歡迎訪問我們2016年的產品/制程變更通知（PCN）頁面。要查找PCN，請從本頁功能表中選擇年份。
每個 PCN 皆提供聯絡人與實施日期、提醒類別與類型、PCN 號碼、標題、影響、變更說明，以及 Diodes 所製造且受到產品/製程變更之影響的完整元件清單。若要檢視 PCN，請按一下 PCN# PDF。
| PCN # | Issue Date | Implementation Date | Product Family | Change Type |
|---|---|---|---|---|
| PCN-2556 | 2021-11-22 | 2022-05-22 | Discrete | Device End of Life (EOL) |
| PCN-2555 | 2021-11-11 | 2022-05-11 | Analog | Device End of Life (EOL) |
| PCN-2554 | 2021-11-15 | 2022-02-15 | Analog Semiconductors | Qualified Additional Assembly & Test (A/T) Sites, Bill of Material (BOM) and updated Data Sheets for Package Outline Dimension Change |
| PCN-2553 | 2021-11-12 | 2022-02-12 | Discrete Semiconductors | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site with Standardization of Assembly Bill of Materials at CAT for Select Discrete Products |
| PCN-2552 | 2021-12-15 | 2021-12-15 | Discrete | Add Product Ordering Information on Device Data Sheets for Select Lite-On Semiconductor (LSC) Brand Products |
| PCN-2551 | 2021-11-10 | 2022-05-10 | Discrete | Device End of Life (EOL) |
| PCN-2550 | 2021-12-20 | 2022-06-20 | Discrete | Device End of Life (EOL) |
| PCN-2549 | 2021-10-19 | 2022-04-19 | Discrete | Device End of Life (EOL) |
| PCN-2548 | 2021-10-08 | 2022-01-08 | Analog Semiconductors | Additional Wafer Source (JKFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Assembly/Test (A/T) Site (CAT) |
| PCN-2546 | 2021-09-23 | 2021-12-23 | Discrete | Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan for Select Lite-On Semiconductor (LSC) Brand Automotive Products. |
| PCN-2545 | 2021-10-05 | 2022-01-05 | Discrete - Automotive | Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products |
| PCN-2544 | 2021-10-05 | 2022-01-05 | Discrete | Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Products |
| PCN-2543 | 2021-08-30 | 2021-11-30 | Discrete | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products in SMA Package |
| PCN-2542 | 2021-08-30 | 2021-11-30 | Discrete | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |
| PCN-2540 | 2021-08-08 | 2021-11-08 | Analog Semiconductors | Qualified Additional Fab Site, Assembly/Test (A/T) Sites, Bill of Material (BOM) and updated Device Data Sheets |
| PCN-2539 | 2021-09-09 | 2022-03-09 | Analog | Device End of Life (EOL) |
| PCN-2536 | 2021-08-06 | 2021-08-06 | Discrete | Device End of Life (EOL) |
| PCN-2534 | 2021-07-29 | 2021-10-29 | Analog Semiconductors | Qualified Additional BUMP Site (LBS) and Assembly/Test (A/T) Site (CAT) |
| PCN-2533 | 2021-09-02 | 2022-03-02 | Discrete | Device End of Life (EOL) |
| PCN-2532 | 2021-10-04 | 2022-01-04 | Discrete | Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) on Select Automotive Products |
| PCN-2531 | 2021-07-30 | 2022-01-29 | Analog | Additional Die Revision, Redistribution Layer (RDL), BUMP Sites (SJSEMI and LBS), as well as Assembly/Test (A/T) Site (CAT) |
| PCN-2530 | 2021-09-03 | 2021-12-03 | Discrete | Addition of a Passivation Layer Over the Top Metal of the Die for Select Lite-On Semiconductor (LSC) Brand Products |
| PCN-2529 | 2021-06-01 | 2021-06-01 | Discrete and Analog | Conversion to Diodes Incorporated standard product labels and shipping boxes for products currently using Lite-On Semiconductor product labels and boxes. |
| PCN-2528 | 2021-07-20 | 2021-10-15 | Discrete | Device End of Life (EOL) |
| PCN-2527 | 2021-06-09 | 2021-09-09 | Analog Semiconductors | Additional Wafer Source (GFAB, JKFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Additional Assembly/Test (A/T) Site (CAT) |
| PCN-2526 | 2021-06-09 | 2021-09-09 | Analog Semiconductors - Automotive | Additional Wafer Source (GFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Additional Assembly/Test Site (CAT) |
| PCN-2524 | 2021-10-04 | 2022-01-04 | Discrete | Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) and Qualification of Yea Shin Technology Co., Ltd. as Additional Wafer Source on Select Products |
| PCN-2522 | 2021-08-24 | 2021-11-24 | Discrete Semiconductors | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products |
| PCN-2521 | 2021-05-27 | 2021-08-27 | Analog Semiconductors - Automotive | Qualified Additional Bill of Materials (BOM) - Automotive |
| PCN-2520 | 2021-05-27 | 2021-08-27 | Analog Semiconductors | Qualified Additional Bump Site and Assembly/Test (A/T) Sites |
| PCN-2519 | 2021-05-20 | 2021-11-20 | Analog | Device End of Life (EOL) |
| PCN-2518 | 2021-06-29 | 2021-09-29 | Discrete Semiconductors | Qualification of Additional Diodes Internal Assembly & Test (A/T) Site (SAT) |
| PCN-2517 | 2021-05-24 | 2020-11-24 | Discrete | Device End of Life (EOL) |
| PCN-2514 | 2021-03-09 | 2021-06-09 | Analog | Additional Wafer Source JKFAB |
| PCN-2513 | 2021-03-08 | 2021-06-08 | Analog - Automotive | Additional Wafer Source GFAB - Automotive |
| PCN-2512 | 2021-04-16 | 2021-07-16 | Analog Semiconductors | Qualified Additional Assembly & Test (A/T) Site |
| PCN-2511 | 2021-09-13 | 2021-12-13 | Discrete | Wafer Diameter Change from 3 inch to 4 inch at Diodes Shanghai Seefull Electronic Co., Ltd. (SSEC FAB) on Select Products |
| PCN-2510 | 2021-02-26 | 2021-05-26 | Analog Semiconductors | Qualified Additional A/T Sites, Fab Site and Data Sheet Change |
| PCN-2509 | 2021-02-09 | 2021-05-09 | Analog Semiconductors (Automotive) | Qualified Additional FL Series Package (Automotive) |
| PCN-2508 | 2021-03-17 | 2021-03-18 | Discrete | Change Date Code Marking Information from “YM” (Year/Month) to “YW” (Year/Week) |
| PCN-2507 | 2021-02-03 | 2021-05-03 | Discrete and Analog Semiconductors | Qualification of Additional Wafer Backside Material Supplier |
| PCN-2506 | 2021-02-09 | 2021-05-09 | Analog Semiconductors | Qualified Additional FL Series Package |
| PCN-2505 | 2021-01-26 | 2021-07-26 | Analog | Device End of Life (EOL) |
| PCN-2502 | 2021-03-15 | 2021-09-15 | Discrete | Device End of Life (EOL) |
| PCN-2501 | 2021-01-13 | 2021-04-13 | Analog Semiconductors | Qualified Additional A/T Sites |
| PCN-2500 | 2021-03-24 | 2021-06-24 | Discrete Semiconductors | Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for Automotive Products |
| PCN-2499 | 2021-06-23 | 2021-09-23 | Discrete Products | Change DBF Package Outline Dimensions for Select Products |
| PCN-2498 | 2021-04-07 | 2021-04-07 | Discrete | Qualification of Additional Wafer Source, and Additional Assembly and Test (A/T) Site for Select Discrete Products |
| PCN-2495 | 2021-03-31 | 2021-07-01 | Discrete Semiconductors | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2493 | 2020-12-28 | 2021-03-28 | Analog Semiconductors | Qualified Additional A/T Sites and Bill of Materials (BOM) |
