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Diodes Product Change Notices

Welcome to our Product/Process Change Notification (PCN) pages from the last five  years. To locate PCNs, please select year from the menu on this page.

Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.

To Automatically Receive PCN Notification / E-mail Alerts

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2618 2023-03-03 2023-06-03 Discrete - Automotive Qualification of Additional Wafer Source, Lead Frame Structure, and Mold Compound Type Changes for Select Discrete Automotive Products
PCN-2615 2023-02-02 2023-05-02 Discrete - Automotive Datasheet Revision Due to Maximum VBE(on) Specification Limit Change - Automotive
PCN-2614 2023-02-23 2023-08-23 Discrete - Automotive Device End of Life (EOL) - Automotive
PCN-2612 2023-03-21 2023-06-21 Analog - Automotive Change to Tape and Reel Packing Quantity - Automotive
PCN-2609 2023-02-02 2023-05-02 Discrete Datasheet Revision Due to Maximum VBE(on) Specification Limit Change
PCN-2608 2023-01-24 2023-04-24 Discrete - Automotive Qualification of Additional Wafer Source - Automotive
PCN-2607 2023-02-22 2023-08-22 Discrete Device End of Life (EOL)
PCN-2606 2023-03-10 2023-06-10 Discrete Change TO263AB Carrier Tape Pitch for Select Discrete Products
PCN-2605 2023-03-09 2023-06-09 Analog Semiconductors Qualified Additional Cu Pillar Bump Site and Bill of Materials (BOM) Lead Frame Material
PCN-2603 2023-03-20 2023-06-20 Analog Semiconductors Qualified Additional Wafer Fab Source (SFAB2/JKFAB), Die Revision, Bill of Material
PCN-2602 2023-01-31 2023-07-31 Analog Device End of Life (EOL)
PCN-2601 2022-10-28 2023-01-28 Discrete Additional Wafer Source for Select Discrete Products
PCN-2600 2022-10-03 2023-04-03 Discrete Device End of Life (EOL)
PCN-2599 2022-10-11 2023-01-11 Discrete Additional Wafer Source for Select Discrete Products
PCN-2598 2022-08-25 2022-08-25 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan
PCN-2597 2022-09-16 2022-12-16 Discrete Change GBPC (W) Package Outline Dimensions for Select Products
PCN-2596 2022-09-08 2022-12-08 Analog – Automotive Qualified Additional Wafer Fab “Key Foundry” Source located in Cheongju, Korea - Automotive
PCN-2595 2022-09-08 2022-12-08 Analog Qualified Additional Wafer Fab Source, Die Revisions, Bill of Materials, and Data Sheet Changes
PCN-2594 2022-08-31 2023-02-28 Analog Device End of Life (EOL)
PCN-2593 2022-11-02 2023-05-02 Discrete Device End of Life (EOL)
PCN-2592 2022-09-12 2022-12-12 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site Using PdCu Bond Wire and New Lead Frame for Select Products
PCN-2591 2022-06-21 2022-09-21 Discrete Semiconductors Change of Lead Frame Type for Select Automotive Products
PCN-2590 2022-06-01 2022-09-01 Discrete - Automotive Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2589 2022-05-11 2022-08-11 Discrete - Automotive Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH) - Automotive
PCN-2588 2022-06-01 2022-09-01 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products
PCN-2587 2022-05-13 2022-11-13 Analog Device End of Life (EOL)
PCN-2586 2022-06-08 2022-09-08 Analog - Automotive Qualified Additional Wafer Fab Backend IMD Material and Process - Automotive
PCN-2585 2022-06-08 2022-09-08 Analog Semiconductors Qualified Additional Assembly/Test (A/T) Sites, Wafer Fab IMD Backend, and Package Outline Dimension Change
PCN-2584 2022-05-19 2022-11-19 Discrete Device End of Life (EOL)
PCN-2582 2022-05-17 2022-08-17 Discrete Semiconductors Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH)
PCN-2581 2022-05-10 2022-08-10 Discrete Additional Wafer Source for Select Discrete Products
PCN-2579 2022-08-29 2023-02-28 Discrete Device End of Life (EOL)
PCN-2578 2022-04-26 2022-06-30 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan, and Device End of Life
(EOL)
PCN-2576 2022-03-01 2022-06-01 Discrete - Automotive Wafer Diameter Change from 6 inch to 8 inch at Diodes Internal BCD (Shanghai) Micro-Electronics Limited (SFAB2) in Shanghai, China for Select Automotive Products
PCN-2575 2022-04-05 2022-07-05 Analog Semiconductors Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH)
PCN-2574 2022-04-05 2022-07-05 Analog - Automotive Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH)
PCN-2572 2022-02-15 2022-02-15 Discrete Qualification of Additional Wafer Source
PCN-2571 2022-03-17 2022-06-17 Discrete Qualification of Additional Diodes Internal Assembly & Test Site (SAT)
PCN-2570 2022-03-02 2022-06-02 Discrete - Automotive Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire, New Mold Compound Type, and New Die Attach Material for Select Automotive Products
PCN-2568 2022-03-29 2022-03-29 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Sites, Bill of Material, and updated Data Sheets for Package Outline Dimension Change
PCN-2567 2022-03-30 2022-09-30 Analog Semiconductors Device End of Life (EOL)
PCN-2566 2022-03-31 2022-09-30 Discrete Device End of Life (EOL)
PCN-2564 2021-12-30 2021-12-30 Discrete Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Discrete Products
PCN-2563 2021-12-29 2022-03-29 Discrete - Automotive Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Automotive Products
PCN-2562 2022-01-04 2022-04-04 Discrete Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2561 2022-02-17 2022-08-17 Discrete Device End of Life (EOL)
PCN-2560 2021-12-16 2021-12-16 Discrete Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT)
PCN-2559 2021-12-01 2022-03-01 Discrete Wafer Diameter Change from 3 inch to 4 inch at Diodes Shanghai Seefull Electronic Co., Ltd. (SSEC FAB) on Select Products
PCN-2558 2021-11-12 2022-05-12 Analog Device End of Life (EOL)
PCN-2557 2022-12-01 2023-03-01 Discrete Semiconductors Qualification of Additional Diodes Internal Assembly & Test Site (SAT)