歡迎訪問我們2016年的產品/制程變更通知（PCN）頁面。要查找PCN，請從本頁功能表中選擇年份。
每個 PCN 皆提供聯絡人與實施日期、提醒類別與類型、PCN 號碼、標題、影響、變更說明，以及 Diodes 所製造且受到產品/製程變更之影響的完整元件清單。若要檢視 PCN，請按一下 PCN# PDF。
| PCN # | Issue Date | Implementation Date | Product Family | Change Type |
|---|---|---|---|---|
| PCN-2492 | 2020-11-04 | 2021-05-04 | Analog | Device End of Life (EOL) |
| PCN-2491 | 2020-11-17 | 2021-05-17 | Discrete | Device End of Life (EOL) |
| PCN-2490 | 2020-10-22 | 2021-01-22 | Analog | Additional Wafer Source (LiteOn Semiconductor Corp.) |
| PCN-2488 | 2020-10-20 | 2021-01-20 | Analog | Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and BOM Change |
| PCN-2487 | 2020-10-07 | 2021-01-07 | Analog | Fab Porting from Global Foundries to Magnachip, Assembly & Test Site Transfer, and Datasheet Change |
| PCN-2485 | 2020-12-04 | 2021-03-04 | Discrete (Automotive) | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Qualification of Additional Wafer Source for Select Discrete Automotive Products |
| PCN-2484 | 2020-11-04 | 2021-02-04 | Discrete Semiconductors | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Standardization of Assembly Bill of Materials At The Existing CAT Site for Select Discrete Products |
| PCN-2481 | 2020-08-26 | 2021-02-26 | Analog | Device End of Life (EOL) |
| PCN-2480 | 2020-10-21 | 2021-01-21 | Analog Semiconductors | Additional Qualified (AT) Assembly Test Site SIMAT |
| PCN-2478 | 2020-08-13 | 2021-06-06 | Discrete - Automotive | Additional Wafer Source (GFAB) |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Discrete | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2475 | 2020-08-06 | 2020-11-06 | Discrete | Qualification of Assembly & Test Site Transfer for Select Discrete Products |
| PCN-2474 | 2020-12-16 | 2021-03-16 | Discrete | Qualification of Additional Wafer Source for Select Discrete Products |
| PCN-2473 | 2021-07-02 | 2021-10-02 | Discrete | Qualification of Additional Wafer Source for Select Discrete Products |
| PCN-2472 | 2020-08-13 | 2021-02-13 | Discrete - Automotive | Device End of Life (EOL) - Automotive |
| PCN-2471 | 2020-07-01 | 2020-11-29 | Analog Semiconductors | Additional Wafer Source - GFAB |
| PCN-2466 | 2020-07-02 | 2020-10-02 | Analog Semiconductors | Package Change and Additional Qualified Plating Source |
| PCN-2465 | 2020-07-02 | 2020-10-02 | Analog - Automotive | Additional Qualified Plating Source - Automotive |
| PCN-2464 | 2020-04-28 | 2020-10-28 | Analog | Device End of Life (EOL) |
| PCN-2462 | 2020-05-08 | 2021-04-11 | Discrete - Automotive | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive) |
| PCN-2461 | 2020-05-08 | 2021-04-05 | Discrete | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site |
| PCN-2460 | 2020-05-12 | 2020-05-12 | Discrete Semiconductors | Qualified Additional Wafer Source and BGBM Source |
| PCN-2459 | 2020-05-28 | 2020-11-28 | Discrete | Device End of Life (EOL) |
| PCN-2458 | 2020-07-01 | 2020-10-01 | Discrete | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2457 | 2020-05-27 | 2020-08-27 | Discrete - Automotive | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, and Change to Palladium Coated Copper Bond Wire, and New Mold Compound on Select Automotive Products |
| PCN-2456 | 2020-05-29 | 2020-08-29 | Discrete Semiconductors | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site Using Copper or Palladium Coated Copper Bond Wire with Standardization of Assembly Bill of Materials, Or as an Additional Wafer Plating, Back Grinding and Back Metal Process Source, and Qualification of Additional Wafer Source for Select Discrete Products. |
| PCN-2455 | 2020-03-11 | 2020-06-11 | Analog Semiconductors | New Die Revision Change |
| PCN-2453 | 2020-04-07 | 2020-10-07 | Discrete | Device End of Life (EOL) |
| PCN-2450 | 2020-02-17 | 2020-05-17 | Discrete | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2449 | 2020-02-14 | 2020-05-14 | Discrete | Qualification of Additional Wafer Sources for Select Discrete Products |
| PCN-2448 | 2020-02-05 | 2020-08-05 | Analog | Device End of Life (EOL) |
| PCN-2447 | 2020-01-30 | 2020-04-30 | Analog | Additional Qualified (FAB) Wafer Fab Source, (A/T) Assembly/Test Site, and (BOM) Bill of Materials |
| PCN-2446 | 2020-01-24 | 2020-01-24 | Discrete | Change Date Code Marking Information from “YM” (Year/Month) to “YW” (Year/Week) |
| PCN-2439 | 2019-12-05 | 2020-03-05 | Discrete Semiconductors | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Using Gold Bond Wire, and as an Additional Wafer Back Grinding and Back Metal Process Source on Select MOSFET Products |
| PCN-2438 | 2020-02-13 | 2020-05-13 | Analog Semiconductors | Data Sheet Change and Additional Qualified Package BOM |
| PCN-2436 | 2019-11-14 | 2020-05-14 | Analog | Device End of Life (EOL) |
| PCN-2433 | 2019-10-07 | 2020-04-07 | Analog | Device End of Life (EOL) |
| PCN-2432 | 2019-08-09 | 2019-08-09 | Replacement Wafer FAB Source for RDL Process | |
| PCN-2431 | 2019-10-31 | 2020-01-31 | Discrete | Qualification of Additional Wafer Source for Select Discrete Products |
| PCN-2430 | 2019-09-04 | 2019-09-04 | Discrete Semiconductors - Automotive | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Automotive part SBRT3U40P1Q-7 |
| PCN-2429 | 2019-11-20 | 2020-02-20 | Analog Semiconductors | Additional Qualified (AT) Assembly Test Site + BOM + Top Marking |
| PCN-2428 | 2019-11-12 | 2020-02-12 | Analog | Assembly & Test Site Porting from OSE to Greatek |
| PCN-2427 | 2019-10-15 | 2020-04-15 | Analog | Device End of Life (EOL) |
| PCN-2426 | 2019-08-06 | 2020-02-06 | Analog | Device End of Life (EOL) |
| PCN-2425 | 2019-10-04 | 2020-01-04 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products. |
|
| PCN-2423 | 2019-06-28 | 2019-06-28 | Discrete | Device End of Life |
| PCN-2422 | 2019-11-26 | 2020-02-26 | Discrete | Addition of A Passivation Layer Over The Top Metal of The Die for Select BJT Products |
| PCN-2420 | 2019-09-18 | 2019-12-18 | Discrete Products | Clip Bond Structure, Lead Frame Type, and Mold Compound Changes to Enhance PowerDI-123 Package as well as Qualification of Additional Wafer Source for Select Products |
| PCN-2419 | 2019-06-11 | 2019-09-11 | Discrete Products | Change of Assembly Lead Plating Process from Bright Tin Coating to Matte Tin Coating for Select TO-126 Products |
| PCN-2418 | 2019-11-07 | 2020-05-07 | Discrete | Device End of Life (EOL) |
