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Diodes Product Change Notices

Welcome to our Product/Process Change Notification (PCN) pages dating back to year 2002. To locate PCNs, please select year from the menu on this page.

Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.

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PCN # Issue Date Implementation Date Product Family Change Type
PCN-2265 2017-08-09 2017-11-09 XO IC Qualified additional wafer source (“Fab3”) for PT7C5027KCx Series devices due to (“Fab2”) closure.
PCN-2263 2017-05-02 2017-08-02 Analog Bill of Material (BOM) Changes for Select Analog Parts
PCN-2262 2017-03-16 2017-06-30 Analog Device End of Life (EOL)
PCN-2261 2017-02-24 2017-05-24 Discrete - Automotive Add Additional Plating Process Site at Diodes Technology (Chengdu) Company Limited (CAT) for Select Automotive Parts
PCN-2260 2017-03-15 2017-06-15 EQX Changing the Wafer Fab From Global Foundry to Semiconductor Manufacturing International Corporation (SMIC)
PCN-2259 2017-02-02 2017-02-02 Discrete Qualification of Additional Wafer Sources for Select Discrete Products
PCN-2257 2017-02-06 2017-05-06 Analog Datasheet Change for High Level Gate Driver Output Voltage Minimum and Typical Values on Select Analog Parts
PCN-2254 2016-12-05 2017-03-06 Analog Addition of New Fab/Assembly Site and Design Change
PCN-2253 2017-01-26 2017-07-26 Analog Device End of Life (EOL)
PCN-2252 2017-02-24 2017-05-24 Discrete Add Additional Plating Process Site at Diodes Technology (Chengdu) Company Limited (CAT) for Select Parts
PCN-2250 2016-12-07 2017-03-07 Analog Change of Assembly Materials/Process, and Mechanical Specifications for Various Parts
PCN-2248 2017-02-09 2017-05-09 Analog - Automotive Lead Frame Supplier Change and Datasheet Change for High Level Gate Driver Output Voltage Minimum and Typical Values on Select Analog Automotive Parts
PCN-2246 2017-06-28 2017-09-28 Analog Additional Qualified Assembly/Test (A/T) Site – Chengdu A/T (CAT) with Part Marking Update
PCN-2244 2016-11-22 2017-02-20 Discrete Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, and Conversion to Copper Bond Wire on Select Products at Diodes Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai (SAT)
PCN-2239 2016-07-18 2016-10-16 Analog Additional FAB Source (TPSCo), Additional Assembly/Test Site (SAT) and BOM (Bill of Materials) on select devices
PCN-2236 2016-06-27 2016-09-26 Discrete Die Attach Material and Back Metal Composition changes to improve product performance
PCN-2235 2016-06-14 2016-09-13 Discrete Qualification of Palladium Coated Copper Bond Wire or Bare Copper Bond Wire for Selected SOT-23, SOT-223 and SM-8 Packaged Products
PCN-2231 2016-06-20 2016-09-19 Analog Additional Qualified Assembly/Test (A/T) Site
PCN-2230 2016-06-02 2016-09-01 Analog Additional FAB Source (TPSCo) and BOM (Bill of Materials) on select Analog Automotive devices
PCN-2224 2016-09-02 2016-12-01 Discrete Wafer Diameter Change from 5 inch to 6 inch at Diodes FabTech (KFAB) on selected Automotive “Q” parts
PCN-2223 2016-04-12 2016-07-11 Discrete Qualification of Additional Wafer Fabrication Source, and Conversion to Green Mold Compound
PCN-2221 2016-08-19 2016-11-18 Discrete Addition of A Passivation Layer Over The Top Metal of The Die for Selected BJT Devices
PCN-2220 2016-05-25 2016-08-24 Analog Additional FAB Source (SFAB) and Assembly/Test Site (CAT) on select Analog devices
PCN-2219 2016-01-09 2016-02-29 Analog Additional FAB Source (TPSCo) and BOM (Bill of Materials) on select devices in SOT25 and MSOP8 packages
PCN-2218 2016-01-11 2016-04-10 Analog Additional Qualified BOM (Bill of Materials) on selected devices manufactured at JCET in the DIP-7 package
PCN-2217 2016-01-19 2016-04-18 Analog Top Metal Thickness Change on Selected Analog Products
PCN-2214 2016-01-21 2016-01-21 Analog Qualification of additional assembly/test site JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China for select analog devices in HSOP, MSOP, PSOP, SOIC, SSOP, and TSSOP packages
PCN-2212 2016-03-11 2016-06-10 Analog Conversion to Automatic Wafer Singulation Process for Selected TVS Products
PCN-2209 2015-12-04 2016-03-03 Discrete Datasheet Revision Due to Maximum IR Specification Limits Change
PCN-2208 2016-10-10 2017-01-09 Discrete Qualification of New Lead Frame and Mold Compound and Conversion to Copper Bond Wire on Selected Zener Products
PCN-2204 2015-10-27 2015-10-27 Discrete Part Marking Polarity Identifier Change
PCN-2202 2016-01-21 2016-01-21 Analog Qualification of additional assembly/test site JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China for select analog devices in SOIC-8 packages
PCN-2197 2015-07-29 2015-10-27 Discrete/Analog Semiconductors Qualification of "Diodes Technology (Chengdu) Company Limited" (CAT) as an Additional Plating Site.
PCN-2196 2016-07-12 2016-10-10 Analog Additional Qualified (FAB) Wafer Fabrication / (AT) Assembly Test Sites on selected devices
PCN-2195 2017-01-17 2017-04-17 Analog Bill of Materials (BOM) Changes for Select Analog Devices
PCN-2193 2016-10-31 2017-02-04 Analog Device End of Life
PCN-2188 2017-02-08 2017-08-08 Discrete Device End of Life (EOL)
PCN-2187 2015-03-13 2015-06-12 Discrete Datasheet Revision Due to Relaxation of Maximum Forward Voltage (VF) Specification Limits
PCN-2181 2016-02-23 2016-05-22 Discrete Conversion to Copper Bond Wire, Additional A/T site, and/or Additional Wafer Source with Smaller Die Size on Selected Discrete Products
PCN-2180 2015-02-19 2015-08-19 Discrete Device End of Life
PCN-2169 2015-01-09 2015-04-09 Discrete Lead Frame Structure, Mold Compound and Solder Type changes to enhance PowerDI-5 package
PCN-2166 2015-01-13 2015-02-12 Discrete Addition of Date Code Information to Part Marking
PCN-2156 2015-06-01 2015-09-01 Discrete Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site for Discrete parts, and Conversion to Copper Bond Wire on select Discrete products at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) Assembly & Test Sites (SAT).
PCN-2153 2017-06-09 2017-09-09 Discrete Qualification of Additional Assembly Sites, and Package Outline Dimension Changes
PCN-2150 2015-08-07 2015-08-07 Discrete/Analog Semiconductors Conversion to Diodes Incorporated standard logo on BCD branded products
PCN-2141 2015-04-29 2015-10-25 Analog Device End of Life
PCN-2133 2015-09-25 2015-12-23 Discrete/Analog Semiconductors Qualification of "Diodes Zetex Neuhaus GmbH" as an Additional Assembly & Test Site and Conversion to Palladium Coated Copper Bond Wire for Selected SOT-23F Packaged Products