Welcome to our Product/Process Change Notification (PCN) pages from the last five years. To locate PCNs, please select year from the menu on this page.
Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.
To Automatically Receive PCN Notification / E-mail Alerts
| PCN # | Issue Date | Implementation Date | Product Family | Change Type |
|---|---|---|---|---|
| PCN-2618 | 2023-03-03 | 2023-06-03 | Discrete - Automotive | Qualification of Additional Wafer Source, Lead Frame Structure, and Mold Compound Type Changes for Select Discrete Automotive Products |
| PCN-2615 | 2023-02-02 | 2023-05-02 | Discrete - Automotive | Datasheet Revision Due to Maximum VBE(on) Specification Limit Change - Automotive |
| PCN-2614 | 2023-02-23 | 2023-08-23 | Discrete - Automotive | Device End of Life (EOL) - Automotive |
| PCN-2612 | 2023-03-21 | 2023-06-21 | Analog - Automotive | Change to Tape and Reel Packing Quantity - Automotive |
| PCN-2609 | 2023-02-02 | 2023-05-02 | Discrete | Datasheet Revision Due to Maximum VBE(on) Specification Limit Change |
| PCN-2608 | 2023-01-24 | 2023-04-24 | Discrete - Automotive | Qualification of Additional Wafer Source - Automotive |
| PCN-2607 | 2023-02-22 | 2023-08-22 | Discrete | Device End of Life (EOL) |
| PCN-2606 | 2023-03-10 | 2023-06-10 | Discrete | Change TO263AB Carrier Tape Pitch for Select Discrete Products |
| PCN-2605 | 2023-03-09 | 2023-06-09 | Analog Semiconductors | Qualified Additional Cu Pillar Bump Site and Bill of Materials (BOM) Lead Frame Material |
| PCN-2603 | 2023-03-20 | 2023-06-20 | Analog Semiconductors | Qualified Additional Wafer Fab Source (SFAB2/JKFAB), Die Revision, Bill of Material |
| PCN-2602 | 2023-01-31 | 2023-07-31 | Analog | Device End of Life (EOL) |
| PCN-2601 | 2022-10-28 | 2023-01-28 | Discrete | Additional Wafer Source for Select Discrete Products |
| PCN-2600 | 2022-10-03 | 2023-04-03 | Discrete | Device End of Life (EOL) |
| PCN-2599 | 2022-10-11 | 2023-01-11 | Discrete | Additional Wafer Source for Select Discrete Products |
| PCN-2598 | 2022-08-25 | 2022-08-25 | Discrete | Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan |
| PCN-2597 | 2022-09-16 | 2022-12-16 | Discrete | Change GBPC (W) Package Outline Dimensions for Select Products |
| PCN-2596 | 2022-09-08 | 2022-12-08 | Analog – Automotive | Qualified Additional Wafer Fab “Key Foundry” Source located in Cheongju, Korea - Automotive |
| PCN-2595 | 2022-09-08 | 2022-12-08 | Analog | Qualified Additional Wafer Fab Source, Die Revisions, Bill of Materials, and Data Sheet Changes |
| PCN-2594 | 2022-08-31 | 2023-02-28 | Analog | Device End of Life (EOL) |
| PCN-2593 | 2022-11-02 | 2023-05-02 | Discrete | Device End of Life (EOL) |
| PCN-2592 | 2022-09-12 | 2022-12-12 | Discrete Semiconductors | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site Using PdCu Bond Wire and New Lead Frame for Select Products |
| PCN-2591 | 2022-06-21 | 2022-09-21 | Discrete Semiconductors | Change of Lead Frame Type for Select Automotive Products |
| PCN-2590 | 2022-06-01 | 2022-09-01 | Discrete - Automotive | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products |
| PCN-2589 | 2022-05-11 | 2022-08-11 | Discrete - Automotive | Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH) - Automotive |
| PCN-2588 | 2022-06-01 | 2022-09-01 | Discrete | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2587 | 2022-05-13 | 2022-11-13 | Analog | Device End of Life (EOL) |
| PCN-2586 | 2022-06-08 | 2022-09-08 | Analog - Automotive | Qualified Additional Wafer Fab Backend IMD Material and Process - Automotive |
| PCN-2585 | 2022-06-08 | 2022-09-08 | Analog Semiconductors | Qualified Additional Assembly/Test (A/T) Sites, Wafer Fab IMD Backend, and Package Outline Dimension Change |
| PCN-2584 | 2022-05-19 | 2022-11-19 | Discrete | Device End of Life (EOL) |
| PCN-2582 | 2022-05-17 | 2022-08-17 | Discrete Semiconductors | Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH) |
| PCN-2581 | 2022-05-10 | 2022-08-10 | Discrete | Additional Wafer Source for Select Discrete Products |
| PCN-2579 | 2022-08-29 | 2023-02-28 | Discrete | Device End of Life (EOL) |
| PCN-2578 | 2022-04-26 | 2022-06-30 | Discrete | Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan, and Device End of Life (EOL) |
| PCN-2576 | 2022-03-01 | 2022-06-01 | Discrete - Automotive | Wafer Diameter Change from 6 inch to 8 inch at Diodes Internal BCD (Shanghai) Micro-Electronics Limited (SFAB2) in Shanghai, China for Select Automotive Products |
| PCN-2575 | 2022-04-05 | 2022-07-05 | Analog Semiconductors | Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH) |
| PCN-2574 | 2022-04-05 | 2022-07-05 | Analog - Automotive | Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH) |
| PCN-2572 | 2022-02-15 | 2022-02-15 | Discrete | Qualification of Additional Wafer Source |
| PCN-2571 | 2022-03-17 | 2022-06-17 | Discrete | Qualification of Additional Diodes Internal Assembly & Test Site (SAT) |
| PCN-2570 | 2022-03-02 | 2022-06-02 | Discrete - Automotive | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire, New Mold Compound Type, and New Die Attach Material for Select Automotive Products |
| PCN-2568 | 2022-03-29 | 2022-03-29 | Analog Semiconductors | Qualified Additional Assembly & Test (A/T) Sites, Bill of Material, and updated Data Sheets for Package Outline Dimension Change |
| PCN-2567 | 2022-03-30 | 2022-09-30 | Analog Semiconductors | Device End of Life (EOL) |
| PCN-2566 | 2022-03-31 | 2022-09-30 | Discrete | Device End of Life (EOL) |
| PCN-2564 | 2021-12-30 | 2021-12-30 | Discrete | Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Discrete Products |
| PCN-2563 | 2021-12-29 | 2022-03-29 | Discrete - Automotive | Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Automotive Products |
| PCN-2562 | 2022-01-04 | 2022-04-04 | Discrete | Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products |
| PCN-2561 | 2022-02-17 | 2022-08-17 | Discrete | Device End of Life (EOL) |
| PCN-2560 | 2021-12-16 | 2021-12-16 | Discrete | Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT) |
| PCN-2559 | 2021-12-01 | 2022-03-01 | Discrete | Wafer Diameter Change from 3 inch to 4 inch at Diodes Shanghai Seefull Electronic Co., Ltd. (SSEC FAB) on Select Products |
| PCN-2558 | 2021-11-12 | 2022-05-12 | Analog | Device End of Life (EOL) |
| PCN-2557 | 2022-12-01 | 2023-03-01 | Discrete Semiconductors | Qualification of Additional Diodes Internal Assembly & Test Site (SAT) |
