Diodes Menu Close

Diodes 产品变更说明

 欢迎访问我们2016年的产品/制程变更通知(PCN)页面。要查找PCN,请从本页菜单中选择年份。

 每个 PCN 皆提供联络人与实施日期、提醒类别与类型、PCN 号码、标题、影响、变更说明,以及 Diodes 所制造且受到产品/制程变更之影响的完整组件列表。若要检视 PCN,请单击 PCN# PDF。

若要自动接收 PCN 通知/电子邮件提醒

 

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2600 2022-10-03 2023-04-03 Discrete Device End of Life (EOL)
PCN-2598 2022-08-25 2022-08-25 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan
PCN-2597 2022-09-16 2022-12-16 Discrete Change GBPC (W) Package Outline Dimensions for Select Products
PCN-2596 2022-09-08 2022-12-08 Analog – Automotive Qualified Additional Wafer Fab “Key Foundry” Source located in Cheongju, Korea - Automotive
PCN-2595 2022-09-08 2022-12-08 Analog Qualified Additional Wafer Fab Source, Die Revisions, Bill of Materials, and Data Sheet Changes
PCN-2594 2022-08-31 2023-02-28 Analog Device End of Life (EOL)
PCN-2592 2022-09-12 2022-12-12 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site Using PdCu Bond Wire and New Lead Frame for Select Products
PCN-2591 2022-06-21 2022-09-21 Discrete Semiconductors Change of Lead Frame Type for Select Automotive Products
PCN-2590 2022-06-01 2022-09-01 Discrete - Automotive Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2589 2022-05-11 2022-08-11 Discrete - Automotive Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH) - Automotive
PCN-2588 2022-06-01 2022-09-01 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products
PCN-2587 2022-05-13 2022-11-13 Analog Device End of Life (EOL)
PCN-2586 2022-06-08 2022-09-08 Analog - Automotive Qualified Additional Wafer Fab Backend IMD Material and Process - Automotive
PCN-2585 2022-06-08 2022-09-08 Analog Semiconductors Qualified Additional Assembly/Test (A/T) Sites, Wafer Fab IMD Backend, and Package Outline Dimension Change
PCN-2584 2022-05-19 2022-11-19 Discrete Device End of Life (EOL)
PCN-2582 2022-05-17 2022-08-17 Discrete Semiconductors Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH)
PCN-2581 2022-05-10 2022-08-10 Discrete Additional Wafer Source for Select Discrete Products
PCN-2579 2022-08-29 2023-02-28 Discrete Device End of Life (EOL)
PCN-2578 2022-04-26 2022-06-30 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan, and Device End of Life
(EOL)
PCN-2576 2022-03-01 2022-06-01 Discrete - Automotive Wafer Diameter Change from 6 inch to 8 inch at Diodes Internal BCD (Shanghai) Micro-Electronics Limited (SFAB2) in Shanghai, China for Select Automotive Products
PCN-2575 2022-04-05 2022-07-05 Analog Semiconductors Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH)
PCN-2574 2022-04-05 2022-07-05 Analog - Automotive Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH)
PCN-2572 2022-02-15 2022-02-15 Discrete Qualification of Additional Wafer Source
PCN-2571 2022-03-17 2022-06-17 Discrete Qualification of Additional Diodes Internal Assembly & Test Site (SAT)
PCN-2570 2022-03-02 2022-06-02 Discrete - Automotive Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire, New Mold Compound Type, and New Die Attach Material for Select Automotive Products
PCN-2568 2022-03-29 2022-03-29 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Sites, Bill of Material, and updated Data Sheets for Package Outline Dimension Change
PCN-2567 2022-03-30 2022-09-30 Analog Semiconductors Device End of Life (EOL)
PCN-2566 2022-03-31 2022-09-30 Discrete Device End of Life (EOL)
PCN-2564 2021-12-30 2021-12-30 Discrete Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Discrete Products
PCN-2563 2021-12-29 2022-03-29 Discrete - Automotive Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Automotive Products
PCN-2562 2022-01-04 2022-04-04 Discrete Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2561 2022-02-17 2022-08-17 Discrete Device End of Life (EOL)
PCN-2560 2021-12-16 2021-12-16 Discrete Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT)
PCN-2559 2021-12-01 2022-03-01 Discrete Wafer Diameter Change from 3 inch to 4 inch at Diodes Shanghai Seefull Electronic Co., Ltd. (SSEC FAB) on Select Products
PCN-2558 2021-11-12 2022-05-12 Analog Device End of Life (EOL)
PCN-2556 2021-11-22 2022-05-22 Discrete Device End of Life (EOL)
PCN-2555 2021-11-11 2022-05-11 Analog Device End of Life (EOL)
PCN-2554 2021-11-15 2022-02-15 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Sites, Bill of Material (BOM) and updated Data Sheets for Package Outline
Dimension Change
PCN-2553 2021-11-12 2022-02-12 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site with Standardization of Assembly Bill of Materials at CAT for Select Discrete Products
PCN-2552 2021-12-15 2021-12-15 Discrete Add Product Ordering Information on Device Data Sheets for Select Lite-On Semiconductor (LSC) Brand Products
PCN-2551 2021-11-10 2022-05-10 Discrete Device End of Life (EOL)
PCN-2550 2021-12-20 2022-06-20 Discrete Device End of Life (EOL)
PCN-2549 2021-10-19 2022-04-19 Discrete Device End of Life (EOL)
PCN-2548 2021-10-08 2022-01-08 Analog Semiconductors Additional Wafer Source (JKFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Assembly/Test (A/T) Site (CAT)
PCN-2546 2021-09-23 2021-12-23 Discrete Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan for Select Lite-On Semiconductor (LSC) Brand Automotive Products.
PCN-2545 2021-10-05 2022-01-05 Discrete - Automotive Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products
PCN-2544 2021-10-05 2022-01-05 Discrete Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Products
PCN-2543 2021-08-30 2021-11-30 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products in SMA Package
PCN-2542 2021-08-30 2021-11-30 Discrete Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package
PCN-2540 2021-08-08 2021-11-08 Analog Semiconductors Qualified Additional Fab Site, Assembly/Test (A/T) Sites, Bill of Material (BOM) and updated Device Data Sheets