete Wafer Diameter Change from 3 inch to 4 inch at Diodes Shanghai Seefull Electronic Co., Ltd. (SSEC FAB) on Select Products
PCN-2558 2021-11-12 2022-05-12 Analog Device End of Life (EOL)
PCN-2556 2021-11-22 2022-05-22 Discrete Device End of Life (EOL)
PCN-2555 2021-11-11 2022-05-11 Analog Device End of Life (EOL)
PCN-2554 2021-11-15 2022-02-15 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Sites, Bill of Material (BOM) and updated Data Sheets for Package Outline
Dimension Change
PCN-2553 2021-11-12 2022-02-12 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site with Standardization of Assembly Bill of Materials at CAT for Select Discrete Products
PCN-2552 2021-12-15 2021-12-15 Discrete Add Product Ordering Information on Device Data Sheets for Select Lite-On Semiconductor (LSC) Brand Products
PCN-2551 2021-11-10 2022-05-10 Discrete Device End of Life (EOL)
PCN-2550 2021-12-20 2022-06-20 Discrete Device End of Life (EOL)
PCN-2549 2021-10-19 2022-04-19 Discrete Device End of Life (EOL)
PCN-2548 2021-10-08 2022-01-08 Analog Semiconductors Additional Wafer Source (JKFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Assembly/Test (A/T) Site (CAT)
PCN-2546 2021-09-23 2021-12-23 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan for Select Lite-On Semiconductor (LSC) Brand Automotive Products.
PCN-2545 2021-10-05 2022-01-05 Discrete - Automotive Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products
PCN-2544 2021-10-05 2022-01-05 Discrete Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Products