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Diodes Product Change Notices

Welcome to our Product/Process Change Notification (PCN) pages dating back to year 2002. To locate PCNs, please select year from the menu on this page.

Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.

To Automatically Receive PCN Notification / E-mail Alerts

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2433 2019-10-07 2020-04-07 Analog Device End of Life (EOL)
PCN-2432 2019-08-09 2019-08-09 Replacement Wafer FAB Source for RDL Process
PCN-2431 2019-10-31 2020-01-31 Discrete Qualification of Additional Wafer Source for Select Discrete Products
PCN-2430 2019-09-04 2019-09-04 Discrete Semiconductors - Automotive Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source
for Automotive part SBRT3U40P1Q-7
PCN-2429 2019-11-20 2020-02-20 Analog Semiconductors Additional Qualified (AT) Assembly Test Site + BOM + Top Marking
PCN-2428 2019-11-12 2020-02-12 Analog Assembly & Test Site Porting from OSE to Greatek
PCN-2427 2019-10-15 2020-04-15 Analog Device End of Life (EOL)
PCN-2426 2019-08-06 2020-02-06 Analog Device End of Life (EOL)
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.
PCN-2423 2019-06-28 2019-06-28 Discrete Device End of Life
PCN-2422 2019-11-26 2020-02-26 Discrete Addition of A Passivation Layer Over The Top Metal of The Die for Select BJT Products
PCN-2420 2019-09-18 2019-12-18 Discrete Products Clip Bond Structure, Lead Frame Type, and Mold Compound Changes to Enhance PowerDI-123 Package as well as
Qualification of Additional Wafer Source for Select Products
PCN-2419 2019-06-11 2019-09-11 Discrete Products Change of Assembly Lead Plating Process from Bright Tin Coating to Matte Tin Coating for Select TO-126 Products
PCN-2418 2019-11-07 2020-05-07 Discrete Device End of Life (EOL)
PCN-2417 2019-04-24 2019-07-24 Analog Semiconductors Additional Qualified (A/T) Assembly/Test Site
PCN-2415 2019-06-28 2019-12-28 Analog Device End of Life (EOL)
PCN-2411 2019-05-24 2019-11-24 Analog Device End of Life (EOL)
PCN-2408 2019-10-02 2020-01-02 Analog Semiconductors Additional Qualified (AT) Assembly Test Site + BOM + Top Marking
PCN-2404 2019-05-21 2019-08-21 Discrete Automotive Semiconductors Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Automotive Products
PCN-2403 2019-03-25 2019-06-19 Discrete Semiconductors Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.
PCN-2402 2019-05-15 2019-08-15 Discrete Semiconductors Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site and Conversion to Palladium Coated Copper Bond Wire with New Lead Frame Type on Select Products
PCN-2401 2019-01-30 2019-07-30 Analog Device End of Life (EOL)
PCN-2400 2019-05-20 2019-08-20 Analog Semiconductors Additional Qualified (AT) Assembly Test Site
PCN-2400 2019-05-20 2019-08-20 Analog Semiconductors Additional Qualified (AT) Assembly Test Site
PCN-2399 2019-06-19 2019-09-19 Analog Semiconductors Additional Qualified (AT) Assembly/Test Site & Package Supplier
PCN-2398 2019-05-21 2019-08-21 Discrete Semiconductors Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products
PCN-2394 2018-12-20 2019-03-20 Discrete Qualification of Additional Wafer Sources and Additional Assembly and Test Site for Select Products
PCN-2393 2019-01-24 2019-04-24 Discrete Semiconductor Metal Mask Change for select Discrete devices to quantify Turn-On Time
PCN-2391 2019-05-24 2019-08-24 Automotive Discrete Products Clip Bond Structure, Lead Frame Type, and Mold Compound changes to enhance PowerDI-123 package
PCN-2389 2019-02-05 2019-08-05 Discrete Device End of Life
PCN-2386 2019-04-17 2019-07-17 Discrete - Automotive Addition of A Passivation Layer Over The Top Metal of The Die for Select Automotive MOSFET Products
PCN-2383 2018-11-19 2019-02-19 Discrete Metal Mask Change for DPS1133FIA-13, and Datasheet Revision Due to IQ (Quiescent Current) Specification Limits Change
PCN-2382 2018-10-17 2019-01-17 Discrete Semiconductors - Automotive Qualification of Additional Assembly and Test (A/T) site, Conversion to Palladium Coated Copper Bond Wire with Modified Top Metal Composition and Thickness, New Lead Frame Type, New Die Attach Material and New Molding Compound for Part Numbers BCP5616QTA and BCP5616QTC
PCN-2381 2018-10-25 2019-01-25 Analog Qualification of Additional FAB & A/T Source, and/or Bill of Materials (BOM) for Select Products
PCN-2380 2018-11-07 2019-05-07 Analog Device End of Life (EOL)
PCN-2379 2018-11-29 2019-02-28 Discrete Additional qualified suppliers for solderable front metal and back grind/back metal
PCN-2376 2018-11-30 2019-03-01 Discrete Addition of A Passivation Layer Over The Top Metal of The Die
PCN-2374 2018-12-07 2019-03-07 Discrete Semiconductors Qualification of "Diodes Technology (Cheng Du) Company Limited"
(CAT) as an Additional Assembly & Test Site, Conversion to Palladium Coated Copper Bond Wire with New Molding Compound, and Qualification of Alternative Die Source on Select Products
PCN-2369 2019-01-29 2019-04-29 Discrete Semiconductors Qualification of JCET as an Additional Assembly & Test Site for Select Discrete TVS Products in DFN2510 Package
PCN-2366 2018-09-19 2018-12-19 Analog Qualification of Additional Bill of Materials (BOM), Fab Source, A/T Site and Top Marking Change on Select Product
PCN-2365 2018-10-04 2019-04-04 Analog - Automotive Device End of Life (EOL) – Automotive Parts
PCN-2364 2018-10-04 2019-04-04 Analog Device End of Life (EOL)
PCN-2361 2018-07-02 2018-10-02 Analog Qualification of Alternate Wafer Source (SFAB2) for Select Analog Products
PCN-2360 2018-06-29 2018-09-29 Discrete Semiconductors Qualification of Additional Wafer Source for Select TVS Products
PCN-2358 2018-06-28 2018-09-28 Analog Qualification of Alternate Wafer Source (SFAB2) for Select Analog Products
PCN-2353 2018-06-12 2018-09-12 Analog Qualification of Alternate Wafer Source for MOSFET Die used in Select Analog Products
PCN-2348 2018-07-19 2018-10-19 Analog Semiconductors Additional Qualified Assembly/Test (A/T) Site for Select Devices
PCN-2347 2018-05-22 2018-11-22 Discrete Device End of Life (EOL)
PCN-2345 2018-05-29 2018-11-29 Discrete - Automotive Device End of Life (EOL)
PCN-2344 INFORMATIONAL 2018-05-24 2018-06-24 Discrete Carrier tape orientation