Welcome to our Product/Process Change Notification (PCN) pages dating back to year 2002. To locate PCNs, please select year from the menu on this page.
Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.
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| PCN # | Issue Date | Implementation Date | Product Family | Change Type |
|---|---|---|---|---|
| PCN-2265 | 2017-08-09 | 2017-11-09 | XO IC | Qualified additional wafer source (“Fab3”) for PT7C5027KCx Series devices due to (“Fab2”) closure. |
| PCN-2263 | 2017-05-02 | 2017-08-02 | Analog | Bill of Material (BOM) Changes for Select Analog Parts |
| PCN-2262 | 2017-03-16 | 2017-06-30 | Analog | Device End of Life (EOL) |
| PCN-2261 | 2017-02-24 | 2017-05-24 | Discrete - Automotive | Add Additional Plating Process Site at Diodes Technology (Chengdu) Company Limited (CAT) for Select Automotive Parts |
| PCN-2260 | 2017-03-15 | 2017-06-15 | EQX | Changing the Wafer Fab From Global Foundry to Semiconductor Manufacturing International Corporation (SMIC) |
| PCN-2259 | 2017-02-02 | 2017-02-02 | Discrete | Qualification of Additional Wafer Sources for Select Discrete Products |
| PCN-2257 | 2017-02-06 | 2017-05-06 | Analog | Datasheet Change for High Level Gate Driver Output Voltage Minimum and Typical Values on Select Analog Parts |
| PCN-2254 | 2016-12-05 | 2017-03-06 | Analog | Addition of New Fab/Assembly Site and Design Change |
| PCN-2253 | 2017-01-26 | 2017-07-26 | Analog | Device End of Life (EOL) |
| PCN-2252 | 2017-02-24 | 2017-05-24 | Discrete | Add Additional Plating Process Site at Diodes Technology (Chengdu) Company Limited (CAT) for Select Parts |
| PCN-2250 | 2016-12-07 | 2017-03-07 | Analog | Change of Assembly Materials/Process, and Mechanical Specifications for Various Parts |
| PCN-2248 | 2017-02-09 | 2017-05-09 | Analog - Automotive | Lead Frame Supplier Change and Datasheet Change for High Level Gate Driver Output Voltage Minimum and Typical Values on Select Analog Automotive Parts |
| PCN-2246 | 2017-06-28 | 2017-09-28 | Analog | Additional Qualified Assembly/Test (A/T) Site – Chengdu A/T (CAT) with Part Marking Update |
| PCN-2244 | 2016-11-22 | 2017-02-20 | Discrete | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, and Conversion to Copper Bond Wire on Select Products at Diodes Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai (SAT) |
| PCN-2239 | 2016-07-18 | 2016-10-16 | Analog | Additional FAB Source (TPSCo), Additional Assembly/Test Site (SAT) and BOM (Bill of Materials) on select devices |
| PCN-2236 | 2016-06-27 | 2016-09-26 | Discrete | Die Attach Material and Back Metal Composition changes to improve product performance |
| PCN-2235 | 2016-06-14 | 2016-09-13 | Discrete | Qualification of Palladium Coated Copper Bond Wire or Bare Copper Bond Wire for Selected SOT-23, SOT-223 and SM-8 Packaged Products |
| PCN-2231 | 2016-06-20 | 2016-09-19 | Analog | Additional Qualified Assembly/Test (A/T) Site |
| PCN-2230 | 2016-06-02 | 2016-09-01 | Analog | Additional FAB Source (TPSCo) and BOM (Bill of Materials) on select Analog Automotive devices |
| PCN-2224 | 2016-09-02 | 2016-12-01 | Discrete | Wafer Diameter Change from 5 inch to 6 inch at Diodes FabTech (KFAB) on selected Automotive “Q” parts |
| PCN-2223 | 2016-04-12 | 2016-07-11 | Discrete | Qualification of Additional Wafer Fabrication Source, and Conversion to Green Mold Compound |
| PCN-2221 | 2016-08-19 | 2016-11-18 | Discrete | Addition of A Passivation Layer Over The Top Metal of The Die for Selected BJT Devices |
| PCN-2220 | 2016-05-25 | 2016-08-24 | Analog | Additional FAB Source (SFAB) and Assembly/Test Site (CAT) on select Analog devices |
| PCN-2219 | 2016-01-09 | 2016-02-29 | Analog | Additional FAB Source (TPSCo) and BOM (Bill of Materials) on select devices in SOT25 and MSOP8 packages |
| PCN-2218 | 2016-01-11 | 2016-04-10 | Analog | Additional Qualified BOM (Bill of Materials) on selected devices manufactured at JCET in the DIP-7 package |
| PCN-2217 | 2016-01-19 | 2016-04-18 | Analog | Top Metal Thickness Change on Selected Analog Products |
| PCN-2214 | 2016-01-21 | 2016-01-21 | Analog | Qualification of additional assembly/test site JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China for select analog devices in HSOP, MSOP, PSOP, SOIC, SSOP, and TSSOP packages |
| PCN-2212 | 2016-03-11 | 2016-06-10 | Analog | Conversion to Automatic Wafer Singulation Process for Selected TVS Products |
| PCN-2209 | 2015-12-04 | 2016-03-03 | Discrete | Datasheet Revision Due to Maximum IR Specification Limits Change |
| PCN-2208 | 2016-10-10 | 2017-01-09 | Discrete | Qualification of New Lead Frame and Mold Compound and Conversion to Copper Bond Wire on Selected Zener Products |
| PCN-2204 | 2015-10-27 | 2015-10-27 | Discrete | Part Marking Polarity Identifier Change |
| PCN-2202 | 2016-01-21 | 2016-01-21 | Analog | Qualification of additional assembly/test site JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China for select analog devices in SOIC-8 packages |
| PCN-2197 | 2015-07-29 | 2015-10-27 | Discrete/Analog Semiconductors | Qualification of "Diodes Technology (Chengdu) Company Limited" (CAT) as an Additional Plating Site. |
| PCN-2196 | 2016-07-12 | 2016-10-10 | Analog | Additional Qualified (FAB) Wafer Fabrication / (AT) Assembly Test Sites on selected devices |
| PCN-2195 | 2017-01-17 | 2017-04-17 | Analog | Bill of Materials (BOM) Changes for Select Analog Devices |
| PCN-2193 | 2016-10-31 | 2017-02-04 | Analog | Device End of Life |
| PCN-2188 | 2017-02-08 | 2017-08-08 | Discrete | Device End of Life (EOL) |
| PCN-2187 | 2015-03-13 | 2015-06-12 | Discrete | Datasheet Revision Due to Relaxation of Maximum Forward Voltage (VF) Specification Limits |
| PCN-2181 | 2016-02-23 | 2016-05-22 | Discrete | Conversion to Copper Bond Wire, Additional A/T site, and/or Additional Wafer Source with Smaller Die Size on Selected Discrete Products |
| PCN-2180 | 2015-02-19 | 2015-08-19 | Discrete | Device End of Life |
| PCN-2169 | 2015-01-09 | 2015-04-09 | Discrete | Lead Frame Structure, Mold Compound and Solder Type changes to enhance PowerDI-5 package |
| PCN-2166 | 2015-01-13 | 2015-02-12 | Discrete | Addition of Date Code Information to Part Marking |
| PCN-2156 | 2015-06-01 | 2015-09-01 | Discrete | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site for Discrete parts, and Conversion to Copper Bond Wire on select Discrete products at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) Assembly & Test Sites (SAT). |
| PCN-2153 | 2017-06-09 | 2017-09-09 | Discrete | Qualification of Additional Assembly Sites, and Package Outline Dimension Changes |
| PCN-2150 | 2015-08-07 | 2015-08-07 | Discrete/Analog Semiconductors | Conversion to Diodes Incorporated standard logo on BCD branded products |
| PCN-2141 | 2015-04-29 | 2015-10-25 | Analog | Device End of Life |
| PCN-2133 | 2015-09-25 | 2015-12-23 | Discrete/Analog Semiconductors | Qualification of "Diodes Zetex Neuhaus GmbH" as an Additional Assembly & Test Site and Conversion to Palladium Coated Copper Bond Wire for Selected SOT-23F Packaged Products |
