PCN-2661
|
2024-02-21 |
2024-05-21 |
Discrete Automotive |
Qualification of Additional Wafer Source and Wafer Diameter Change |
- SBR10M100P5Q
- SBR15U30SP5Q
- SBR1U200P1Q
- SBR20A60CTBQ
- SBR20M150D1Q
- SBR2M60S1FQ
- SBR2U60S1FQ
- SBR3A40SAQ
- SBR3U40S1FQ
- SBR3U60P1Q
- SBR3U60P5Q
- SBR40U200CTBQ
- SBR545SAFQ
|
PCN-2660
|
2024-03-13 |
2024-06-13 |
Discrete Automotive |
Qualification of Additional Wafer Source with Wafer Diameter and Mold Compound Changes for Select Discrete Products |
- BAT40V
- BAT54S
- BAT54WS
- SBR0240LPW
- SBR0330CW
- SBR10100CTFP
- SBR10150CT
- SBR10150CTE
- SBR10150CTFP
- SBR10150CTL
- SBR10200CT
- SBR10200CTB
- SBR10200CTFP
- SBR10200CTL
- SBR1060CTFP
- SBR10U100CTFP
- SBR10U150CT
- SBR10U150CTFP
- SBR10U200CT
- SBR10U200CTB
- SBR10U200CTFP
- SBR10U200P5
- SBR10U40CTFP
- SBR10U60CTFP
- SBR1A20T5
- SBR1A30T5
- SBR1U200P1
- SBR20100CTFP
- SBR20150CT
- SBR20150CTFP
- SBR2045CTFP
- SBR2060CTFP
- SBR20A100CTFP
- SBR20A150CT
- SBR20A150CTFP
- SBR20A200CT
- SBR20A200CTB
- SBR20A200CTFP
- SBR20A45CTFP
- SBR20A60CTFP
- SBR20U100CTFP
- SBR20U150CT
- SBR20U150CTFP
- SBR20U60CTFP
- SBR2A30P1
- SBR2A40P1
- SBR2A40SA
- SBR2M30P1
- SBR2M60S1F
- SBR2U100LP
- SBR2U30P1
- SBR2U30SA
- SBR2U60S1F
- SBR30150CT
- SBR30150CTFP
- SBR30200CT
- SBR30200CTFP
- SBR3040CTFP
- SBR3045CTFP
- SBR3060CTFP
- SBR30A100CTFP
- SBR30A120CTFP
- SBR30A150CT
- SBR30A150CTFP
- SBR30A40CTFP
- SBR30A45CTFP
- SBR30A60CTFP
- SBR3A40SA
- SBR3A40SAF
- SBR3M30P1
- SBR3U150LP
- SBR3U20SA
- SBR3U30P1
- SBR3U40P1
- SBR3U40S1F
- SBR3U60P1
- SBR40100CTFP
- SBR40150CT
- SBR40150CTFP
- SBR4040CTFP
- SBR4045CTFP
- SBR4060CTFP
- SBR40U150CT
- SBR40U200CT
- SBR40U200CTB
- SBR4U130LP
- SBR545SAF
- SBR60A200CT
- SBR6200CTL
- SDM03MT40
- SDM03MT40A
- SDM03U40
- SDM10M45SD
- SDM10U45
- SDM10U45LP
- SDM20U40
- SDMG0340L
- SDMG0340LA
- SDMG0340LC
- SDMG0340LS
- SDMK0340L
- SDMP0340LAT
- SDMP0340LCT
- SDMP0340LST
- SDMP0340LT
|
PCN-2658
|
2024-02-12 |
2024-05-12 |
Discrete Semiconductor |
Wafer Diameter Change from 4 inch to 5 inch at Diodes Internal Wafer Fabrication WX1 in WuXi, China for Select Discrete Products |
- KBJL1006
- KBJL1010
- KBJL1508
- KBJL1510
- KBJL408
- KBJL608
- MSB40M
- S1KP1M
- S1MWFM
- S5JB
- S5KP5M
- TT10M
|
PCN-2656
|
2023-12-20 |
2024-03-20 |
Discrete Semiconductors |
Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products. |
- AZ23C27Q
- BZT52C10Q
- BZT52C10SQ
- BZT52C11Q
- BZT52C11SQ
- BZT52C12Q
- BZT52C12SQ
- BZT52C13LPQ
- BZT52C13Q
- BZT52C13SQ
- BZT52C15LPQ
- BZT52C15Q
- BZT52C16LPQ
- BZT52C16Q
- BZT52C16SQ
- BZT52C18Q
- BZT52C18SQ
- BZT52C20Q
- BZT52C20SQ
- BZT52C22Q
- BZT52C24Q
- BZT52C24SQ
- BZT52C27Q
- BZT52C2V4Q
- BZT52C2V7Q
- BZT52C2V7SQ
- BZT52C3V0SQ
- BZT52C3V3Q
- BZT52C3V3SQ
- BZT52C3V6Q
- BZT52C3V6SQ
- BZT52C3V9Q
- BZT52C3V9SQ
- BZT52C4V3Q
- BZT52C4V3SQ
- BZT52C4V7Q
- BZT52C4V7SQ
- BZT52C5V1Q
- BZT52C5V1SQ
- BZT52C5V6Q
- BZT52C5V6SQ
- BZT52C6V2Q
- BZT52C6V2SQ
- BZT52C6V8LPQ
- BZT52C6V8Q
- BZT52C7V5Q
- BZT52C7V5SQ
- BZT52C8V2Q
- BZT52C8V2SQ
- BZT52C9V1LPQ
- BZT52C9V1Q
- BZX84C10Q
- BZX84C11Q
- BZX84C12Q
- BZX84C13Q
- BZX84C15Q
- BZX84C16Q
- BZX84C18Q
- BZX84C20Q
- BZX84C22Q
- BZX84C24Q
- BZX84C27Q
- BZX84C2V4Q
- BZX84C2V7Q
- BZX84C3V0Q
- BZX84C3V3Q
- BZX84C3V6Q
- BZX84C3V9Q
- BZX84C4V3Q
- BZX84C4V7Q
- BZX84C5V1Q
- BZX84C5V6Q
- BZX84C6V2Q
- BZX84C6V8Q
- BZX84C7V5Q
- BZX84C8V2Q
- BZX84C9V1Q
- DDZ5V6ASFQ
- DDZ9684Q
- DDZ9685Q
- DDZ9689Q
- DDZ9701Q
- DFLZ10Q
- DFLZ11Q
- DFLZ12Q
- DFLZ13Q
- DFLZ15Q
- DFLZ16Q
- DFLZ18Q
- DFLZ20Q
- DFLZ5V6Q
- DFLZ6V2Q
- DFLZ6V8Q
- DFLZ7V5Q
- DFLZ8V2Q
- DFLZ9V1Q
- MMBZ5221BQ
- MMBZ5226BQ
- MMBZ5231BQ
- MMBZ5232BQ
- MMBZ5235BQ
- MMBZ5242BQ
- MMBZ5244BQ
- MMBZ5245BQ
- MMBZ5245BWQ
- MMBZ5252BQ
- MMSZ5223BQ
- MMSZ5225BQ
- MMSZ5226BQ
- MMSZ5227BQ
- MMSZ5228BQ
- MMSZ5229BQ
- MMSZ5230BQ
- MMSZ5231BQ
- MMSZ5232BQ
- MMSZ5232BSQ
- MMSZ5233BQ
- MMSZ5234BQ
- MMSZ5235BQ
- MMSZ5236BQ
- MMSZ5237BQ
- MMSZ5239BQ
- MMSZ5240BQ
- MMSZ5241BQ
- MMSZ5242BQ
- MMSZ5243BQ
- MMSZ5245BQ
- MMSZ5246BQ
- MMSZ5248BQ
- MMSZ5250BQ
- MMSZ5251BQ
- MMSZ5252BQ
- MMSZ5254BQ
- UDZ9V1BQ
|
PCN-2655
|
2023-11-06 |
2024-02-06 |
Discrete |
Datasheet Revision Due to Maximum IR Specification Limit Change |
|
PCN-2654
|
2024-02-15 |
2024-04-28 |
Analog |
Device End of Life (EOL) |
- AH211
- AH2985
- AH3362Q
- AH3363Q
- AH3364Q
- AH3365Q
- AH3366Q
- AH3367Q
- AH3368Q
- AH3369Q
- AH3390Q
- AH3391Q
- AH3563Q
- AH3564Q
- AH3762Q
- AH3763Q
- AH3764Q
- AH3765Q
- AH3766Q
- AH3767Q
- AH3768Q
- AH3769Q
- AH5772
- AH5773
- AH5775
- AJH266Z4
- AJH276Z4
- AJH277AZ4
- AL1663RS
- AL1663S
- AL3353S
- AL5892SP
- AL8823S
- AL9910
- AM4406
- AM4406F
- AM9468
- AM9469
- AN431
- AP131
- AP139
- AP1506
- AP1603
- AP2822A
- AP3031
- AP431S
- AP7217D
- AP7342
- AP7344
- AP7346
- AS7806A
- AS7808A
- AZ431L
- AZ75232
- PI2PCIE2412
- PI2SSD3212
- PI3C3125
- PI3C3306
- PI3CH3345
- PI3CH400
- PI3CH480
- PI3CH800
- PI3USB3102
- PI3WVR12412
- PI4MSD5V9545A
- PI4ULS3V302
- PI5A124
- PI5A3157B
- PI5A3166
- PI5A3167C
- PI5A4157
- PI5A4599B
- PI5C3125
- PI5C3245
- PI5C3251
- PI5C3253
- PI5C3257
- PI5C3305
- PI5V330
- PI5V330A
- PI5V331
- PI6C10810
- PI6C485311
- PI6C485352
- PI6C485352FAE
- PI6ULS5V9306
- PI6ULS5V9511A
- PI6ULS5V9515A
- PI90LVT386
- ZXBM5210
|
PCN-2653
|
2023-11-06 |
2024-02-06 |
Discrete |
Transer of Wafer Manufacturing Site for Select Automotive Products |
|
PCN-2652
|
2023-11-06 |
2024-05-06 |
Discrete |
Device End of Life (EOL) |
- 1N4736A
- 1N4749A
- BAS21A
- FB230H
- UDZS5V6B
|
PCN-2651
|
2023-11-13 |
2023-11-13 |
Analog |
Qualified Additional Fab Source, Assembly Test Sites, Die Revision, BOM, Datasheet, Tape and Reel Packing Quantity. |
- AH175
- AH49F
- AP3156
- AP3917B
- AP3917C
- AP3917D
- AP4310A
- APX823
- APX824
- APX825A
- AS324
- AS339
- AZ75232
- FL
- G23270006
- G23270013
- G23270015
- G23270016
- G23270023
- G23270024
- G23270025
- PI3CH3305
- PI3USB102E
- PI3VT3306
- PI6LC48C21
- PI6LC48C51
- PI6LC48P0101
- PI6LC48P25104
- PT7C4302
- PT7C4307
- PT7C4311
- PT7C4337
- PT7C4337A
- PT7C433833A
- PT7C4339
- PT7C4363B
- PT7C4372A
- PT7C4511
- PT7C4563B
- US
- ZXCT1008
|
PCN-2648
|
2023-10-19 |
2024-01-20 |
Analog |
Additional Wafer Source SPFAB |
- AP22816A
- AP22816B
- AP22817A
- AP22817B
- AP22818A
- AP22818B
- AP7315
- AP7340
- AP7341
|
PCN-2647
|
2023-10-12 |
2024-01-12 |
Discrete |
Back Metal Composition Change for Select Discrete Products |
- DMN1002UCA6
- DMN1003UCA6
- DMN1006UCA6
- DMN12M3UCA6
- DMN12M7UCA10
- DMN12M8UCA10
- DMN16M0UCA6
- DMN2009UCA4
- DMN2030UCA4
- DMN22M5UCA10
- DMN3006SCA6
- DMN3008SCP10
|
PCN-2645
|
2023-09-11 |
2023-12-11 |
Discrete |
Datasheet Revision Due to Maximum VBSUV+ and VCCUV+ Specification Limit Change |
|
PCN-2644
|
2023-09-27 |
2023-12-27 |
Discrete |
Lead Frame Type, Die Bond Process, Wire Bond Type and Mold Compound changes to enhance select TO-252
packaged automotive products |
- MJD31CQ
- MJD31CUQ
- MJD32CQ
- MJD32CUQ
- ZXT1053AKQ
- ZXT690BKQ
- ZXT951KQ
- ZXTN4004KQ
|
PCN-2642
|
2023-09-05 |
2024-03-05 |
Analog |
Device End of Life (EOL) |
- AL1696
- AL5890
- AL8820
- AP1501
- AP2204
- AP3105
- AP3302
- AP3983E
- AP3983R
- AP3987P
- AP3987T
- AP4306
- AP4312
- AP43201H
- AP7335A
- AP9101C
- AP9211
- AP9214L
- AP9221
- AP9234L
- APR3415
- APR343
- APR34509L
- APR34709
- AS7805AT
- AS7806A
- AS7808A
- AS7809A
- AS7815A
- AS7818A
- AZ494A
- AZ7500B
- AZ7500E
- LSP2008
- LSP2015
- LSP2031
- PI2EQX632E
- PI3C3125WE
- PI3C3245
- PI3C3384
- PI3C3861-A
- PI3CH1012
- PI3CH480
- PI3L110
- PI3L301D
- PI3L500-A
- PI3L720
- PI3USB20
- PI3V512
- PI3V512QE
- PI3VT3245-A
- PI4GTL2034
- PI4MSD5V9543A
- PI5C3253
- PI5C3257
- PI5C3384
- PI5C3861
- PI5USB2544
- PI5V330S
- PI6C2405A-1
- PI6C2405A-1H
- PI6C2409-1H
- PI6CX201A
- PI6ULS5V9511B
- PI6ULS5V9517A
- PI6ULS5V9517B
- PI6ULS5V9617B
- PI6ULS5V9627A
- PI7C9X20505GP
- PI7C9X20508GP
- PT7C4302
- PT7C4307
- PT7C4311
- PT7C4337AC
- PT7C4337B
- PT7C433833
- PT7C433833A
- PT7C4339
- PT7C4363B
- PT7C4511
- PT7C4563B
- PT7M7809
- PT7M7811
- PT7M7823S
- PT8A2766I
- SP6699EK
- ZNI1000
- ZR285
- ZR4040-2.5
- ZR4040-4.1
- ZR4040-5
- ZR431
- ZRT025
- ZRT040
- ZRT050
- ZTLV431
- ZXRE1004
- ZXRE330
|
PCN-2641
|
2023-09-26 |
2023-12-26 |
Discrete |
Lead Frame Type, Die Bond Process, Wire Bond Type and Mold Compound changes to enhance select TO-252
packaged products |
- 2DB1182Q
- 2DB1184Q
- DXT696BK
- MJD31C
- MJD32C
- MJD340
- MJD350
- ZXT1053AK
- ZXT690BK
- ZXT790AK
- ZXT849K
- ZXT953K
- ZXTN04120HK
- ZXTN4004K
|
PCN-2640
|
2023-09-12 |
2024-03-13 |
Discrete |
Device End of Life (EOL) - Automotive |
- 1N4148WQ
- 1N4148WSQ
- BAS116Q
- BAS16HTWQ
- BAS16Q
- BAV116WSQ
- BAV170Q
- BAV199DWQ
- BAV199Q
- BAV199WQ
- BAV70Q
- BAV70WQ
- BAV99DWQ
- BAV99Q
- BAW156Q
- BAW56DWQ
- BAW56Q
- BAW56WQ
- BZT52C3V9Q
- BZT52C5V6TQ
- BZX84B11
- BZX84B13
- BZX84B15
- BZX84B16
- BZX84B18
- BZX84B20
- BZX84B2V7
- BZX84B30
- BZX84B33
- BZX84B39
- BZX84B3V0
- BZX84B3V3
- BZX84B4V3
- BZX84B5V1
- BZX84B5V6
- BZX84B6V8
- BZX84B7V5
- BZX84B8V2
- DDZ9678
- DLD101
- MMSZ5232B
|
PCN-2639
|
2023-09-26 |
2023-12-26 |
Discrete |
Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire with Standardization of Assembly Bill of Materials at CAT for Select Automotive Products |
- 2DA1201YQ
- ADTA114EUAQ
- ADTA143ZUAQ
- ADTA144ECAQ
- ADTC114ECAQ
- ADTC114EUAQ
- ADTC114YUAQ
- ADTC124ECAQ
- ADTC143TUAQ
- ADTC143ZCAQ
- ADTC143ZUAQ
- ADTC144EUAQ
- BCP5316Q
- BCP5416Q
- BCX5316Q
- BCX5616Q
- BCX6825Q
- DMG1013TQ
- DMG2302UQ
- DMG2307LQ
- DMG3401LSNQ
- DMG3414UQ
- DMG6602SVTQ
- DMN2230UQ
- DMN3135LVTQ
- DMN6068SEQ
- DMN63D8LDWQ
- DMP1045UQ
- DMP2100UQ
- DMP6110SVTQ
- DXT651Q
- DXT751Q
- FCX491AQ
- FCX491Q
- FCX558Q
- FCX591AQ
- FMMT5401Q
- FZT491AQ
- FZT591AQ
- FZT851Q
- MMST5551Q
- MMSTA56Q
- ZXTN07060BGQ
- ZXTN25060BZQ
- ZXTP01500BGQ
- ZXTP07060BGQ
|
PCN-2638
|
2023-09-19 |
2023-12-19 |
Discrete |
Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site with Standardization of Assembly Bill of Materials at CAT for Select Discrete Products |
- DMP10H400SE
- FMMT449
- FMMT451
- FMMT455
- FMMT489
- FMMT491
- FMMT491A
- FMMT493
- FMMT493A
- FMMT494
- FMMT495
- FMMT497
- FMMT549
- FMMT549A
- FMMT551
- FMMT555
- FMMT589
- FMMT591
- FMMT591A
- FMMT593
- FMMT596
- MMDT2222V
|
PCN-2636
|
2023-08-29 |
2023-08-29 |
Discrete |
Device End of Life (EOL) |
- 1N4001
- 1N4002
- 1N4003
- 1N4004
- 1N4005
- 1N4006
- 1N4007
- 1N4148(LS)
- 1N4148W(LS)
- 1N4148WS(LS)
- 1N5408
- BAV70(LS)
- BAV99(LS)
- BAW56(LS)
- DDZ2V4ASF
- DDZ2V4BSF
- DGD0506
- DGD1503
- DGD2190
- DGD21904
- DLPA004
- DLPT05
- DMF05LCFLP
- DMT5012LFVW
- DPD18AWF
- DPS1035
- DTVS3V3S1UR
- ES1G(LS)
- HTMN5130SSD
- L35L12VCB2
- L35L15VCB2
- L35L18VCB2
- L35L24VCB2
- L35L3V3CB2
- L35L5V0CB2
- L35L8V0CB2
- LL4148(LS)
- PLR0524
- SD05
- TPD6V8LP
- ZXMD63N03X
- ZXTN2097F
|
PCN-2635
|
2023-08-10 |
2023-11-10 |
Discrete |
Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products |
|
PCN-2633
|
2023-08-16 |
2023-11-15 |
Discrete |
Additional Wafer Source for Select Discrete Products |
- GBJ15L06(LS)
- GBJ25JL(LS)
- GBU15JL(LS)
- GBU15L06
- GBU25JL(LS)
- MSB30JL(LS)
- TT6JL(LS)
- TT8JL(LS)
|
PCN-2632
|
2023-06-13 |
2023-09-11 |
Discrete |
Addition of A Passivation Layer Over The Top Metal of The Die for Select BJT Products |
- DMMT5551
- DSS5240Y
- DSS9110Y
- DXT2010P5
- DXT2011P5
- DXT2012P5
- DXT2013P5
- DXT2014P5
- DXT5551P5
- DXTP03200BP5
- DZT5551
- FCX605
- FCX619
- FCX705
- FMMT413
- FMMT618
- FMMT619
- FMMT624
- FMMT6520
- FMMT718
- FMMT720
- FZT600
- FZT600B
- FZT603
- FZT605
- FZT705
- MMBT5401
- MMBT5551
- MMDT5401
- MMST5401
- ZDS1009
- ZDT6702
- ZUMT619
- ZXGD3003E6
- ZXT12N20DX
- ZXT12N50DX
- ZXT12P40DX
- ZXT13N20DE6
- ZXT13N50DE6
- ZXT13P12DE6
- ZXTC2045E6
- ZXTN04120HK
- ZXTN04120HP5
- ZXTN5551FL
- ZXTN5551G
- ZXTP4003G
- ZXTP4003Z
- ZXTP5401FL
- ZXTP5401G
|
PCN-2631
|
2023-11-07 |
2024-02-07 |
Discrete |
Transfer of Wafer Manufacturing Site for Select Discrete Products |
- 1N4001G
- 1N4002G
- 1N4003G
- 1N4004G
- 1N4005G
- 1N4006G
- 1N4007G
- 1N5400G
- 1N5401G
- 1N5402G
- 1N5404G
- 1N5406G
- 1N5407G
- 1N5408G
- 2A07G
- ABS20M
- ABS20MH
- D4G
- D5G
- D7G
- DF005M
- DF005S
- DF01M
- DF01S
- DF02M
- DF02S
- DF04M
- DF04S
- DF06M
- DF06S
- DF08M
- DF08S
- DF10M
- DF10S
- DF15005S
- DF1501S
- DF1502S
- DF1504S
- DF1506M
- DF1506S
- DF1508M
- DF1508S
- DF1510S
- DF1512S
- DF1514S
- DFLR1200
- DFLR1400
- DFLR1600
- FS1ME
- FS2MD
- FS2ME
- GBJ10005
- GBJ1001
- GBJ1002
- GBJ1004
- GBJ1006
- GBJ1008
- GBJ1010
- GBJ1502
- GBJ1504
- GBJ1506
- GBJ1508
- GBJ1510
- GBJ15V10
- GBJ2001
- GBJ2002
- GBJ2004
- GBJ2006
- GBJ2008
- GBJ2010
- GBJ25005
- GBJ2501
- GBJ2502
- GBJ2504
- GBJ2506
- GBJ2508
- GBJ2510
- GBJ25KH
- GBJ25V08
- GBJ3506
- GBJ3508
- GBJ3510
- GBJ5010
- GBJ6005
- GBJ601
- GBJ602
- GBJ604
- GBJ606
- GBJ608
- GBJ610
- GBJ801
- GBJ802
- GBJ804
- GBJ806
- GBJ808
- GBJ810
- GBJS3010
- GBJS4010
- GBL206
- GBL208
- GBL406
- GBL408
- GBL410
- GBL610
- GBP206
- GBP208
- GBP210
- GBP306
- GBP308
- GBP310
- GBP406
- GBP406N
- GBP408
- GBP408N
- GBP410
- GBP808N
- GBP810
- GBU10005
- GBU1001
- GBU1002
- GBU1004
- GBU1006
- GBU1008
- GBU1010
- GBU10V06
- GBU10V08
- GBU1506
- GBU1508
- GBU1510
- GBU2508
- GBU2510
- GBU25KH
- GBU3008
- GBU30T08
- GBU4005
- GBU401
- GBU402
- GBU404
- GBU406
- GBU408
- GBU410
- GBU6005
- GBU601
- GBU602
- GBU604
- GBU606
- GBU608
- GBU610
- GBU8005
- GBU801
- GBU802
- GBU804
- GBU806
- GBU808
- GBU810
- HD01
- HD02
- HD04
- HD06
- HDS20M
- KBJ1006G
- KBJ1008G
- KBJ1010G
- KBJ2006G
- KBJ2008G
- KBJ401G
- KBJ402G
- KBJ404G
- KBJ406G
- KBJ408G
- KBJ410G
- KBJ601G
- KBJ604G
- KBJ606G
- KBJ608G
- KBJ610G
- KBP005G
- KBP01G
- KBP02G
- KBP04G
- KBP06G
- KBP08G
- KBP10G
- KBP2005G
- KBP201G
- KBP202G
- KBP204G
- KBP206G
- KBP208G
- KBP210G
- KBP304G
- KBP306G
- KBP308G
- KBP310G
- KBP404G
- KBP406G
- KBP408G
- KBP410G
- LT2A07G
- MSB15M
- MSB15MH
- MSB20M
- MSB22M.
- MSB25MH
- MSB30KH
- MSB30M
- PDR3G
- PDR5G
- S10JC
- S10KC
- S10MC
- S1A
- S1AB
- S1B
- S1BB
- S1D
- S1DB
- S1G
- S1GB
- S1J
- S1JB
- S1K
- S1KB
- S1M
- S1MB
- S2A
- S2AA
- S2B
- S2BA
- S2D
- S2DA
- S2G
- S2GA
- S2J
- S2JA
- S2K
- S2KA
- S2M
- S2MA
- S2MH
- S2MHA
- S3A
- S3AB
- S3B
- S3BB
- S3D
- S3DB
- S3G
- S3GB
- S3J
- S3JB
- S3K
- S3KB
- S3M
- S3MB
- S5AC
- S5BC
- S5DC
- S5GC
- S5JB
- S5JC
- S5KB
- S5KC
- S5MB
- S5MC
- S8JC
- S8KC
- S8MC
- TT10M
- TT2M
- TT3M
- TT410
- TT4M
- TT4V10
- TT6M
- TT8M
|
PCN-2630
|
2024-02-20 |
2024-05-20 |
Discrete Semiconductors |
Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness for Select
Products |
- BZT52C10LP
- BZT52C11LP
- BZT52C12LP
- BZT52C13LP
- BZT52C15LP
- BZT52C16LP
- BZT52C18LP
- BZT52C20LP
- BZT52C22LP
- BZT52C24LP
- BZT52C2V4LP
- BZT52C2V7LP
- BZT52C36LP
- BZT52C39LP
- BZT52C3V0LP
- BZT52C3V3LP
- BZT52C3V6LP
- BZT52C3V9LP
- BZT52C4V3LP
- BZT52C4V7LP
- BZT52C5V1LP
- BZT52C5V6LP
- BZT52C6V2LP
- BZT52C6V8LP
- BZT52C7V5LP
- BZT52C8V2LP
- BZT52C9V1LP
- BZX84C15
- DDZ36BSF
- DDZ4V7BSF
- DDZ5V6ASF
- DDZ5V6CSF
- DDZ6V8ASF
- DFLT10A
- DFLT11A
- DFLT12A
- DFLT13A
- DFLT14A
- DFLT15A
- DFLT16A
- DFLT17A
- DFLT18A
- DFLT20A
- DFLT22A
- DFLT24A
- DFLT5V0A
- DFLT6V0A
- DFLT6V5A
- DFLT7V0A
- DFLT7V5A
- DFLT8V5A
- DFLT9V0A
- DFLZ10
- DFLZ11
- DFLZ12
- DFLZ13
- DFLZ15
- DFLZ16
- DFLZ18
- DFLZ20
- DFLZ5V6
- DFLZ6V2
- DFLZ6V8
- DFLZ7V5
- DFLZ8V2
- DFLZ9V1
- GDZ10LP3
- GDZ11LP3
- GDZ12LP3
- GDZ13LP3
- GDZ15LP3
- GDZ18LP3
- GDZ20LP3
- GDZ22LP3
- GDZ24LP3
- GDZ5V1LP3
- GDZ5V6LP3
- GDZ6V0LP3
- GDZ6V2LP3
- GDZ6V8LP3
- GDZ7V5LP3
- GDZ8V2LP3
- GDZ9V1LP3
|
PCN-2629
|
2023-05-15 |
2023-11-15 |
Discrete |
Device End of Life (EOL) - Automotive |
- AS1A
- AS1B
- AS1D
- AS1G
- AS1K
- B240AQ
- B260Q
- BAS521Q
- DFLS160Q
- PDS560Q
- ZHCS506Q
|
PCN-2628
|
2023-05-11 |
2023-08-11 |
Discrete |
Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products |
- DMN22M5UFG
- DMN3012LEG
- DMN3013LDG
- DMN3013LFG
- DMN3022LDG
- DMN3022LFG
- DMP2002UPS
- DMP2004UFG
- DMP2005UFG
- DMP3007SFG
- DMP32M6SPS
- DMT10H003SPSW
- DMT10H009LFG
- DMT10H015LFG
- DMT10H017LPD
- DMT3002LPS
- DMT3003LFG
- DMT31M6LPS
- DMT32M4LFG
- DMT32M4LPSW
- DMT32M5LFG
- DMT4002LPS
- DMT6002LPS
- DMT6005LFG
- DMT6007LFG
- DMT61M5SPSW
- DMT8008LFG
- DMTH10H003SPSW
- DMTH3002LPS
- DMTH41M8SPS
- DMTH43M8LFG
- DMTH45M5LPDW
- DMTH45M5LPSW
- DMTH45M5SPDW
- DMTH45M5SPSW
- DMTH6002LPS
- DMTH6005LFG
- DMTH61M5SPSW
- DMTH62M8LPS
- DMTH62M8SPS
- DMTH8003SPS
- DMTH8008LFG
- DMTH8008SFG
|
PCN-2624
|
2023-05-31 |
2023-08-29 |
Analog |
Qualification of Additional Assembly Test Site CAT – Automotive |
|
PCN-2623
|
2023-05-15 |
2023-11-15 |
Discrete |
Device End of Life (EOL) |
- 1N4148
- B0520LW
- B0520WS
- B0530W
- B0530WS
- B0540W
- B0540WS
- B1100
- B1100B
- B1100LB
- B120
- B130
- B130L
- B130LAW
- B130LB
- B140WS
- B150
- B160
- B160B
- B160S1F
- B170
- B170B
- B180
- B180B
- B2100
- B2100A
- B2100AE
- B220
- B220A
- B230
- B230A
- B240
- B240A
- B240AE
- B240AF
- B240LA
- B240S1F
- B250
- B250A
- B260
- B260A
- B260AE
- B290
- B3100B
- B3100BE
- B320A
- B320AE
- B320AF
- B320B
- B330
- B330A
- B330B
- B340
- B340A
- B340AF
- B340B
- B340CE
- B340LA
- B340LB
- B350
- B350B
- B360
- B360A
- B360AE
- B360AF
- B360AM
- B360B
- B370
- B380
- B380B
- B3L30LP
- B520C
- B530C
- B540C
- B550C
- B560C
- BAS40
- BAS40BRW
- BAS40DW
- BAS40LP
- BAS40TW
- BAS40W
- BAT1000
- BAT400D
- BAT46W
- BAT54
- BAT54A
- BAT54ATA
- BAT54AW
- BAT54CDW
- BAT54CTA
- BAT54CW
- BAT54JW
- BAT54LP
- BAT54S
- BAT54SDW
- BAT54ST
- BAT54STA
- BAT54SW
- BAT54T
- BAT54TW
- BAT54V
- BAT54W
- BAT54WS
- BAT54WT
- BAT750
- BAT760
- BAV99BRLP
- DFLS1100
- DFLS1150
- DFLS1200
- DFLS120L
- DFLS140L
- DFLS160
- DFLS2100
- DFLS230L
- DFLS260
- DML3010LFDS
- DML3011LFDS
- DMP1070UCA3
- MBR0580S1
- MBR2045CT
- MBR2045CTF
- MBR2060CT
- MBR2060CTF
- MBR230S1F
- MBR3045CT
- MBR3045CTF
- PD3S120L
- PD3S130H
- PD3S130L
- PD3S140
- PD3S160
- PD3S220L
- PD3S230H
- PD3S230L
- PDS1040
- PDS1040L
- PDS1045
- PDS3100
- PDS3200
- PDS340
- PDS360
- PDS4150
- PDS4200H
- PDS5100
- PDS5100H
- PDS760
- SB380
- SBR10100CTL
- SBR10200CTFP
- SBR1045CTL
- SBR12A45SD1
- SBR12E45LH1
- SBR15300D1
- SBR15U100CTL
- SBR20B100CT
- SBR20E120CT
- SBR30A100CT
- SBR30A40CT
- SBR30E100CT
- SBR30E45CT
- SBR30E45CTB
- SBR30S30CT
- SBR40S45CT
- SBR40U100CT
- SBR40U120CT
- SBR40U150CT
- SBR40U45CT
- SBR40U60CT
- SBR40U60CTE
- SBR60A150CT
- SBR60A300CT
- SBR60A60CT
- SBR6100CTL
- SBR8A45SP5
- SBR8U60P5
- SD103ASDM
- SD103ATW
- SD103AW
- SD103AWS
- SD103BW
- SD103BWS
- SD103CW
- SDM01U50CP3
- SDM02M30LP3
- SDM02U30LP3
- SDM100K30L
- SDM1100LP
- SDM1100S1F
- SDM160S1F
- SDM1A40LP8
- SDM20E40C
- SDM20U30
- SDM20U30LP
- SDM2100S1F
- SDM40E20LA
- SDM40E20LC
- SDM40E20LS
- SDT15B150LP5
- ZHCS1000TA
- ZHCS2000TA
- ZHCS350TA
- ZHCS400TA
- ZHCS500TA
- ZHCS506TA
- ZHCS750TA
- ZLLS1000TA
- ZLLS2000TA
- ZLLS350TA
- ZLLS400TA
- ZLLS400TC
- ZLLS410TA
- ZXT11N15DFTA
- ZXT11N20DFTA
|
PCN-2622
|
2023-04-07 |
2023-07-07 |
Analog |
Qualified Additional Assembly/Test (A/T) Site |
|
PCN-2620
|
2023-05-10 |
2023-08-10 |
Discrete |
Qualification of Additional Wafer Source and Additional Assembly and Test Site for Select Discrete Products |
|
PCN-2619
|
2023-04-12 |
2023-07-12 |
Discrete Automotive |
Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products |
- P6SMAJ12ADFQ
- P6SMAJ15ADFQ
- P6SMAJ18ADFQ
- P6SMAJ22ADFQ
- P6SMAJ24ADFQ
- P6SMAJ26ADFQ
- P6SMAJ28ADFQ
- P6SMAJ30ADFQ
- P6SMAJ36ADFQ
- P6SMAJ43ADFQ
- P6SMAJ5.0ADFQ
- P6SMAJ6.0ADFQ
- P6SMAJ64ADFQ
- P6SMAJ7.5ADFQ
- RS1JDFQ
- RS1MDFQ
- S1MDFQ
- S2KDFQ
- S8MCQ
- SBR545SAFQ
- US1DWFQ
- US1JDFQ
- US1MDFQ
- US2JDFQ
|
PCN-2618
|
2023-03-03 |
2023-06-03 |
Discrete Automotive |
Qualification of Additional Wafer Source, Lead Frame Structure, and Mold Compound Type Changes for Select Discrete Automotive Products |
- SBR02U100LPQ
- SBR0560S1Q
- SBR1045CTLQ
- SBR1045D1Q
- SBR1045SP5Q
- SBR10A45SP5Q
- SBR10U200P5Q
- SBR10U45D1Q
- SBR10U45SP5Q
- SBR12U100P5Q
- SBR15U100CTLQ
- SBR20M45D1Q
- SBR2A40P1Q
- SBR3045CTBQ
- SBR30A45CTBQ
- SBR30A60CTBQ
- SBR3U40P1Q
- SBR3U60P1Q
- SBR6100CTLQ
- SBR660CTLQ
- SBR8U60P5Q
|
PCN-2617
|
2023-05-03 |
2023-08-03 |
Discrete |
Addition of a Polyimide Wafer Coating Layer and Enhanced ESD Structure for DMP10H4D2S Products |
|
PCN-2616
|
2023-06-02 |
2023-08-31 |
Discrete Automotive |
Addition of A Passivation Layer Over The Top Metal of The Die for Select Automotive BJT Products - Automotive |
- DXT690BP5Q-13
- FMMT619QTA
- FMMT625QTA
- FMMT717QTA
- FMMT720QTA
- FZT795AQTA
- MJD31CQ-13
- MMST5551Q-7-F
- ZDT694QTA
- ZTD09N50DE6QTA
- ZXGD3003E6QTA
- ZXTC6717MCQTA
- ZXTD6717E6QTA
- ZXTN2080GQTA
|
PCN-2615
|
2023-02-02 |
2023-05-02 |
Discrete Automotive |
Datasheet Revision Due to Maximum VBE(on) Specification Limit Change - Automotive |
- BC847BVNQ
- BC847PNQ
- BC847PNQ-
|
PCN-2614
|
2023-02-23 |
2023-08-23 |
Discrete Automotive |
Device End of Life (EOL) - Automotive |
- 2DD1766Q
- BAV3004WQ
- BAV3004WSQ
- MMBD3004CQ
- MMBD3004SQ
- ZTX550Q
|
PCN-2613
|
2023-04-12 |
2023-07-12 |
Discrete |
Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products |
- B120AF
- B130AF
- B140AF
- B150AF
- B160AF
- B2100AF
- B220AF
- B230AF
- B240AF
- B245AF
- B250AF
- B260AF
- B320AF
- B330AF
- B340AF
- B340AXF
- B345AF
- B350AF
- B360AF
- HS1DDF
- P4SMAJ10ADF
- P4SMAJ11ADF
- P4SMAJ12ADF
- P4SMAJ13ADF
- P4SMAJ14ADF
- P4SMAJ15ADF
- P4SMAJ16ADF
- P4SMAJ17ADF
- P4SMAJ18ADF
- P4SMAJ20ADF
- P4SMAJ22ADF
- P4SMAJ24ADF
- P4SMAJ26ADF
- P4SMAJ28ADF
- P4SMAJ30ADF
- P4SMAJ33ADF
- P4SMAJ36ADF
- P4SMAJ5.0ADF
- P4SMAJ54ADF
- P4SMAJ6.0ADF
- P4SMAJ6.5ADF
- P4SMAJ60ADF
- P4SMAJ64ADF
- P4SMAJ7.0ADF
- P4SMAJ7.5ADF
- P4SMAJ70ADF
- P4SMAJ8.0ADF
- P4SMAJ8.5ADF
- P4SMAJ85ADF
- P4SMAJ9.0ADF
- P6SMAJ12ADF
- P6SMAJ14ADF
- P6SMAJ15ADF
- P6SMAJ18ADF
- P6SMAJ20ADF
- P6SMAJ24ADF
- P6SMAJ28ADF
- P6SMAJ30ADF
- P6SMAJ36ADF
- P6SMAJ5.0ADF
- P6SMAJ54ADF
- P6SMAJ58ADF
- RS1JDF
- RS1MDF
- S1MDF
- S2KDF
- SBR2M100SAF
- SBR3A40SAF
- SBR3M100SAF
- SBR545SAF
- SBRT3U45SAF
- SBRT3U60SAF
- SBRT5A50SAF
- SDT3A45SAF
- SDT5A100SAF
- SDT5A50SAF
- SDT5A60SAF
- SF1DDF
- SF1GDF
- SF1JDF
- SF2DDF
- SF2JDF
|
PCN-2612
|
2023-03-21 |
2023-06-21 |
Analog Automotive |
Change to Tape and Reel Packing Quantity - Automotive |
- HX53C5002Q
- HX73C5001Q
- HX73F6201Q
- LDA000010Q
- LDC500014Q
- NX52F6209Q
- NX52N3201Q
- NX5350008Q
- NX5350A01Q
- NX53F6203Q
- NX53Q6601Q
- NX7250002Q
- NX72F6207Q
- NX73U0001Q
- NX76F6201Q
- NX76R0001Q
- PB2500021Q
- PB5000033Q
- PD5000010Q
- PX5000021Q
|
PCN-2611
|
2023-04-03 |
2023-07-03 |
Analog |
Qualified Additional Assembly Test Sites, Die Revision and Tape and Reel Packing Quantity. |
- AH1892
- AH1898
- AH3712
- AH3713
- AH3714
- AH3715
- AS78L05
- AS78L12
- AS78L15
- AZ431-A
- HX
- LD
- LN
- NX
- PB
- PD
- PF
- PN
- PX
- RX
- S2692
- SDS3833B
- SEL3833B
- SN
- SP
- SQ
- UF
- UV
- UX
- WF
|
PCN-2610
|
2023-03-30 |
2023-09-30 |
Analog |
Device End of Life (EOL) |
- AH1751
- AL1697
- AL1781
- AL1782
- AP3031
- AP7366
- APX803
- FK
- FM
- FN
- HX
- LX
- NX
- PB
- PK
- S1613A
- S1613AA
- S1613B
- S1613E
- S1803E
- SEL3833B
- SN
- SX
- UF
- UX
- WF
- WX
|
PCN-2609
|
2023-02-02 |
2023-05-02 |
Discrete |
Datasheet Revision Due to Maximum VBE(on) Specification Limit Change |
|
PCN-2608
|
2023-01-24 |
2023-04-24 |
Discrete Automotive |
Qualification of Additional Wafer Source - Automotive |
|
PCN-2607
|
2023-02-22 |
2023-08-22 |
Discrete |
Device End of Life (EOL) |
- 1N4448W(LS)
- 1N4937(LS)
- 1SS355(LS)
- 2DD1766P
- 2DD1766R
- 2DD2656
- BAS21C(LS)
- BAS21S(LS)
- BAV21W(LS)
- BAV3004W
- BAV3004WS
- BAV70W(LS)
- BAV99W(LS)
- BAW101V(LS)
- BC858A
- BC858AW
- D5V0Q1B2CSP
- DESD5V0V1BCSP
- DGD0590FU
- DMJ70H1D3SK3
- DMJ70H1D4SJ3
- DMJ70H600HCT
- DMJ70H600HCTI
- DMJ70H600HK3
- DMT5015LFDF
- LS4148W(LS)
- LS4148WS(LS)
- LS4148WT(LS)
- LS4448W(LS)
- LZ52C10W(LS)
- LZ52C12W(LS)
- LZ52C13W(LS)
- LZ52C15W(LS)
- LZ52C15WS(LS)
- LZ52C16W(LS)
- LZ52C16WS(LS)
- LZ52C18W(LS)
- LZ52C18WS(LS)
- LZ52C20W(LS)
- LZ52C22W(LS)
- LZ52C24W(LS)
- LZ52C27W(LS)
- LZ52C27WS(LS)
- LZ52C30W(LS)
- LZ52C30WS(LS)
- LZ52C33W(LS)
- LZ52C36W(LS)
- LZ52C36WS(LS)
- LZ52C3V3W(LS)
- LZ52C3V6W(LS)
- LZ52C4V3W(LS)
- LZ52C4V7W(LS)
- LZ52C5V1W(LS)
- LZ52C5V1WS(LS)
- LZ52C5V6W(LS)
- LZ52C5V6WS(LS)
- LZ52C6V2W(LS)
- LZ52C6V8W(LS)
- LZ52C7V5W(LS)
- LZ52C9V1W(LS)
- LZ55C8V2WS(LS)
- MBR1040(LS)
- MBR1060(LS)
- MMBD3004A
- MMBD3004BRM
- MMBD3004C
- MMBD3004S
- MMDT3946FL3
- S1MWF
- UF1003(LS)
- ZTX550
- ZTX550STZ
- ZXGD3101T8TA
|
PCN-2606
|
2023-03-10 |
2023-06-10 |
Discrete |
Change TO263AB Carrier Tape Pitch for Select Discrete Products |
- MBRB10100CT
- MBRB10200CT
- MBRB20100CT
- MBRB20150CT
- MBRB20200CT
|
PCN-2605
|
2023-03-09 |
2023-06-09 |
Analog |
Qualified Additional Cu Pillar Bump Site and Bill of Materials (BOM) Lead Frame Material |
- AP61100
- AP61102
- AP61200
- AP61201
- AP61202
- AP61203
- AP61300
- AP61302
- AP62150
- AP62200
- AP62201
- AP62250
- AP62300
- AP62301
- AP62500
- AP62600
- AP62800
- AP63200
- AP63201
- AP63203
- AP63205
- AP63300
- AP63301
- AP63356
- AP63357
|
PCN-2603
|
2023-03-20 |
2023-06-20 |
Analog |
Qualified Additional Wafer Fab Source (SFAB2/JKFAB), Die Revision, Bill of Material |
- AL1665S
- AL1666S
- AP2213
- AP3036B
- AP39811
- AP3981B
- AP3987
- AP3987CT
- AP3987H
- AP3987V
- GP
- PI5A121BCE
- PI5A3167C
- PT7M3808
- PT7M7809
|
PCN-2602
|
2023-01-31 |
2023-07-31 |
Analog |
Device End of Life (EOL) |
- AL1692
- AL1697
- AL3050FDC
- AL3065AS16
- AL3157F
- AL3158FSG
- AL3159FSG
- AL5812
- AL8805
- AL8807
- AL8807Q
- AL8808
- AL8821
- AP2501
- AP3019A
- AP3154FG
- AP3410
- AP3418
- AP4306
- AP4313
- AP6502
- AP6503
- AP8800A
- AP8801
- AS78L05
- AS78L12
- AS78L15
- AZ431L
- FR2500011
- HX11384001
- LB4310AAPG
- LB4310AAPGB
- LSP2008DATB120
- LSP2008DATB150
- LSP2008DATB180
- LSP2008DATB250
- LSP2008DATB280
- LSP2008DATB300
- LSP2008DATB330
- LSP2009AADB330
- LSP2009BADB330
- LSP2015CATB330
- PAM2805AF_02
- PAM2861
- PAM2863
- PBC500002
- PBC500008
- PBF550015
- PBF550016
- PDF000003
- PI2DBS212
- PI2DBS6212
- PI2DDR321
- PI2DDR3212
- PI2PCIE2212
- PI2PCIE2214
- PI2PCIE2422
- PI2PCIE2442
- PI2USB3212
- PI3HDMI101
- PI3HDMI1310
- PI3HDMI301
- PI3HDMI336
- PI3HDMI412AD
- PI3HDMI412FT-B
- PI3PCIE2215
- PI3PCIE2415
- PI3PCIE2612
- PI3USB102
- PI3USB31534
- PI3VDP12412
- PI3VDP1430
- PI3VDP3212
- PI3VDP411LS
- PI3VDP411LSA
- PI3VDP411LSR
- PI3VDP411LST
- PI3VDP612
- PI3VEDP212
- PI3WVR12612
- PI4ULS3V501
- PI4ULS3V502
- PI6C10804
- PI6C10810
- PI6C485311
- PI6C485352
- PI6ULS5V9306
- PI90LV01
- PI90LV02
- PS8A0010WEX
- PS8A0013PE
- PS8A0014PE
- PS8A0014WEX
- PS8A0015WEX
- PS8A0017PE
- PS8A0020PE
- PS8A0023PE
- PS8A0032PE
- PS8A0032WE
- PS8A0032WEX
- PS8A0034WE
- PS8A0034WEX
- PS8A0040AWE
- PS8A0040AWEX
- PS8A0040CWE
- PS8A0040CWEX
- PS8A0054NWEX
- PS8A0054WEX
- PS8A0057WEX
- PS8A0060WEX
- PS8A0070PE
- PS8A0143AWE
- PS8A0143AWEX
- PS8A0143BWE
- PS8A0143BWEX
- PS8A0143HWE
- PS8A0143HWEX
- PS8A4B05WEX
- PS8A6B01EWEX
- PS8A6B01WEX
- PS8AES02WEX
- PT7A7514WE
- PT7M823
- PT8A2512
- PT8A2515
- PT8A2641
- PT8A2642
- PT8A2645
- PT8A2646
- PT8A2647
- PT8A2648
- PT8A2766J
- PT8A3252
- PT8A3263A
- PT8A3263B
- PT8A9001QE
- PT8A9010WE
- PT8S0001PE
- S1613A
- S1613AA
- S1613B
- S1613E
- SX10GE156
- UV3360001Q
- WT3252I0032.000000
- WT3532014A
- YD2700005
- YJ1630001Q
- YJ2700002
- YJ2700003
- YJ2700004
- YJ2700005Q
- YJ3880001
- YK2250001
- YK2450001
- YK2500001
- YK2500004
- YK2600002
- YK2700004
- YK2700006
- YK2820001
- YK3270002
- YK4000002
- ZABG4003
- ZABG6003
- ZABG6004
- ZD1638LB6/TR-1
|
PCN-2601
|
2022-10-28 |
2023-01-28 |
Discrete |
Additional Wafer Source for Select Discrete Products |
- DMC3021LSD
- DMC3025LDV
- DMC3025LNS
- DMC3025LSD
- DMG2302UK
- DMN1004UFDF
- DMN1004UFV
- DMN1008UFDF
- DMN2056U
- DMN2058U
- DMN2058UW
- DMN3009LFV
- DMN3009LFVW
- DMN3009SSS
- DMN3021LFDF
- DMN3025LFG
- DMN3025LFV
- DMP1005UFDF
- DMP1009UFDF
- DMP1012UFDF
- DMP1012USS
- DMP2007UFG
- DMP2010UFG
- DMP2010UFV
- DMP2165UW
- DMP3007LSS
- DMP3007SCG
- DMP3050LVT
- DMP3056LDM
- DMP3056LSD
- DMP3056LSS
- DMP32M6SPS
- DMT3011LDT
|
PCN-2600
|
2022-10-03 |
2023-04-03 |
Discrete |
Device End of Life (EOL) |
- B1100(LS)
- B1100B(LS)
- SB1100(LS)
- SDM1A30CSP
|
PCN-2599
|
2022-10-11 |
2023-01-11 |
Discrete |
Additional Wafer Source for Select Discrete Products |
- DTH1206D
- DTH1206FP
- DTH8L06D
- DTH8L06DNC
- DTH8L06FP
- ES1G
- ES1G(LS)
- ES1J
- ES1J(LS)
- ES2G
- ES2G(LS)
- ES2GA(LS)
- ES2J(LS)
- ES2JA(LS)
- ES3GB(LS)
- ES3J(LS)
- ES3JB(LS)
- ES5G(LS)
- ES5J(LS)
- FES1GE(LS)
- FES1JD(LS)
- FES1JE(LS)
- LTTH1006LDW(LS)
- LTTH1006LFW(LS)
- LTTH1006LW(LS)
- LTTH1206DFW(LS)
- LTTH1206DW(LS)
- LTTH1506D(LS)
- LTTH1506DF(LS)
- LTTH806LDW(LS)
- LTTH806LF(LS)
- LTTH806LFW(LS)
- MUR160(LS)
- MURS140
- MURS160
- MURS160(LS)
- MURS160A
- MURS160Q
- MURS360
- MURS360(LS)
- MURS360B
- MURS360B(LS)
- MURS460C
- MURS460C(LS)
- SF10JG(LS)
- STPF1040
- STPF1040CT(LS)
- STPF1040CTW(LS)
- STPF1060CT(LS)
- STPR1040
- STPR1040CTW(LS)
- STPR1060CT(LS)
- STPR1240
- STPR1640
- STPR1640CT(LS)
- STPR1640CTW(LS)
- STPR1660CT(LS)
- STPR2040
- STPR2040CTW(LS)
- STPR560D(LS)
- STPR860D(LS)
- STPS1040
- STPS1660
- STPS2060
- US1G(LS)
|