Welcome to our Product/Process Change Notification (PCN) pages from the last five years. To locate PCNs, please select year from the menu on this page.
Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.
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| PCN # | Issue Date | Implementation Date | Product Family | Change Type |
|---|---|---|---|---|
| PCN-2401 | 2019-01-30 | 2019-07-30 | Analog | Device End of Life (EOL) |
| PCN-2400 | 2019-05-20 | 2019-08-20 | Analog Semiconductors | Additional Qualified (AT) Assembly Test Site |
| PCN-2399 | 2019-06-19 | 2019-09-19 | Analog Semiconductors | Additional Qualified (AT) Assembly/Test Site & Package Supplier |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Discrete Semiconductors | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2394 | 2018-12-20 | 2019-03-20 | Discrete | Qualification of Additional Wafer Sources and Additional Assembly and Test Site for Select Products |
| PCN-2393 | 2019-01-24 | 2019-04-24 | Discrete Semiconductor | Metal Mask Change for select Discrete devices to quantify Turn-On Time |
| PCN-2391 | 2019-05-24 | 2019-08-24 | Automotive Discrete Products | Clip Bond Structure, Lead Frame Type, and Mold Compound changes to enhance PowerDI-123 package |
| PCN-2389 | 2019-02-05 | 2019-08-05 | Discrete | Device End of Life |
| PCN-2386 | 2019-04-17 | 2019-07-17 | Discrete - Automotive | Addition of A Passivation Layer Over The Top Metal of The Die for Select Automotive MOSFET Products |
| PCN-2383 | 2018-11-19 | 2019-02-19 | Discrete | Metal Mask Change for DPS1133FIA-13, and Datasheet Revision Due to IQ (Quiescent Current) Specification Limits Change |
| PCN-2382 | 2018-10-17 | 2019-01-17 | Discrete Semiconductors - Automotive | Qualification of Additional Assembly and Test (A/T) site, Conversion to Palladium Coated Copper Bond Wire with Modified Top Metal Composition and Thickness, New Lead Frame Type, New Die Attach Material and New Molding Compound for Part Numbers BCP5616QTA and BCP5616QTC |
| PCN-2381 | 2018-10-25 | 2019-01-25 | Analog | Qualification of Additional FAB & A/T Source, and/or Bill of Materials (BOM) for Select Products |
| PCN-2380 | 2018-11-07 | 2019-05-07 | Analog | Device End of Life (EOL) |
| PCN-2379 | 2018-11-29 | 2019-02-28 | Discrete | Additional qualified suppliers for solderable front metal and back grind/back metal |
| PCN-2376 | 2018-11-30 | 2019-03-01 | Discrete | Addition of A Passivation Layer Over The Top Metal of The Die |
| PCN-2374 | 2018-12-07 | 2019-03-07 | Discrete Semiconductors | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Conversion to Palladium Coated Copper Bond Wire with New Molding Compound, and Qualification of Alternative Die Source on Select Products |
| PCN-2369 | 2019-01-29 | 2019-04-29 | Discrete Semiconductors | Qualification of JCET as an Additional Assembly & Test Site for Select Discrete TVS Products in DFN2510 Package |
| PCN-2366 | 2018-09-19 | 2018-12-19 | Analog | Qualification of Additional Bill of Materials (BOM), Fab Source, A/T Site and Top Marking Change on Select Product |
| PCN-2365 | 2018-10-04 | 2019-04-04 | Analog - Automotive | Device End of Life (EOL) – Automotive Parts |
| PCN-2364 | 2018-10-04 | 2019-04-04 | Analog | Device End of Life (EOL) |
| PCN-2361 | 2018-07-02 | 2018-10-02 | Analog | Qualification of Alternate Wafer Source (SFAB2) for Select Analog Products |
| PCN-2360 | 2018-06-29 | 2018-09-29 | Discrete Semiconductors | Qualification of Additional Wafer Source for Select TVS Products |
| PCN-2358 | 2018-06-28 | 2018-09-28 | Analog | Qualification of Alternate Wafer Source (SFAB2) for Select Analog Products |
| PCN-2353 | 2018-06-12 | 2018-09-12 | Analog | Qualification of Alternate Wafer Source for MOSFET Die used in Select Analog Products |
| PCN-2348 | 2018-07-19 | 2018-10-19 | Analog Semiconductors | Additional Qualified Assembly/Test (A/T) Site for Select Devices |
| PCN-2347 | 2018-05-22 | 2018-11-22 | Discrete | Device End of Life (EOL) |
| PCN-2345 | 2018-05-29 | 2018-11-29 | Discrete - Automotive | Device End of Life (EOL) |
| PCN-2344 INFORMATIONAL | 2018-05-24 | 2018-06-24 | Discrete | Carrier tape orientation |
| PCN-2343 | 2018-05-15 | 2018-08-15 | Analog | Qualification of Additional Bill of Materials (BOM), Fab Source for Select Products with Top Marking Change on Select Product |
| PCN-2342 | 2018-05-31 | 2018-11-30 | Analog | Device End of Life (EOL) |
| PCN-2341 | 2019-02-27 | 2019-05-27 | Discrete | Qualification of Additional Wafer Source for Select Automotive Products |
| PCN-2340 | 2018-04-26 | 2018-05-26 | Discrete | Qualification of Alternate Wafer Sources for Select MOSFET Products |
| PCN-2339 | 2018-06-15 | 2018-09-15 | Discrete | Qualification of Additional Wafer Source for Select Products |
| PCN-2337 | 2018-06-04 | 2018-05-04 | Discrete | Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products |
| PCN-2336 | 2018-05-24 | 2018-11-24 | Analog | Device End of Life (EOL) |
| PCN-2335 | 2018-09-12 | 2019-03-12 | Analog | Device End of Life (EOL) |
| PCN-2331 | 2018-03-22 | 2018-06-22 | Analog Semiconductors | Additional Qualified BOM (Bill of Materials) on Selected Devices |
| PCN-2330 | 2018-03-29 | 2018-07-29 | Discrete Semiconductors | Qualification of Additional A/T site and Conversion to Palladium Coated Copper Bond Wire on Select Discrete Products |
| PCN-2328 | 2018-04-12 | 2018-10-12 | Analog | Device End of Life for tray packaging only |
| PCN-2327 (Advance Notice) | 2018-04-20 | 2020-11-11 | Analog | Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and Bond Wire Change |
| PCN-2326 - Rev 3 (Interim Update) | 2018-04-20 | 2020-12-30 | Analog | Fab Porting from Global Foundries to MagnaChip |
| PCN-2325 – Rev 3 (Interim Update) | 2018-04-20 | 2020-11-20 | Analog | Fab Porting from Global Foundries to MagnaChip |
| PCN-2324 | 2018-02-28 | 2018-05-28 | Discrete Automotive | Addition of A Passivation Layer Over The Top Metal of The Die for Selected Automotive BJT Devices |
| PCN-2322 (Advance Notice) | 2018-03-19 | 2020-03-15 | Analog Automotive | Fab Porting from Global Foundries to MagnaChip |
| PCN-2321 | 2018-02-22 | 2018-08-22 | Analog | Device End of Life (EOL) |
| PCN-2319 | 2018-03-09 | 2018-06-09 | Discrete Automotive | Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility |
| PCN-2318 | 2018-01-22 | 2018-01-22 | Discrete | Device End of Life (EOL) |
| PCN-2315 | 2018-03-09 | 2018-06-09 | Discrete | Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility |
| PCN-2313 | 2019-10-21 | 2020-01-21 | Discrete Semiconductors | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Conversion to Copper Bond Wire, and Qualification of Additional Die Passivation Layer on Select Products |
| PCN-2312 | 2018-04-11 | 2018-07-11 | Analog | Qualification of Additional Bill of Materials (BOM), Top Marking, and Fab Source for Select Products |
