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Diodes Product Change Notices

Welcome to our Product/Process Change Notification (PCN) pages from the last five  years. To locate PCNs, please select year from the menu on this page.

Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.

To Automatically Receive PCN Notification / E-mail Alerts

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2589 2022-05-11 2022-08-11 Discrete - Automotive Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH) - Automotive
PCN-2587 2022-05-13 2022-11-13 Analog Device End of Life (EOL)
PCN-2584 2022-05-19 2022-11-19 Discrete Device End of Life (EOL)
PCN-2582 2022-05-17 2022-08-17 Discrete Semiconductors Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH)
PCN-2581 2022-05-10 2022-08-10 Discrete Additional Wafer Source for Select Discrete Products
PCN-2578 2022-04-26 2022-06-30 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan, and Device End of Life
(EOL)
PCN-2576 2022-03-01 2022-06-01 Discrete - Automotive Wafer Diameter Change from 6 inch to 8 inch at Diodes Internal BCD (Shanghai) Micro-Electronics Limited (SFAB2) in Shanghai, China for Select Automotive Products
PCN-2575 2022-04-05 2022-07-05 Analog Semiconductors Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH)
PCN-2574 2022-04-05 2022-07-05 Analog - Automotive Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH)
PCN-2572 2022-02-15 2022-02-15 Discrete Qualification of Additional Wafer Source
PCN-2571 2022-03-17 2022-06-17 Discrete Qualification of Additional Diodes Internal Assembly & Test Site (SAT)
PCN-2570 2022-03-02 2022-06-02 Discrete - Automotive Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire, New Mold Compound Type, and New Die Attach Material for Select Automotive Products
PCN-2568 2022-03-29 2022-03-29 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Sites, Bill of Material, and updated Data Sheets for Package Outline Dimension Change
PCN-2567 2022-03-30 2022-09-30 Analog Semiconductors Device End of Life (EOL)
PCN-2566 2022-03-31 2022-09-30 Discrete Device End of Life (EOL)
PCN-2564 2021-12-30 2021-12-30 Discrete Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Discrete Products
PCN-2563 2021-12-29 2022-03-29 Discrete - Automotive Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Automotive Products
PCN-2562 2022-01-04 2022-04-04 Discrete Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2561 2022-02-17 2022-08-17 Discrete Device End of Life (EOL)
PCN-2560 2021-12-16 2021-12-16 Discrete Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT)
PCN-2559 2021-12-01 2022-03-01 Discrete Wafer Diameter Change from 3 inch to 4 inch at Diodes Shanghai Seefull Electronic Co., Ltd. (SSEC FAB) on Select Products
PCN-2558 2021-11-12 2022-05-12 Analog Device End of Life (EOL)
PCN-2556 2021-11-22 2022-05-22 Discrete Device End of Life (EOL)
PCN-2555 2021-11-11 2022-05-11 Analog Device End of Life (EOL)
PCN-2554 2021-11-15 2022-02-15 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Sites, Bill of Material (BOM) and updated Data Sheets for Package Outline
Dimension Change
PCN-2553 2021-11-12 2022-02-12 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site with Standardization of Assembly Bill of Materials at CAT for Select Discrete Products
PCN-2552 2021-12-15 2021-12-15 Discrete Add Product Ordering Information on Device Data Sheets for Select Lite-On Semiconductor (LSC) Brand Products
PCN-2551 2021-11-10 2022-05-10 Discrete Device End of Life (EOL)
PCN-2550 2021-12-20 2022-06-20 Discrete Device End of Life (EOL)
PCN-2549 2021-10-19 2022-04-19 Discrete Device End of Life (EOL)
PCN-2548 2021-10-08 2022-01-08 Analog Semiconductors Additional Wafer Source (JKFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Assembly/Test (A/T) Site (CAT)
PCN-2546 2021-09-23 2021-12-23 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan for Select Lite-On Semiconductor (LSC) Brand Automotive Products.
PCN-2545 2021-10-05 2022-01-05 Discrete - Automotive Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products
PCN-2544 2021-10-05 2022-01-05 Discrete Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Products
PCN-2543 2021-08-30 2021-11-30 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products in SMA Package
PCN-2542 2021-08-30 2021-11-30 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package
PCN-2540 2021-08-08 2021-11-08 Analog Semiconductors Qualified Additional Fab Site, Assembly/Test (A/T) Sites, Bill of Material (BOM) and updated Device Data Sheets
PCN-2539 2021-09-09 2022-03-09 Analog Device End of Life (EOL)
PCN-2536 2021-08-06 2021-08-06 Discrete Device End of Life (EOL)
PCN-2534 2021-07-29 2021-10-29 Analog Semiconductors Qualified Additional BUMP Site (LBS) and Assembly/Test (A/T) Site (CAT)
PCN-2533 2021-09-02 2022-03-02 Discrete Device End of Life (EOL)
PCN-2532 2021-10-04 2022-01-04 Discrete Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) on Select Automotive Products
PCN-2531 2021-07-30 2022-01-29 Analog Additional Die Revision, Redistribution Layer (RDL), BUMP Sites (SJSEMI and LBS), as well as Assembly/Test (A/T) Site (CAT)
PCN-2530 2021-09-03 2021-12-03 Discrete Addition of a Passivation Layer Over the Top Metal of the Die for Select Lite-On Semiconductor (LSC) Brand Products
PCN-2529 2021-06-01 2021-06-01 Discrete and Analog Conversion to Diodes Incorporated standard product labels and shipping boxes for products currently using Lite-On Semiconductor product labels and boxes.
PCN-2528 2021-07-20 2021-10-15 Discrete Device End of Life (EOL)
PCN-2527 2021-06-09 2021-09-09 Analog Semiconductors Additional Wafer Source (GFAB, JKFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Additional Assembly/Test
(A/T) Site (CAT)
PCN-2526 2021-06-09 2021-09-09 Analog Semiconductors - Automotive Additional Wafer Source (GFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Additional Assembly/Test Site (CAT)
PCN-2524 2021-10-04 2022-01-04 Discrete Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) and Qualification of Yea Shin
Technology Co., Ltd. as Additional Wafer Source on Select Products
PCN-2522 2021-08-24 2021-11-24 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products