Diodes Menu Close

Diodes Product Change Notices

Welcome to our Product/Process Change Notification (PCN) pages dating back to year 2002. To locate PCNs, please select year from the menu on this page.

Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.

To Automatically Receive PCN Notification / E-mail Alerts

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2343 2018-05-15 2018-08-15 Analog Qualification of Additional Bill of Materials (BOM), Fab Source for Select Products with Top Marking Change on Select Product
PCN-2342 2018-05-31 2018-11-30 Analog Device End of Life (EOL)
PCN-2341 2019-02-27 2019-05-27 Discrete Qualification of Additional Wafer Source for Select Automotive
Products
PCN-2340 2018-04-26 2018-05-26 Discrete Qualification of Alternate Wafer Sources for Select MOSFET Products
PCN-2339 2018-06-15 2018-09-15 Discrete Qualification of Additional Wafer Source for Select Products
PCN-2337 2018-06-04 2018-05-04 Discrete Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products
PCN-2336 2018-05-24 2018-11-24 Analog Device End of Life (EOL)
PCN-2335 2018-09-12 2019-03-12 Analog Device End of Life (EOL)
PCN-2331 2018-03-22 2018-06-22 Analog Semiconductors Additional Qualified BOM (Bill of Materials) on Selected Devices
PCN-2330 2018-03-29 2018-07-29 Discrete Semiconductors Qualification of Additional A/T site and Conversion to Palladium Coated Copper Bond Wire on Select Discrete Products
PCN-2328 2018-04-12 2018-10-12 Analog Device End of Life for tray packaging only
PCN-2327 (Advance Notice) 2018-04-20 2020-11-11 Analog Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and Bond Wire Change
PCN-2326 - Rev 3 (Interim Update) 2018-04-20 2020-12-30 Analog Fab Porting from Global Foundries to MagnaChip
PCN-2325 – Rev 3 (Interim Update) 2018-04-20 2020-11-20 Analog Fab Porting from Global Foundries to MagnaChip
PCN-2324 2018-02-28 2018-05-28 Discrete Automotive Addition of A Passivation Layer Over The Top Metal of The Die for Selected Automotive BJT Devices
PCN-2322 (Advance Notice) 2018-03-19 2020-03-15 Analog Automotive Fab Porting from Global Foundries to MagnaChip
PCN-2321 2018-02-22 2018-08-22 Analog Device End of Life (EOL)
PCN-2319 2018-03-09 2018-06-09 Discrete Automotive Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility
PCN-2318 2018-01-22 2018-01-22 Discrete Device End of Life (EOL)
PCN-2315 2018-03-09 2018-06-09 Discrete Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility
PCN-2313 2019-10-21 2020-01-21 Discrete Semiconductors Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Conversion
to Copper Bond Wire, and Qualification of Additional Die Passivation Layer on Select Products
PCN-2312 2018-04-11 2018-07-11 Analog Qualification of Additional Bill of Materials (BOM), Top Marking, and Fab Source for Select Products
PCN-2311 2018-05-22 2018-11-22 Analog - Automotive Device End of Life (EOL)
PCN-2310 2018-01-24 2018-01-24 Analog Device End of Life (EOL)
PCN-2308 2017-12-22 2018-03-22 Analog Additional FAB Source (Chipbond LH), and Assembly/Test Site (SAT/Unisem) on Select Devices
PCN-2307 2017-12-06 2018-06-06 Analog Device End of Life (EOL)
PCN-2305 2018-02-28 2018-05-28 Discrete Addition of A Passivation Layer Over The Top Metal of The Die for Selected BJT Devices
PCN-2304 2018-01-05 2018-04-05 Analog Additional Qualified Fab Source for MOSFET Devices and BOM (Bill of Materials) on Selected Devices
PCN-2301 2017-12-15 2017-12-15 Discrete Device End of Life
PCN-2300 2018-03-07 2018-06-07 Discrete Qualification of Additional Assembly and Test Sites
PCN-2299 2018-03-01 2018-06-01 Analog Semiconductors Additional Qualified (A/T) Assembly Test Site
PCN-2298 2017-10-27 2017-10-27 Analog End of Life (EOL) for Select Parts
PCN-2297 2017-12-06 2017-12-06 Analog Amendment of AL5809Q InOut Current Accuracy Over Temperature (Tj of -40C to 150C)
PCN-2293 2018-01-16 2018-01-16 Analog Fab Transfer for PT7C4512WE and PT7C4512WEX Devices Due to Current Fab Closure
PCN-2292 2018-01-17 2018-04-17 Analog Die Revision Upgrade
PCN-2286 2017-06-27 2017-12-27 Analog Device End of Life (EOL)
PCN-2285 2017-06-15 2017-06-15 Analog Device End of Life (EOL)
PCN-2283 2017-08-29 2017-11-29 Analog Additional Qualified (AT) Assembly/Test Site
PCN-2280 2017-07-12 2018-01-12 Analog Device End of Life (EOL)
PCN-2279 2017-05-02 2017-08-02 Analog Addition of Assembly/Test Site
PCN-2278 2017-05-23 2017-11-23 Analog End of Life (EOL) for Select Parts with Replacements, and End of Life (EOL) Without Replacement Parts
PCN-2277 2017-05-02 2017-08-02 Discrete Qualification of an Additional Die and Datasheet Change for PDR5KF-13
PCN-2276 2017-05-24 2017-08-24 EQX Qualification of a Different Wafer Fab for Select Parts Due to the Closure of Global Foundry Fab 6
PCN-2274 2017-04-03 2017-07-03 Analog
PCN-2272 2017-05-01 2017-05-01 Discrete - Automotive End of Life (EOL) for Select Automotive Parts Due to Closure of Diodes FabTech (KFAB) Facility
PCN-2271 2017-05-01 2017-05-01 Discrete End of Life (EOL) for Select Parts Due to Closure of Diodes FabTech (KFAB) Facility
PCN-2270 2017-05-02 2017-11-02 Analog Device End of Life (EOL)
PCN-2269 2017-04-21 2017-04-21 Discrete - Automotive Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility
PCN-2268 2017-04-21 2017-04-21 Discrete Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility
PCN-2267 2017-03-31 2017-04-30 Discrete End of Life for Select Parts with Replacements, and Qualification of an Additional Wafer Source for Select Parts