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Diodes 產品變更說明

歡迎訪問我們2016年的產品/制程變更通知(PCN)頁面。要查找PCN,請從本頁功能表中選擇年份。

每個 PCN 皆提供聯絡人與實施日期、提醒類別與類型、PCN 號碼、標題、影響、變更說明,以及 Diodes 所製造且受到產品/製程變更之影響的完整元件清單。若要檢視 PCN,請按一下 PCN# PDF。

若要自動接收 PCN 通知/電子郵件提醒

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2543 2021-08-30 2021-11-30 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products in SMA Package
PCN-2542 2021-08-30 2021-11-30 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package
PCN-2540 2021-08-08 2021-11-08 Analog Semiconductors Qualified Additional Fab Site, Assembly/Test (A/T) Sites, Bill of Material (BOM) and updated Device Data Sheets
PCN-2539 2021-09-09 2022-03-09 Analog Device End of Life (EOL)
PCN-2536 2021-08-06 2021-08-06 Discrete Device End of Life (EOL)
PCN-2534 2021-07-29 2021-10-29 Analog Semiconductors Qualified Additional BUMP Site (LBS) and Assembly/Test (A/T) Site (CAT)
PCN-2533 2021-09-02 2022-03-02 Discrete Device End of Life (EOL)
PCN-2531 2021-07-30 2021-11-15 Analog Additional Die Revision, Redistribution Layer (RDL), BUMP Sites (SJSEMI and LBS), as well as Assembly/Test (A/T) Site (CAT)
PCN-2530 2021-09-03 2021-12-03 Discrete Addition of a Passivation Layer Over the Top Metal of the Die for Select Lite-On Semiconductor (LSC) Brand Products
PCN-2529 2021-06-01 2021-06-01 Discrete and Analog Conversion to Diodes Incorporated standard product labels and shipping boxes for products currently using Lite-On Semiconductor product labels and boxes.
PCN-2528 2021-07-20 2022-01-20 Discrete Device End of Life (EOL)
PCN-2527 2021-06-09 2021-09-09 Analog Semiconductors Additional Wafer Source (GFAB, JKFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Additional Assembly/Test
(A/T) Site (CAT)
PCN-2526 2021-06-09 2021-09-09 Analog Semiconductors - Automotive Additional Wafer Source (GFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Additional Assembly/Test Site (CAT)
PCN-2522 2021-08-24 2021-11-24 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products
PCN-2521 2021-05-27 2021-08-27 Analog Semiconductors - Automotive Qualified Additional Bill of Materials (BOM) - Automotive
PCN-2520 2021-05-27 2021-08-27 Analog Semiconductors Qualified Additional Bump Site and Assembly/Test (A/T) Sites
PCN-2519 2021-05-20 2021-11-20 Analog Device End of Life (EOL)
PCN-2518 2021-06-29 2021-09-29 Discrete Semiconductors Qualification of Additional Diodes Internal Assembly & Test (A/T) Site (SAT)
PCN-2517 2021-05-24 2020-11-24 Discrete Device End of Life (EOL)
PCN-2514 2021-03-09 2021-06-09 Analog Additional Wafer Source JKFAB
PCN-2513 2021-03-08 2021-06-08 Analog - Automotive Additional Wafer Source GFAB - Automotive
PCN-2512 2021-04-16 2021-07-16 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Site
PCN-2511 2021-09-13 2021-12-13 Discrete Wafer Diameter Change from 3 inch to 4 inch at Diodes Shanghai Seefull Electronic Co., Ltd. (SSEC FAB) on Select Products
PCN-2510 2021-02-26 2021-05-26 Analog Semiconductors Qualified Additional A/T Sites, Fab Site and Data Sheet Change
PCN-2509 2021-02-09 2021-05-09 Analog Semiconductors (Automotive) Qualified Additional FL Series Package (Automotive)
PCN-2508 2021-03-17 2021-03-18 Discrete Change Date Code Marking Information from “YM” (Year/Month) to “YW” (Year/Week)
PCN-2507 2021-02-03 2021-05-03 Discrete and Analog Semiconductors Qualification of Additional Wafer Backside Material Supplier
PCN-2506 2021-02-09 2021-05-09 Analog Semiconductors Qualified Additional FL Series Package
PCN-2505 2021-01-26 2021-07-26 Analog Device End of Life (EOL)
PCN-2502 2021-03-15 2021-09-15 Discrete Device End of Life (EOL)
PCN-2501 2021-01-13 2021-04-13 Analog Semiconductors Qualified Additional A/T Sites
PCN-2500 2021-03-24 2021-06-24 Discrete Semiconductors Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products
PCN-2499 2021-06-23 2021-09-23 Discrete Products Change DBF Package Outline Dimensions for Select Products
PCN-2498 2021-04-07 2021-04-07 Discrete Qualification of Additional Wafer Source, and Additional Assembly and Test (A/T) Site for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Discrete Semiconductors Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2493 2020-12-28 2021-03-28 Analog Semiconductors Qualified Additional A/T Sites and Bill of Materials (BOM)
PCN-2492 2020-11-04 2021-05-04 Analog Device End of Life (EOL)
PCN-2491 2020-11-17 2021-05-17 Discrete Device End of Life (EOL)
PCN-2490 2020-10-22 2021-01-22 Analog Additional Wafer Source (LiteOn Semiconductor Corp.)
PCN-2488 2020-10-20 2021-01-20 Analog Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and BOM Change
PCN-2487 2020-10-07 2021-01-07 Analog Fab Porting from Global Foundries to Magnachip, Assembly & Test Site Transfer, and Datasheet Change
PCN-2485 2020-12-04 2021-03-04 Discrete (Automotive) Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Qualification of Additional Wafer Source for Select Discrete Automotive Products
PCN-2484 2020-11-04 2021-02-04 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Standardization of Assembly Bill of Materials At The Existing CAT Site for Select Discrete Products
PCN-2481 2020-08-26 2021-02-26 Analog Device End of Life (EOL)
PCN-2480 2020-10-21 2021-01-21 Analog Semiconductors Additional Qualified (AT) Assembly Test Site SIMAT
PCN-2478 2020-08-13 2021-06-06 Discrete - Automotive Additional Wafer Source (GFAB)
PCN-2477 2020-08-17 2021-05-09 Discrete Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2475 2020-08-06 2020-11-06 Discrete Qualification of Assembly & Test Site Transfer for Select Discrete Products
PCN-2474 2020-12-16 2021-03-16 Discrete Qualification of Additional Wafer Source for Select Discrete Products
PCN-2473 2021-07-02 2021-10-02 Discrete Qualification of Additional Wafer Source for Select Discrete Products