欢迎使用我们的产品/制程变更通知 (PCN) 页面，时间可追溯至 2002 年。为了找到 PCN，请在本页的选单中选择年份。
每个 PCN 皆提供联络人与实施日期、提醒类别与类型、PCN 号码、标题、影响、变更说明，以及 Diodes 所制造且受到产品/制程变更之影响的完整组件列表。若要检视 PCN，请单击 PCN# PDF。
| PCN # | Issue Date | Implementation Date | Product Family | Change Type |
|---|---|---|---|---|
| PCN-2514 | 2021-03-09 | 2021-06-09 | Analog | Additional Wafer Source JKFAB |
| PCN-2513 | 2021-03-08 | 2021-06-08 | Analog - Automotive | Additional Wafer Source GFAB - Automotive |
| PCN-2512 | 2021-04-16 | 2021-07-16 | Analog Semiconductors | Qualified Additional Assembly & Test (A/T) Site |
| PCN-2510 | 2021-02-26 | 2021-05-26 | Analog Semiconductors | Qualified Additional A/T Sites, Fab Site and Data Sheet Change |
| PCN-2509 | 2021-02-09 | 2021-05-09 | Analog Semiconductors (Automotive) | Qualified Additional FL Series Package (Automotive) |
| PCN-2508 | 2021-03-17 | 2021-03-18 | Discrete | Change Date Code Marking Information from “YM” (Year/Month) to “YW” (Year/Week) |
| PCN-2507 | 2021-02-03 | 2021-05-03 | Discrete and Analog Semiconductors | Qualification of Additional Wafer Backside Material Supplier |
| PCN-2506 | 2021-02-09 | 2021-05-09 | Analog Semiconductors | Qualified Additional FL Series Package |
| PCN-2505 | 2021-01-26 | 2021-07-26 | Analog | Device End of Life (EOL) |
| PCN-2502 | 2021-03-15 | 2021-09-15 | Discrete | Device End of Life (EOL) |
| PCN-2501 | 2021-01-13 | 2021-04-13 | Analog Semiconductors | Qualified Additional A/T Sites |
| PCN-2500 | 2021-03-24 | 2021-06-24 | Discrete Semiconductors | Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for Automotive Products |
| PCN-2498 | 2021-04-07 | 2021-04-07 | Discrete | Qualification of Additional Wafer Source, and Additional Assembly and Test (A/T) Site for Select Discrete Products |
| PCN-2495 | 2021-03-31 | 2021-07-01 | Discrete Semiconductors | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2493 | 2020-12-28 | 2021-03-28 | Analog Semiconductors | Qualified Additional A/T Sites and Bill of Materials (BOM) |
| PCN-2492 | 2020-11-04 | 2021-05-04 | Analog | Device End of Life (EOL) |
| PCN-2491 | 2020-11-17 | 2021-05-17 | Discrete | Device End of Life (EOL) |
| PCN-2490 | 2020-10-22 | 2021-01-22 | Analog | Additional Wafer Source (LiteOn Semiconductor Corp.) |
| PCN-2488 | 2020-10-20 | 2021-01-20 | Analog | Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and BOM Change |
| PCN-2487 | 2020-10-07 | 2021-01-07 | Analog | Fab Porting from Global Foundries to Magnachip, Assembly & Test Site Transfer, and Datasheet Change |
| PCN-2485 | 2020-12-04 | 2021-03-04 | Discrete (Automotive) | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Qualification of Additional Wafer Source for Select Discrete Automotive Products |
| PCN-2484 | 2020-11-04 | 2021-02-04 | Discrete Semiconductors | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Standardization of Assembly Bill of Materials At The Existing CAT Site for Select Discrete Products |
| PCN-2481 | 2020-08-26 | 2021-02-26 | Analog | Device End of Life (EOL) |
| PCN-2480 | 2020-10-21 | 2021-01-21 | Analog Semiconductors | Additional Qualified (AT) Assembly Test Site SIMAT |
| PCN-2478 | 2020-08-11 | 2020-11-23 | Discrete - Automotive | Additional Wafer Source (GFAB) |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Discrete | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2475 | 2020-08-06 | 2020-11-06 | Discrete | Qualification of Assembly & Test Site Transfer for Select Discrete Products |
| PCN-2474 | 2020-12-16 | 2021-03-16 | Discrete | Qualification of Additional Wafer Source for Select Discrete Products |
| PCN-2472 | 2020-08-13 | 2021-02-13 | Discrete - Automotive | Device End of Life (EOL) - Automotive |
| PCN-2471 | 2020-07-01 | 2020-11-29 | Analog Semiconductors | Additional Wafer Source - GFAB |
| PCN-2466 | 2020-07-02 | 2020-10-02 | Analog Semiconductors | Package Change and Additional Qualified Plating Source |
| PCN-2465 | 2020-07-02 | 2020-10-02 | Analog - Automotive | Additional Qualified Plating Source - Automotive |
| PCN-2464 | 2020-04-28 | 2020-10-28 | Analog | Device End of Life (EOL) |
| PCN-2462 | 2020-05-08 | 2021-04-11 | Discrete - Automotive | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive) |
| PCN-2461 | 2020-05-08 | 2021-04-05 | Discrete | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site |
| PCN-2460 | 2020-05-12 | 2020-05-12 | Discrete Semiconductors | Qualified Additional Wafer Source and BGBM Source |
| PCN-2459 | 2020-05-28 | 2020-11-28 | Discrete | Device End of Life (EOL) |
| PCN-2458 | 2020-07-01 | 2020-10-01 | Discrete | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2457 | 2020-05-27 | 2020-08-27 | Discrete - Automotive | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, and Change to Palladium Coated Copper Bond Wire, and New Mold Compound on Select Automotive Products |
| PCN-2456 | 2020-05-29 | 2020-08-29 | Discrete Semiconductors | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site Using Copper or Palladium Coated Copper Bond Wire with Standardization of Assembly Bill of Materials, Or as an Additional Wafer Plating, Back Grinding and Back Metal Process Source, and Qualification of Additional Wafer Source for Select Discrete Products. |
| PCN-2455 | 2020-03-11 | 2020-06-11 | Analog Semiconductors | New Die Revision Change |
| PCN-2453 | 2020-04-07 | 2020-10-07 | Discrete | Device End of Life (EOL) |
| PCN-2450 | 2020-02-17 | 2020-05-17 | Discrete | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2449 | 2020-02-14 | 2020-05-14 | Discrete | Qualification of Additional Wafer Sources for Select Discrete Products |
| PCN-2448 | 2020-02-05 | 2020-08-05 | Analog | Device End of Life (EOL) |
| PCN-2447 | 2020-01-30 | 2020-04-30 | Analog | Additional Qualified (FAB) Wafer Fab Source, (A/T) Assembly/Test Site, and (BOM) Bill of Materials |
| PCN-2446 | 2020-01-24 | 2020-01-24 | Discrete | Change Date Code Marking Information from “YM” (Year/Month) to “YW” (Year/Week) |
| PCN-2439 | 2019-12-05 | 2020-03-05 | Discrete Semiconductors | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Using Gold Bond Wire, and as an Additional Wafer Back Grinding and Back Metal Process Source on Select MOSFET Products |
| PCN-2438 | 2020-02-13 | 2020-05-13 | Analog Semiconductors | Data Sheet Change and Additional Qualified Package BOM |
| PCN-2436 | 2019-11-14 | 2020-05-14 | Analog | Device End of Life (EOL) |
