歡迎訪問我們2016年的產品/制程變更通知（PCN）頁面。要查找PCN，請從本頁功能表中選擇年份。
每個 PCN 皆提供聯絡人與實施日期、提醒類別與類型、PCN 號碼、標題、影響、變更說明，以及 Diodes 所製造且受到產品/製程變更之影響的完整元件清單。若要檢視 PCN，請按一下 PCN# PDF。
| PCN # | Issue Date | Implementation Date | Product Family | Change Type |
|---|---|---|---|---|
| PCN-2417 | 2019-04-24 | 2019-07-24 | Analog Semiconductors | Additional Qualified (A/T) Assembly/Test Site |
| PCN-2415 | 2019-06-28 | 2019-12-28 | Analog | Device End of Life (EOL) |
| PCN-2411 | 2019-05-24 | 2019-11-24 | Analog | Device End of Life (EOL) |
| PCN-2408 | 2019-10-02 | 2020-01-02 | Analog Semiconductors | Additional Qualified (AT) Assembly Test Site + BOM + Top Marking |
| PCN-2404 | 2019-05-21 | 2019-08-21 | Discrete Automotive Semiconductors | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Automotive Products |
| PCN-2403 | 2019-03-25 | 2019-06-19 | Discrete Semiconductors | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products. |
| PCN-2402 | 2019-05-15 | 2019-08-15 | Discrete Semiconductors | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site and Conversion to Palladium Coated Copper Bond Wire with New Lead Frame Type on Select Products |
| PCN-2401 | 2019-01-30 | 2019-07-30 | Analog | Device End of Life (EOL) |
| PCN-2400 | 2019-05-20 | 2019-08-20 | Analog Semiconductors | Additional Qualified (AT) Assembly Test Site |
| PCN-2399 | 2019-06-19 | 2019-09-19 | Analog Semiconductors | Additional Qualified (AT) Assembly/Test Site & Package Supplier |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Discrete Semiconductors | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2394 | 2018-12-20 | 2019-03-20 | Discrete | Qualification of Additional Wafer Sources and Additional Assembly and Test Site for Select Products |
| PCN-2393 | 2019-01-24 | 2019-04-24 | Discrete Semiconductor | Metal Mask Change for select Discrete devices to quantify Turn-On Time |
| PCN-2391 | 2019-05-24 | 2019-08-24 | Automotive Discrete Products | Clip Bond Structure, Lead Frame Type, and Mold Compound changes to enhance PowerDI-123 package |
| PCN-2389 | 2019-02-05 | 2019-08-05 | Discrete | Device End of Life |
| PCN-2386 | 2019-04-17 | 2019-07-17 | Discrete - Automotive | Addition of A Passivation Layer Over The Top Metal of The Die for Select Automotive MOSFET Products |
| PCN-2383 | 2018-11-19 | 2019-02-19 | Discrete | Metal Mask Change for DPS1133FIA-13, and Datasheet Revision Due to IQ (Quiescent Current) Specification Limits Change |
| PCN-2382 | 2018-10-17 | 2019-01-17 | Discrete Semiconductors - Automotive | Qualification of Additional Assembly and Test (A/T) site, Conversion to Palladium Coated Copper Bond Wire with Modified Top Metal Composition and Thickness, New Lead Frame Type, New Die Attach Material and New Molding Compound for Part Numbers BCP5616QTA and BCP5616QTC |
| PCN-2381 | 2018-10-25 | 2019-01-25 | Analog | Qualification of Additional FAB & A/T Source, and/or Bill of Materials (BOM) for Select Products |
| PCN-2380 | 2018-11-07 | 2019-05-07 | Analog | Device End of Life (EOL) |
| PCN-2379 | 2018-11-29 | 2019-02-28 | Discrete | Additional qualified suppliers for solderable front metal and back grind/back metal |
| PCN-2376 | 2018-11-30 | 2019-03-01 | Discrete | Addition of A Passivation Layer Over The Top Metal of The Die |
| PCN-2374 | 2018-12-07 | 2019-03-07 | Discrete Semiconductors | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Conversion to Palladium Coated Copper Bond Wire with New Molding Compound, and Qualification of Alternative Die Source on Select Products |
| PCN-2369 | 2019-01-29 | 2019-04-29 | Discrete Semiconductors | Qualification of JCET as an Additional Assembly & Test Site for Select Discrete TVS Products in DFN2510 Package |
| PCN-2366 | 2018-09-19 | 2018-12-19 | Analog | Qualification of Additional Bill of Materials (BOM), Fab Source, A/T Site and Top Marking Change on Select Product |
| PCN-2365 | 2018-10-04 | 2019-04-04 | Analog - Automotive | Device End of Life (EOL) – Automotive Parts |
| PCN-2364 | 2018-10-04 | 2019-04-04 | Analog | Device End of Life (EOL) |
| PCN-2361 | 2018-07-02 | 2018-10-02 | Analog | Qualification of Alternate Wafer Source (SFAB2) for Select Analog Products |
| PCN-2360 | 2018-06-29 | 2018-09-29 | Discrete Semiconductors | Qualification of Additional Wafer Source for Select TVS Products |
| PCN-2358 | 2018-06-28 | 2018-09-28 | Analog | Qualification of Alternate Wafer Source (SFAB2) for Select Analog Products |
| PCN-2353 | 2018-06-12 | 2018-09-12 | Analog | Qualification of Alternate Wafer Source for MOSFET Die used in Select Analog Products |
| PCN-2348 | 2018-07-19 | 2018-10-19 | Analog Semiconductors | Additional Qualified Assembly/Test (A/T) Site for Select Devices |
| PCN-2347 | 2018-05-22 | 2018-11-22 | Discrete | Device End of Life (EOL) |
| PCN-2345 | 2018-05-29 | 2018-11-29 | Discrete - Automotive | Device End of Life (EOL) |
| PCN-2344 INFORMATIONAL | 2018-05-24 | 2018-06-24 | Discrete | Carrier tape orientation |
| PCN-2343 | 2018-05-15 | 2018-08-15 | Analog | Qualification of Additional Bill of Materials (BOM), Fab Source for Select Products with Top Marking Change on Select Product |
| PCN-2342 | 2018-05-31 | 2018-11-30 | Analog | Device End of Life (EOL) |
| PCN-2341 | 2019-02-27 | 2019-05-27 | Discrete | Qualification of Additional Wafer Source for Select Automotive Products |
| PCN-2340 | 2018-04-26 | 2018-05-26 | Discrete | Qualification of Alternate Wafer Sources for Select MOSFET Products |
| PCN-2339 | 2018-06-15 | 2018-09-15 | Discrete | Qualification of Additional Wafer Source for Select Products |
| PCN-2337 | 2018-06-04 | 2018-05-04 | Discrete | Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products |
| PCN-2336 | 2018-05-24 | 2018-11-24 | Analog | Device End of Life (EOL) |
| PCN-2335 | 2018-09-12 | 2019-03-12 | Analog | Device End of Life (EOL) |
| PCN-2331 | 2018-03-22 | 2018-06-22 | Analog Semiconductors | Additional Qualified BOM (Bill of Materials) on Selected Devices |
| PCN-2330 | 2018-03-29 | 2018-07-29 | Discrete Semiconductors | Qualification of Additional A/T site and Conversion to Palladium Coated Copper Bond Wire on Select Discrete Products |
| PCN-2328 | 2018-04-12 | 2018-10-12 | Analog | Device End of Life for tray packaging only |
| PCN-2327 (Advance Notice) | 2018-04-20 | 2020-11-11 | Analog | Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and Bond Wire Change |
| PCN-2326 - Rev 3 (Interim Update) | 2018-04-20 | 2020-12-30 | Analog | Fab Porting from Global Foundries to MagnaChip |
| PCN-2325 – Rev 3 (Interim Update) | 2018-04-20 | 2020-11-20 | Analog | Fab Porting from Global Foundries to MagnaChip |
| PCN-2324 | 2018-02-28 | 2018-05-28 | Discrete Automotive | Addition of A Passivation Layer Over The Top Metal of The Die for Selected Automotive BJT Devices |
