Diodes Incorporated

Diodes 產品變更說明

歡迎訪問我們2016年的產品/制程變更通知(PCN)頁面。要查找PCN,請從本頁功能表中選擇年份。

每個 PCN 皆提供聯絡人與實施日期、提醒類別與類型、PCN 號碼、標題、影響、變更說明,以及 Diodes 所製造且受到產品/製程變更之影響的完整元件清單。若要檢視 PCN,請按一下 PCN# PDF。

若要自動接收 PCN 通知/電子郵件提醒

PCN # Issue Date Implementation Date Product Family Change Type Related Part Numbers
PCN-2671 2024-02-20 2024-05-20 Discrete Semiconductor Part Marking Change
  • ZHCS400Q
  • ZLLS400Q
PCN-2670 2024-02-20 2024-05-20 Discrete Semiconductor Part Marking Change
  • ZHCS400
  • ZLLS400
  • ZLLS410
PCN-2667 2024-02-07 2024-05-07 Analog Qualified Additional Bill of Material (BOM) - Die Source, Die Revision.
  • AP7368
PCN-2666 2024-02-07 2024-05-07 Analog Qualified Additional Bill of Material (BOM) - Die Source
PCN-2664 2024-02-23 2024-08-23 Discrete Semiconductor Device End of Life (EOL)
  • DBF1510U
  • DBF210
  • DBF2510
  • DBF310
  • DFLR1600
  • DGD2110
  • DGD2113
  • DGD2117
  • DGD2118
  • DGD2181
  • DGD21814
  • DGD2184
  • DGD2190
  • DGD21904
  • DMN3003LCA8
  • DMN30H14DLY
  • DT1240H-04LP
  • FCX493
  • FCX495
  • FCX591A
  • G5E100B
  • GBJ35JL
  • MMSZ5231B
  • MMSZ5244B
  • MMSZ5248B
  • RDBF1510U
  • RDBF151U
  • RDBF152U
  • RDBF154U
  • RDBF156U
  • RDBF158U
  • RDBF251
  • RDBF2510
  • RDBF252
  • RDBF254
  • RDBF256
  • RDBF258
  • RDBF31
  • RDBF310
  • RDBF32
  • RDBF34
  • RDBF36
  • RDBF38
  • SXTA42
PCN-2661 2024-02-21 2024-05-21 Discrete Automotive Qualification of Additional Wafer Source and Wafer Diameter Change
  • SBR10M100P5Q
  • SBR15U30SP5Q
  • SBR1U200P1Q
  • SBR20A60CTBQ
  • SBR20M150D1Q
  • SBR2M60S1FQ
  • SBR2U60S1FQ
  • SBR3A40SAQ
  • SBR3U40S1FQ
  • SBR3U60P1Q
  • SBR3U60P5Q
  • SBR40U200CTBQ
  • SBR545SAFQ
PCN-2658 2024-02-12 2024-05-12 Discrete Semiconductor Wafer Diameter Change from 4 inch to 5 inch at Diodes Internal Wafer Fabrication WX1 in WuXi, China for Select Discrete Products
  • KBJL1006
  • KBJL1010
  • KBJL1508
  • KBJL1510
  • KBJL408
  • KBJL608
  • MSB40M
  • S1KP1M
  • S1MWFM
  • S5JB
  • S5KP5M
  • TT10M
PCN-2656 2023-12-20 2024-03-20 Discrete Semiconductors Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products.
  • AZ23C27Q
  • BZT52C10Q
  • BZT52C10SQ
  • BZT52C11Q
  • BZT52C11SQ
  • BZT52C12Q
  • BZT52C12SQ
  • BZT52C13LPQ
  • BZT52C13Q
  • BZT52C13SQ
  • BZT52C15LPQ
  • BZT52C15Q
  • BZT52C16LPQ
  • BZT52C16Q
  • BZT52C16SQ
  • BZT52C18Q
  • BZT52C18SQ
  • BZT52C20Q
  • BZT52C20SQ
  • BZT52C22Q
  • BZT52C24Q
  • BZT52C24SQ
  • BZT52C27Q
  • BZT52C2V4Q
  • BZT52C2V7Q
  • BZT52C2V7SQ
  • BZT52C3V0SQ
  • BZT52C3V3Q
  • BZT52C3V3SQ
  • BZT52C3V6Q
  • BZT52C3V6SQ
  • BZT52C3V9Q
  • BZT52C3V9SQ
  • BZT52C4V3Q
  • BZT52C4V3SQ
  • BZT52C4V7Q
  • BZT52C4V7SQ
  • BZT52C5V1Q
  • BZT52C5V1SQ
  • BZT52C5V6Q
  • BZT52C5V6SQ
  • BZT52C6V2Q
  • BZT52C6V2SQ
  • BZT52C6V8LPQ
  • BZT52C6V8Q
  • BZT52C7V5Q
  • BZT52C7V5SQ
  • BZT52C8V2Q
  • BZT52C8V2SQ
  • BZT52C9V1LPQ
  • BZT52C9V1Q
  • BZX84C10Q
  • BZX84C11Q
  • BZX84C12Q
  • BZX84C13Q
  • BZX84C15Q
  • BZX84C16Q
  • BZX84C18Q
  • BZX84C20Q
  • BZX84C22Q
  • BZX84C24Q
  • BZX84C27Q
  • BZX84C2V4Q
  • BZX84C2V7Q
  • BZX84C3V0Q
  • BZX84C3V3Q
  • BZX84C3V6Q
  • BZX84C3V9Q
  • BZX84C4V3Q
  • BZX84C4V7Q
  • BZX84C5V1Q
  • BZX84C5V6Q
  • BZX84C6V2Q
  • BZX84C6V8Q
  • BZX84C7V5Q
  • BZX84C8V2Q
  • BZX84C9V1Q
  • DDZ5V6ASFQ
  • DDZ9684Q
  • DDZ9685Q
  • DDZ9689Q
  • DDZ9701Q
  • DFLZ10Q
  • DFLZ11Q
  • DFLZ12Q
  • DFLZ13Q
  • DFLZ15Q
  • DFLZ16Q
  • DFLZ18Q
  • DFLZ20Q
  • DFLZ5V6Q
  • DFLZ6V2Q
  • DFLZ6V8Q
  • DFLZ7V5Q
  • DFLZ8V2Q
  • DFLZ9V1Q
  • MMBZ5221BQ
  • MMBZ5226BQ
  • MMBZ5231BQ
  • MMBZ5232BQ
  • MMBZ5235BQ
  • MMBZ5242BQ
  • MMBZ5244BQ
  • MMBZ5245BQ
  • MMBZ5245BWQ
  • MMBZ5252BQ
  • MMSZ5223BQ
  • MMSZ5225BQ
  • MMSZ5226BQ
  • MMSZ5227BQ
  • MMSZ5228BQ
  • MMSZ5229BQ
  • MMSZ5230BQ
  • MMSZ5231BQ
  • MMSZ5232BQ
  • MMSZ5232BSQ
  • MMSZ5233BQ
  • MMSZ5234BQ
  • MMSZ5235BQ
  • MMSZ5236BQ
  • MMSZ5237BQ
  • MMSZ5239BQ
  • MMSZ5240BQ
  • MMSZ5241BQ
  • MMSZ5242BQ
  • MMSZ5243BQ
  • MMSZ5245BQ
  • MMSZ5246BQ
  • MMSZ5248BQ
  • MMSZ5250BQ
  • MMSZ5251BQ
  • MMSZ5252BQ
  • MMSZ5254BQ
  • UDZ9V1BQ
PCN-2655 2023-11-06 2024-02-06 Discrete Datasheet Revision Due to Maximum IR Specification Limit Change
  • SBR15U30SP5Q
PCN-2654 2024-02-15 2024-04-28 Analog Device End of Life (EOL)
  • AH211
  • AH2985
  • AH3362Q
  • AH3363Q
  • AH3364Q
  • AH3365Q
  • AH3366Q
  • AH3367Q
  • AH3368Q
  • AH3369Q
  • AH3390Q
  • AH3391Q
  • AH3563Q
  • AH3564Q
  • AH3762Q
  • AH3763Q
  • AH3764Q
  • AH3765Q
  • AH3766Q
  • AH3767Q
  • AH3768Q
  • AH3769Q
  • AH5772
  • AH5773
  • AH5775
  • AJH266Z4
  • AJH276Z4
  • AJH277AZ4
  • AL1663RS
  • AL1663S
  • AL5892SP
  • AL8823S
  • AL9910
  • AM4406
  • AM4406F
  • AM9468
  • AM9469
  • AP131
  • AP139
  • AP1506
  • AP1603
  • AP2822A
  • AP3031
  • AP7217D
  • AP7342
  • AP7344
  • AP7346
  • AS7806A
  • AS7808A
  • AZ431L
  • PI2PCIE2412
  • PI2SSD3212
  • PI3C3125
  • PI3C3306
  • PI3CH3345
  • PI3CH400
  • PI3CH800
  • PI3USB3102
  • PI3WVR12412
  • PI4MSD5V9545A
  • PI4ULS3V302
  • PI5C3125
  • PI5C3245
  • PI5C3251
  • PI5C3253
  • PI5C3257
  • PI5C3305
  • PI5V330
  • PI5V330A
  • PI5V331
  • PI6C10810
  • PI6C485311
  • PI6C485352
  • PI6ULS5V9306
  • PI6ULS5V9511A
  • PI6ULS5V9515A
  • PI90LVT386
  • ZXBM5210
PCN-2653 2023-11-06 2024-02-06 Discrete Transer of Wafer Manufacturing Site for Select Automotive Products
  • AS1J
  • AS1M
  • DFLR1600Q
PCN-2652 2023-11-06 2024-05-06 Discrete Device End of Life (EOL)
  • 1N4736A
  • 1N4749A
  • BAS21A
  • FB230H
  • UDZS5V6B
PCN-2651 2023-11-13 2023-11-13 Analog Qualified Additional Fab Source, Assembly Test Sites, Die Revision, BOM, Datasheet, Tape and Reel Packing Quantity.
  • AH175
  • AH49F
  • AP3156
  • AP3917B
  • AP3917C
  • AP3917D
  • AP4310A
  • APX823
  • APX824
  • APX825A
  • AS324
  • AS339
  • AZ75232
  • FL
  • G23270006
  • G23270013
  • G23270015
  • G23270016
  • G23270023
  • G23270024
  • G23270025
  • PI3CH3305
  • PI3USB102E
  • PI3VT3306
  • PI6LC48C21
  • PI6LC48C51
  • PI6LC48P0101
  • PI6LC48P25104
  • PT7C4302
  • PT7C4307
  • PT7C4311
  • PT7C4337
  • PT7C4337A
  • PT7C433833A
  • PT7C4339
  • PT7C4363B
  • PT7C4372A
  • PT7C4511
  • PT7C4563B
  • US
  • ZXCT1008
PCN-2648 2023-10-19 2024-01-19 Analog Additional Wafer Source SPFAB
  • AP22816A
  • AP22816B
  • AP22817A
  • AP22817B
  • AP22818A
  • AP22818B
  • AP7315
  • AP7340
  • AP7341
PCN-2647 2023-10-12 2024-01-12 Discrete Back Metal Composition Change for Select Discrete Products
  • DMN1002UCA6
  • DMN1003UCA6
  • DMN1006UCA6
  • DMN12M3UCA6
  • DMN12M7UCA10
  • DMN12M8UCA10
  • DMN16M0UCA6
  • DMN2009UCA4
  • DMN2030UCA4
  • DMN22M5UCA10
  • DMN3006SCA6
  • DMN3008SCP10
PCN-2645 2023-09-11 2023-12-11 Discrete Datasheet Revision Due to Maximum VBSUV+ and VCCUV+ Specification Limit Change
  • DGD05463
  • DGD05473
PCN-2644 2023-09-27 2023-12-27 Discrete Lead Frame Type, Die Bond Process, Wire Bond Type and Mold Compound changes to enhance select TO-252
packaged automotive products
  • MJD31CQ
  • MJD31CUQ
  • MJD32CQ
  • MJD32CUQ
  • ZXT1053AKQ
  • ZXT690BKQ
  • ZXT951KQ
  • ZXTN4004KQ
PCN-2642 2023-09-05 2024-03-05 Analog Device End of Life (EOL)
  • AL1696
  • AL5890
  • AL8820
  • AP1501
  • AP2204
  • AP3105
  • AP3302
  • AP3983E
  • AP3983R
  • AP3987P
  • AP3987T
  • AP4306
  • AP4312
  • AP43201H
  • AP7335A
  • AP9101C
  • AP9211
  • AP9214L
  • AP9221
  • AP9234L
  • APR3415
  • APR343
  • APR34509L
  • APR34709
  • AS7805AT
  • AS7806A
  • AS7808A
  • AS7809A
  • AS7815A
  • AS7818A
  • AZ494A
  • AZ7500B
  • AZ7500E
  • LSP2008
  • LSP2015
  • LSP2031
  • PI2EQX632E
  • PI3C3125WE
  • PI3C3245
  • PI3C3384
  • PI3C3861-A
  • PI3CH1012
  • PI3CH480
  • PI3L110
  • PI3L301D
  • PI3L500-A
  • PI3L720
  • PI3USB20
  • PI3V512
  • PI3V512QE
  • PI3VT3245-A
  • PI4GTL2034
  • PI4MSD5V9543A
  • PI5C3253
  • PI5C3257
  • PI5C3384
  • PI5C3861
  • PI5USB2544
  • PI5V330S
  • PI6C2405A-1
  • PI6C2405A-1H
  • PI6C2409-1H
  • PI6CX201A
  • PI6ULS5V9511B
  • PI6ULS5V9517A
  • PI6ULS5V9517B
  • PI6ULS5V9617B
  • PI6ULS5V9627A
  • PI7C9X20505GP
  • PI7C9X20508GP
  • PT7C4302
  • PT7C4307
  • PT7C4311
  • PT7C4337AC
  • PT7C4337B
  • PT7C433833
  • PT7C433833A
  • PT7C4339
  • PT7C4363B
  • PT7C4511
  • PT7C4563B
  • PT7M7809
  • PT7M7811
  • PT7M7823S
  • PT8A2766I
  • SP6699EK
  • ZNI1000
  • ZR285
  • ZR4040-2.5
  • ZR4040-4.1
  • ZR4040-5
  • ZR431
  • ZRT025
  • ZRT040
  • ZRT050
  • ZTLV431
  • ZXRE1004
  • ZXRE330
PCN-2641 2023-09-26 2023-12-26 Discrete Lead Frame Type, Die Bond Process, Wire Bond Type and Mold Compound changes to enhance select TO-252
packaged products
  • 2DB1182Q
  • 2DB1184Q
  • DXT696BK
  • MJD31C
  • MJD32C
  • MJD340
  • MJD350
  • ZXT1053AK
  • ZXT690BK
  • ZXT790AK
  • ZXT849K
  • ZXT953K
  • ZXTN04120HK
  • ZXTN4004K
PCN-2640 2023-09-12 2024-03-13 Discrete Device End of Life (EOL) - Automotive
  • 1N4148WQ
  • 1N4148WSQ
  • BAS116Q
  • BAS16HTWQ
  • BAS16Q
  • BAV116WSQ
  • BAV170Q
  • BAV199DWQ
  • BAV199Q
  • BAV199WQ
  • BAV70Q
  • BAV70WQ
  • BAV99DWQ
  • BAV99Q
  • BAW156Q
  • BAW56DWQ
  • BAW56Q
  • BAW56WQ
  • BZT52C3V9Q
  • BZT52C5V6TQ
  • BZX84B11
  • BZX84B13
  • BZX84B15
  • BZX84B16
  • BZX84B18
  • BZX84B20
  • BZX84B2V7
  • BZX84B30
  • BZX84B33
  • BZX84B39
  • BZX84B3V0
  • BZX84B3V3
  • BZX84B4V3
  • BZX84B5V1
  • BZX84B5V6
  • BZX84B6V8
  • BZX84B7V5
  • BZX84B8V2
  • DDZ9678
  • DLD101
  • MMSZ5232B
PCN-2639 2023-09-26 2023-12-26 Discrete Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire with Standardization of Assembly Bill of Materials at CAT for Select Automotive Products
  • 2DA1201YQ
  • ADTA114EUAQ
  • ADTA143ZUAQ
  • ADTA144ECAQ
  • ADTC114ECAQ
  • ADTC114EUAQ
  • ADTC114YUAQ
  • ADTC124ECAQ
  • ADTC143TUAQ
  • ADTC143ZCAQ
  • ADTC143ZUAQ
  • ADTC144EUAQ
  • BCP5316Q
  • BCP5416Q
  • BCX5316Q
  • BCX5616Q
  • BCX6825Q
  • DMG1013TQ
  • DMG2302UQ
  • DMG2307LQ
  • DMG3401LSNQ
  • DMG3414UQ
  • DMG6602SVTQ
  • DMN2230UQ
  • DMN3135LVTQ
  • DMN6068SEQ
  • DMN63D8LDWQ
  • DMP1045UQ
  • DMP2100UQ
  • DMP6110SVTQ
  • DXT651Q
  • DXT751Q
  • FCX491AQ
  • FCX491Q
  • FCX558Q
  • FCX591AQ
  • FMMT5401Q
  • FZT491AQ
  • FZT591AQ
  • FZT851Q
  • MMST5551Q
  • MMSTA56Q
  • ZXTN07060BGQ
  • ZXTN25060BZQ
  • ZXTP01500BGQ
  • ZXTP07060BGQ
PCN-2638 2023-09-19 2023-12-19 Discrete Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site with Standardization of Assembly Bill of Materials at CAT for Select Discrete Products
  • DMP10H400SE
  • FMMT449
  • FMMT451
  • FMMT455
  • FMMT489
  • FMMT491
  • FMMT491A
  • FMMT493
  • FMMT493A
  • FMMT494
  • FMMT495
  • FMMT497
  • FMMT549
  • FMMT549A
  • FMMT551
  • FMMT555
  • FMMT589
  • FMMT591
  • FMMT591A
  • FMMT593
  • FMMT596
  • MMDT2222V
PCN-2636 2023-08-29 2023-08-29 Discrete Device End of Life (EOL)
  • 1N4001
  • 1N4002
  • 1N4003
  • 1N4004
  • 1N4005
  • 1N4006
  • 1N4007
  • 1N4148(LS)
  • 1N4148W(LS)
  • 1N4148WS(LS)
  • 1N5408
  • BAV70(LS)
  • BAV99(LS)
  • BAW56(LS)
  • DDZ2V4ASF
  • DDZ2V4BSF
  • DGD0506
  • DGD1503
  • DGD2190
  • DGD21904
  • DLPA004
  • DLPT05
  • DMF05LCFLP
  • DMT5012LFVW
  • DPD18AWF
  • DPS1035
  • DTVS3V3S1UR
  • ES1G(LS)
  • HTMN5130SSD
  • L35L12VCB2
  • L35L15VCB2
  • L35L18VCB2
  • L35L24VCB2
  • L35L3V3CB2
  • L35L5V0CB2
  • L35L8V0CB2
  • LL4148(LS)
  • PLR0524
  • SD05
  • TPD6V8LP
  • ZXMD63N03X
  • ZXTN2097F
PCN-2635 2023-08-10 2023-11-10 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products
  • SMAZ5V1
  • SMAZ5V6
PCN-2633 2023-08-16 2023-11-15 Discrete Additional Wafer Source for Select Discrete Products
  • GBJ15L06(LS)
  • GBJ25JL(LS)
  • GBU15JL(LS)
  • GBU15L06
  • GBU25JL(LS)
  • MSB30JL(LS)
  • TT6JL(LS)
  • TT8JL(LS)
PCN-2632 2023-06-13 2023-09-11 Discrete Addition of A Passivation Layer Over The Top Metal of The Die for Select BJT Products
  • DMMT5551
  • DSS5240Y
  • DSS9110Y
  • DXT2010P5
  • DXT2011P5
  • DXT2012P5
  • DXT2013P5
  • DXT2014P5
  • DXT5551P5
  • DXTP03200BP5
  • DZT5551
  • FCX605
  • FCX619
  • FCX705
  • FMMT413
  • FMMT618
  • FMMT619
  • FMMT624
  • FMMT6520
  • FMMT718
  • FMMT720
  • FZT600
  • FZT600B
  • FZT603
  • FZT605
  • FZT705
  • MMBT5401
  • MMBT5551
  • MMDT5401
  • MMST5401
  • ZDS1009
  • ZDT6702
  • ZUMT619
  • ZXGD3003E6
  • ZXT12N20DX
  • ZXT12N50DX
  • ZXT12P40DX
  • ZXT13N20DE6
  • ZXT13N50DE6
  • ZXT13P12DE6
  • ZXTC2045E6
  • ZXTN04120HK
  • ZXTN04120HP5
  • ZXTN5551FL
  • ZXTN5551G
  • ZXTP4003G
  • ZXTP4003Z
  • ZXTP5401FL
  • ZXTP5401G
PCN-2631 2023-11-07 2024-02-07 Discrete Transfer of Wafer Manufacturing Site for Select Discrete Products
  • 1N4001G
  • 1N4002G
  • 1N4003G
  • 1N4004G
  • 1N4005G
  • 1N4006G
  • 1N4007G
  • 1N5400G
  • 1N5401G
  • 1N5402G
  • 1N5404G
  • 1N5406G
  • 1N5407G
  • 1N5408G
  • 2A07G
  • ABS20M
  • ABS20MH
  • D4G
  • D5G
  • D7G
  • DF005M
  • DF005S
  • DF01M
  • DF01S
  • DF02M
  • DF02S
  • DF04M
  • DF04S
  • DF06M
  • DF06S
  • DF08M
  • DF08S
  • DF10M
  • DF10S
  • DF15005S
  • DF1501S
  • DF1502S
  • DF1504S
  • DF1506M
  • DF1506S
  • DF1508M
  • DF1508S
  • DF1510S
  • DF1512S
  • DF1514S
  • DFLR1200
  • DFLR1400
  • DFLR1600
  • FS1ME
  • FS2MD
  • FS2ME
  • GBJ10005
  • GBJ1001
  • GBJ1002
  • GBJ1004
  • GBJ1006
  • GBJ1008
  • GBJ1010
  • GBJ1502
  • GBJ1504
  • GBJ1506
  • GBJ1508
  • GBJ1510
  • GBJ15V10
  • GBJ2001
  • GBJ2002
  • GBJ2004
  • GBJ2006
  • GBJ2008
  • GBJ2010
  • GBJ25005
  • GBJ2501
  • GBJ2502
  • GBJ2504
  • GBJ2506
  • GBJ2508
  • GBJ2510
  • GBJ25KH
  • GBJ25V08
  • GBJ3506
  • GBJ3508
  • GBJ3510
  • GBJ5010
  • GBJ6005
  • GBJ601
  • GBJ602
  • GBJ604
  • GBJ606
  • GBJ608
  • GBJ610
  • GBJ801
  • GBJ802
  • GBJ804
  • GBJ806
  • GBJ808
  • GBJ810
  • GBJS3010
  • GBJS4010
  • GBL206
  • GBL208
  • GBL406
  • GBL408
  • GBL410
  • GBL610
  • GBP206
  • GBP208
  • GBP210
  • GBP306
  • GBP308
  • GBP310
  • GBP406
  • GBP406N
  • GBP408
  • GBP408N
  • GBP410
  • GBP808N
  • GBP810
  • GBU10005
  • GBU1001
  • GBU1002
  • GBU1004
  • GBU1006
  • GBU1008
  • GBU1010
  • GBU10V06
  • GBU10V08
  • GBU1506
  • GBU1508
  • GBU1510
  • GBU2508
  • GBU2510
  • GBU25KH
  • GBU3008
  • GBU30T08
  • GBU4005
  • GBU401
  • GBU402
  • GBU404
  • GBU406
  • GBU408
  • GBU410
  • GBU6005
  • GBU601
  • GBU602
  • GBU604
  • GBU606
  • GBU608
  • GBU610
  • GBU8005
  • GBU801
  • GBU802
  • GBU804
  • GBU806
  • GBU808
  • GBU810
  • HD01
  • HD02
  • HD04
  • HD06
  • HDS20M
  • KBJ1006G
  • KBJ1008G
  • KBJ1010G
  • KBJ2006G
  • KBJ2008G
  • KBJ401G
  • KBJ402G
  • KBJ404G
  • KBJ406G
  • KBJ408G
  • KBJ410G
  • KBJ601G
  • KBJ604G
  • KBJ606G
  • KBJ608G
  • KBJ610G
  • KBP005G
  • KBP01G
  • KBP02G
  • KBP04G
  • KBP06G
  • KBP08G
  • KBP10G
  • KBP2005G
  • KBP201G
  • KBP202G
  • KBP204G
  • KBP206G
  • KBP208G
  • KBP210G
  • KBP304G
  • KBP306G
  • KBP308G
  • KBP310G
  • KBP404G
  • KBP406G
  • KBP408G
  • KBP410G
  • LT2A07G
  • MSB15M
  • MSB15MH
  • MSB20M
  • MSB22M.
  • MSB25MH
  • MSB30KH
  • MSB30M
  • PDR3G
  • PDR5G
  • S10JC
  • S10KC
  • S10MC
  • S1A
  • S1AB
  • S1B
  • S1BB
  • S1D
  • S1DB
  • S1G
  • S1GB
  • S1J
  • S1JB
  • S1K
  • S1KB
  • S1M
  • S1MB
  • S2A
  • S2AA
  • S2B
  • S2BA
  • S2D
  • S2DA
  • S2G
  • S2GA
  • S2J
  • S2JA
  • S2K
  • S2KA
  • S2M
  • S2MA
  • S2MH
  • S2MHA
  • S3A
  • S3AB
  • S3B
  • S3BB
  • S3D
  • S3DB
  • S3G
  • S3GB
  • S3J
  • S3JB
  • S3K
  • S3KB
  • S3M
  • S3MB
  • S5AC
  • S5BC
  • S5DC
  • S5GC
  • S5JB
  • S5JC
  • S5KB
  • S5KC
  • S5MB
  • S5MC
  • S8JC
  • S8KC
  • S8MC
  • TT10M
  • TT2M
  • TT3M
  • TT410
  • TT4M
  • TT4V10
  • TT6M
  • TT8M
PCN-2630 2024-02-20 2024-05-20 Discrete Semiconductors Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness for Select
Products
  • BZT52C10LP
  • BZT52C11LP
  • BZT52C12LP
  • BZT52C13LP
  • BZT52C15LP
  • BZT52C16LP
  • BZT52C18LP
  • BZT52C20LP
  • BZT52C22LP
  • BZT52C24LP
  • BZT52C2V4LP
  • BZT52C2V7LP
  • BZT52C36LP
  • BZT52C39LP
  • BZT52C3V0LP
  • BZT52C3V3LP
  • BZT52C3V6LP
  • BZT52C3V9LP
  • BZT52C4V3LP
  • BZT52C4V7LP
  • BZT52C5V1LP
  • BZT52C5V6LP
  • BZT52C6V2LP
  • BZT52C6V8LP
  • BZT52C7V5LP
  • BZT52C8V2LP
  • BZT52C9V1LP
  • BZX84C15
  • DDZ36BSF
  • DDZ4V7BSF
  • DDZ5V6ASF
  • DDZ5V6CSF
  • DDZ6V8ASF
  • DFLT10A
  • DFLT11A
  • DFLT12A
  • DFLT13A
  • DFLT14A
  • DFLT15A
  • DFLT16A
  • DFLT17A
  • DFLT18A
  • DFLT20A
  • DFLT22A
  • DFLT24A
  • DFLT5V0A
  • DFLT6V0A
  • DFLT6V5A
  • DFLT7V0A
  • DFLT7V5A
  • DFLT8V5A
  • DFLT9V0A
  • DFLZ10
  • DFLZ11
  • DFLZ12
  • DFLZ13
  • DFLZ15
  • DFLZ16
  • DFLZ18
  • DFLZ20
  • DFLZ5V6
  • DFLZ6V2
  • DFLZ6V8
  • DFLZ7V5
  • DFLZ8V2
  • DFLZ9V1
  • GDZ10LP3
  • GDZ11LP3
  • GDZ12LP3
  • GDZ13LP3
  • GDZ15LP3
  • GDZ18LP3
  • GDZ20LP3
  • GDZ22LP3
  • GDZ24LP3
  • GDZ5V1LP3
  • GDZ5V6LP3
  • GDZ6V0LP3
  • GDZ6V2LP3
  • GDZ6V8LP3
  • GDZ7V5LP3
  • GDZ8V2LP3
  • GDZ9V1LP3
PCN-2629 2023-05-15 2023-11-15 Discrete Device End of Life (EOL) - Automotive
  • AS1A
  • AS1B
  • AS1D
  • AS1G
  • AS1K
  • B240AQ
  • B260Q
  • BAS521Q
  • DFLS160Q
  • PDS560Q
  • ZHCS506Q
PCN-2628 2023-05-11 2023-08-11 Discrete Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products
  • DMN22M5UFG
  • DMN3012LEG
  • DMN3013LDG
  • DMN3013LFG
  • DMN3022LDG
  • DMN3022LFG
  • DMP2002UPS
  • DMP2004UFG
  • DMP2005UFG
  • DMP3007SFG
  • DMP32M6SPS
  • DMT10H003SPSW
  • DMT10H009LFG
  • DMT10H015LFG
  • DMT10H017LPD
  • DMT3002LPS
  • DMT3003LFG
  • DMT31M6LPS
  • DMT32M4LFG
  • DMT32M4LPSW
  • DMT32M5LFG
  • DMT4002LPS
  • DMT6002LPS
  • DMT6005LFG
  • DMT6007LFG
  • DMT61M5SPSW
  • DMT8008LFG
  • DMTH10H003SPSW
  • DMTH3002LPS
  • DMTH41M8SPS
  • DMTH43M8LFG
  • DMTH45M5LPDW
  • DMTH45M5LPSW
  • DMTH45M5SPDW
  • DMTH45M5SPSW
  • DMTH6002LPS
  • DMTH6005LFG
  • DMTH61M5SPSW
  • DMTH62M8LPS
  • DMTH62M8SPS
  • DMTH8003SPS
  • DMTH8008LFG
  • DMTH8008SFG
PCN-2624 2023-05-31 2023-08-29 Analog Qualification of Additional Assembly Test Site CAT – Automotive
  • AZ9431BQ
  • SE555Q
PCN-2623 2023-05-15 2023-11-15 Discrete Device End of Life (EOL)
  • 1N4148
  • B0520LW
  • B0520WS
  • B0530W
  • B0530WS
  • B0540W
  • B0540WS
  • B1100
  • B1100B
  • B1100LB
  • B120
  • B130
  • B130L
  • B130LAW
  • B130LB
  • B140WS
  • B150
  • B160
  • B160B
  • B160S1F
  • B170
  • B170B
  • B180
  • B180B
  • B2100
  • B2100A
  • B2100AE
  • B220
  • B220A
  • B230
  • B230A
  • B240
  • B240A
  • B240AE
  • B240AF
  • B240LA
  • B240S1F
  • B250
  • B250A
  • B260
  • B260A
  • B260AE
  • B290
  • B3100B
  • B3100BE
  • B320A
  • B320AE
  • B320AF
  • B320B
  • B330
  • B330A
  • B330B
  • B340
  • B340A
  • B340AF
  • B340B
  • B340CE
  • B340LA
  • B340LB
  • B350
  • B350B
  • B360
  • B360A
  • B360AE
  • B360AF
  • B360AM
  • B360B
  • B370
  • B380
  • B380B
  • B3L30LP
  • B520C
  • B530C
  • B540C
  • B550C
  • B560C
  • BAS40
  • BAS40BRW
  • BAS40DW
  • BAS40LP
  • BAS40TW
  • BAS40W
  • BAT1000
  • BAT400D
  • BAT46W
  • BAT54
  • BAT54A
  • BAT54ATA
  • BAT54AW
  • BAT54CDW
  • BAT54CTA
  • BAT54CW
  • BAT54JW
  • BAT54LP
  • BAT54S
  • BAT54SDW
  • BAT54ST
  • BAT54STA
  • BAT54SW
  • BAT54T
  • BAT54TW
  • BAT54V
  • BAT54W
  • BAT54WS
  • BAT54WT
  • BAT750
  • BAT760
  • BAV99BRLP
  • DFLS1100
  • DFLS1150
  • DFLS1200
  • DFLS120L
  • DFLS140L
  • DFLS160
  • DFLS2100
  • DFLS230L
  • DFLS260
  • DML3010LFDS
  • DML3011LFDS
  • DMP1070UCA3
  • MBR0580S1
  • MBR2045CT
  • MBR2045CTF
  • MBR2060CT
  • MBR2060CTF
  • MBR230S1F
  • MBR3045CT
  • MBR3045CTF
  • PD3S120L
  • PD3S130H
  • PD3S130L
  • PD3S140
  • PD3S160
  • PD3S220L
  • PD3S230H
  • PD3S230L
  • PDS1040
  • PDS1040L
  • PDS1045
  • PDS3100
  • PDS3200
  • PDS340
  • PDS360
  • PDS4150
  • PDS4200H
  • PDS5100
  • PDS5100H
  • PDS760
  • SB380
  • SBR10100CTL
  • SBR10200CTFP
  • SBR1045CTL
  • SBR12A45SD1
  • SBR12E45LH1
  • SBR15300D1
  • SBR15U100CTL
  • SBR20B100CT
  • SBR20E120CT
  • SBR30A100CT
  • SBR30A40CT
  • SBR30E100CT
  • SBR30E45CT
  • SBR30E45CTB
  • SBR30S30CT
  • SBR40S45CT
  • SBR40U100CT
  • SBR40U120CT
  • SBR40U150CT
  • SBR40U45CT
  • SBR40U60CT
  • SBR40U60CTE
  • SBR60A150CT
  • SBR60A300CT
  • SBR60A60CT
  • SBR6100CTL
  • SBR8A45SP5
  • SBR8U60P5
  • SD103ASDM
  • SD103ATW
  • SD103AW
  • SD103AWS
  • SD103BW
  • SD103BWS
  • SD103CW
  • SDM01U50CP3
  • SDM02M30LP3
  • SDM02U30LP3
  • SDM100K30L
  • SDM1100LP
  • SDM1100S1F
  • SDM160S1F
  • SDM1A40LP8
  • SDM20E40C
  • SDM20U30
  • SDM20U30LP
  • SDM2100S1F
  • SDM40E20LA
  • SDM40E20LC
  • SDM40E20LS
  • SDT15B150LP5
  • ZHCS1000TA
  • ZHCS2000TA
  • ZHCS350TA
  • ZHCS400TA
  • ZHCS500TA
  • ZHCS506TA
  • ZHCS750TA
  • ZLLS1000TA
  • ZLLS2000TA
  • ZLLS350TA
  • ZLLS400TA
  • ZLLS400TC
  • ZLLS410TA
  • ZXT11N15DFTA
  • ZXT11N20DFTA
PCN-2622 2023-04-07 2023-07-07 Analog Qualified Additional Assembly/Test (A/T) Site
  • US2500010
PCN-2620 2023-05-10 2023-08-10 Discrete Qualification of Additional Wafer Source and Additional Assembly and Test Site for Select Discrete Products
  • KBJL1010
PCN-2619 2023-04-12 2023-07-12 Discrete Automotive Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
  • P6SMAJ12ADFQ
  • P6SMAJ15ADFQ
  • P6SMAJ18ADFQ
  • P6SMAJ22ADFQ
  • P6SMAJ24ADFQ
  • P6SMAJ26ADFQ
  • P6SMAJ28ADFQ
  • P6SMAJ30ADFQ
  • P6SMAJ36ADFQ
  • P6SMAJ43ADFQ
  • P6SMAJ5.0ADFQ
  • P6SMAJ6.0ADFQ
  • P6SMAJ64ADFQ
  • P6SMAJ7.5ADFQ
  • RS1JDFQ
  • RS1MDFQ
  • S1MDFQ
  • S2KDFQ
  • S8MCQ
  • SBR545SAFQ
  • US1DWFQ
  • US1JDFQ
  • US1MDFQ
  • US2JDFQ
PCN-2618 2023-03-03 2023-06-03 Discrete Automotive Qualification of Additional Wafer Source, Lead Frame Structure, and Mold Compound Type Changes for Select Discrete Automotive Products
  • SBR02U100LPQ
  • SBR0560S1Q
  • SBR1045CTLQ
  • SBR1045D1Q
  • SBR1045SP5Q
  • SBR10A45SP5Q
  • SBR10U200P5Q
  • SBR10U45D1Q
  • SBR10U45SP5Q
  • SBR12U100P5Q
  • SBR15U100CTLQ
  • SBR20M45D1Q
  • SBR2A40P1Q
  • SBR3045CTBQ
  • SBR30A45CTBQ
  • SBR30A60CTBQ
  • SBR3U40P1Q
  • SBR3U60P1Q
  • SBR6100CTLQ
  • SBR660CTLQ
  • SBR8U60P5Q
PCN-2617 2023-05-03 2023-08-03 Discrete Addition of a Polyimide Wafer Coating Layer and Enhanced ESD Structure for DMP10H4D2S Products
  • DMP10H4D2S
PCN-2616 2023-06-02 2023-08-31 Discrete Automotive Addition of A Passivation Layer Over The Top Metal of The Die for Select Automotive BJT Products - Automotive
  • ZXTN07060BG
  • ZXTN2080GQ
  • ZXTP07060BGQ
PCN-2615 2023-02-02 2023-05-02 Discrete Automotive Datasheet Revision Due to Maximum VBE(on) Specification Limit Change - Automotive
  • BC847BVNQ
  • BC847PNQ
  • BC847PNQ-
PCN-2614 2023-02-23 2023-08-23 Discrete Automotive Device End of Life (EOL) - Automotive
  • 2DD1766Q
  • BAV3004WQ
  • BAV3004WSQ
  • MMBD3004CQ
  • MMBD3004SQ
  • ZTX550Q
PCN-2613 2023-04-12 2023-07-12 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products
  • B120AF
  • B130AF
  • B140AF
  • B150AF
  • B160AF
  • B2100AF
  • B220AF
  • B230AF
  • B240AF
  • B245AF
  • B250AF
  • B260AF
  • B320AF
  • B330AF
  • B340AF
  • B340AXF
  • B345AF
  • B350AF
  • B360AF
  • HS1DDF
  • P4SMAJ10ADF
  • P4SMAJ11ADF
  • P4SMAJ12ADF
  • P4SMAJ13ADF
  • P4SMAJ14ADF
  • P4SMAJ15ADF
  • P4SMAJ16ADF
  • P4SMAJ17ADF
  • P4SMAJ18ADF
  • P4SMAJ20ADF
  • P4SMAJ22ADF
  • P4SMAJ24ADF
  • P4SMAJ26ADF
  • P4SMAJ28ADF
  • P4SMAJ30ADF
  • P4SMAJ33ADF
  • P4SMAJ36ADF
  • P4SMAJ5.0ADF
  • P4SMAJ54ADF
  • P4SMAJ6.0ADF
  • P4SMAJ6.5ADF
  • P4SMAJ60ADF
  • P4SMAJ64ADF
  • P4SMAJ7.0ADF
  • P4SMAJ7.5ADF
  • P4SMAJ70ADF
  • P4SMAJ8.0ADF
  • P4SMAJ8.5ADF
  • P4SMAJ85ADF
  • P4SMAJ9.0ADF
  • P6SMAJ12ADF
  • P6SMAJ14ADF
  • P6SMAJ15ADF
  • P6SMAJ18ADF
  • P6SMAJ20ADF
  • P6SMAJ24ADF
  • P6SMAJ28ADF
  • P6SMAJ30ADF
  • P6SMAJ36ADF
  • P6SMAJ5.0ADF
  • P6SMAJ54ADF
  • P6SMAJ58ADF
  • RS1JDF
  • RS1MDF
  • S1MDF
  • S2KDF
  • SBR2M100SAF
  • SBR3A40SAF
  • SBR3M100SAF
  • SBR545SAF
  • SBRT3U45SAF
  • SBRT3U60SAF
  • SBRT5A50SAF
  • SDT3A45SAF
  • SDT5A100SAF
  • SDT5A50SAF
  • SDT5A60SAF
  • SF1DDF
  • SF1GDF
  • SF1JDF
  • SF2DDF
  • SF2JDF
PCN-2612 2023-03-21 2023-06-21 Analog Automotive Change to Tape and Reel Packing Quantity - Automotive
  • HX53C5002Q
  • HX73C5001Q
  • HX73F6201Q
  • LDA000010Q
  • LDC500014Q
  • NX52F6209Q
  • NX52N3201Q
  • NX5350008Q
  • NX5350A01Q
  • NX53F6203Q
  • NX53Q6601Q
  • NX7250002Q
  • NX72F6207Q
  • NX73U0001Q
  • NX76F6201Q
  • NX76R0001Q
  • PB2500021Q
  • PB5000033Q
  • PD5000010Q
  • PX5000021Q
PCN-2611 2023-04-03 2023-07-03 Analog Qualified Additional Assembly Test Sites, Die Revision and Tape and Reel Packing Quantity.
  • AH1892
  • AH1898
  • AH3712
  • AH3713
  • AH3714
  • AH3715
  • AS78L05
  • AS78L12
  • AS78L15
  • AZ431-A
  • AZ431-B
  • HX
  • LD
  • LN
  • NX
  • PB
  • PD
  • PF
  • PN
  • PX
  • RX
  • S2692
  • SDS3833B
  • SEL3833B
  • SN
  • SP
  • SQ
  • UF
  • UV
  • UX
  • WF
PCN-2610 2023-03-30 2023-09-30 Analog Device End of Life (EOL)
  • AH1751
  • AL1697
  • AL1781
  • AL1782
  • AP3031
  • AP7366
  • APX803
  • FK
  • FM
  • FN
  • HX
  • LX
  • NX
  • PB
  • PK
  • S1613A
  • S1613AA
  • S1613B
  • S1613E
  • S1803E
  • SEL3833B
  • SN
  • SX
  • UF
  • UX
  • WF
  • WX
PCN-2609 2023-02-02 2023-05-02 Discrete Datasheet Revision Due to Maximum VBE(on) Specification Limit Change
  • BC847BVN
  • BC847PN
PCN-2608 2023-01-24 2023-04-24 Discrete Automotive Qualification of Additional Wafer Source - Automotive
  • S1MSWFQ
PCN-2607 2023-02-22 2023-08-22 Discrete Device End of Life (EOL)
  • 1N4448W(LS)
  • 1N4937(LS)
  • 1SS355(LS)
  • 2DD1766P
  • 2DD1766R
  • 2DD2656
  • BAS21C(LS)
  • BAS21S(LS)
  • BAV21W(LS)
  • BAV3004W
  • BAV3004WS
  • BAV70W(LS)
  • BAV99W(LS)
  • BAW101V(LS)
  • BC858A
  • BC858AW
  • D5V0Q1B2CSP
  • DESD5V0V1BCSP
  • DGD0590FU
  • DMJ70H1D3SK3
  • DMJ70H1D4SJ3
  • DMJ70H600HCT
  • DMJ70H600HCTI
  • DMJ70H600HK3
  • DMT5015LFDF
  • LS4148W(LS)
  • LS4148WS(LS)
  • LS4148WT(LS)
  • LS4448W(LS)
  • LZ52C10W(LS)
  • LZ52C12W(LS)
  • LZ52C13W(LS)
  • LZ52C15W(LS)
  • LZ52C15WS(LS)
  • LZ52C16W(LS)
  • LZ52C16WS(LS)
  • LZ52C18W(LS)
  • LZ52C18WS(LS)
  • LZ52C20W(LS)
  • LZ52C22W(LS)
  • LZ52C24W(LS)
  • LZ52C27W(LS)
  • LZ52C27WS(LS)
  • LZ52C30W(LS)
  • LZ52C30WS(LS)
  • LZ52C33W(LS)
  • LZ52C36W(LS)
  • LZ52C36WS(LS)
  • LZ52C3V3W(LS)
  • LZ52C3V6W(LS)
  • LZ52C4V3W(LS)
  • LZ52C4V7W(LS)
  • LZ52C5V1W(LS)
  • LZ52C5V1WS(LS)
  • LZ52C5V6W(LS)
  • LZ52C5V6WS(LS)
  • LZ52C6V2W(LS)
  • LZ52C6V8W(LS)
  • LZ52C7V5W(LS)
  • LZ52C9V1W(LS)
  • LZ55C8V2WS(LS)
  • MBR1040(LS)
  • MBR1060(LS)
  • MMBD3004A
  • MMBD3004BRM
  • MMBD3004C
  • MMBD3004S
  • MMDT3946FL3
  • S1MWF
  • UF1003(LS)
  • ZTX550
  • ZTX550STZ
  • ZXGD3101T8TA
PCN-2606 2023-03-10 2023-06-10 Discrete Change TO263AB Carrier Tape Pitch for Select Discrete Products
  • MBRB10100CT
  • MBRB10200CT
  • MBRB20100CT
  • MBRB20150CT
  • MBRB20200CT
PCN-2605 2023-03-09 2023-06-09 Analog Qualified Additional Cu Pillar Bump Site and Bill of Materials (BOM) Lead Frame Material
  • AP61100
  • AP61102
  • AP61200
  • AP61201
  • AP61202
  • AP61203
  • AP61300
  • AP61302
  • AP62150
  • AP62200
  • AP62201
  • AP62250
  • AP62300
  • AP62301
  • AP62500
  • AP62600
  • AP62800
  • AP63200
  • AP63201
  • AP63203
  • AP63205
  • AP63300
  • AP63301
  • AP63356
  • AP63357
PCN-2603 2023-03-20 2023-06-20 Analog Qualified Additional Wafer Fab Source (SFAB2/JKFAB), Die Revision, Bill of Material
  • AL1665S
  • AL1666S
  • AP2213
  • AP3036B
  • AP39811
  • AP3981B
  • AP3987
  • AP3987CT
  • AP3987H
  • AP3987V
  • GP
  • PI5A121BCE
  • PI5A3167C
  • PT7M3808
  • PT7M7809