欢迎访问我们2016年的产品/制程变更通知（PCN）页面。要查找PCN，请从本页菜单中选择年份。
每个 PCN 皆提供联络人与实施日期、提醒类别与类型、PCN 号码、标题、影响、变更说明，以及 Diodes 所制造且受到产品/制程变更之影响的完整组件列表。若要检视 PCN，请单击 PCN# PDF。
| PCN # | Issue Date | Implementation Date | Product Family | Change Type |
|---|---|---|---|---|
| PCN-2600 | 2022-10-03 | 2023-04-03 | Discrete | Device End of Life (EOL) |
| PCN-2598 | 2022-08-25 | 2022-08-25 | Discrete | Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan |
| PCN-2597 | 2022-09-16 | 2022-12-16 | Discrete | Change GBPC (W) Package Outline Dimensions for Select Products |
| PCN-2596 | 2022-09-08 | 2022-12-08 | Analog – Automotive | Qualified Additional Wafer Fab “Key Foundry” Source located in Cheongju, Korea - Automotive |
| PCN-2595 | 2022-09-08 | 2022-12-08 | Analog | Qualified Additional Wafer Fab Source, Die Revisions, Bill of Materials, and Data Sheet Changes |
| PCN-2594 | 2022-08-31 | 2023-02-28 | Analog | Device End of Life (EOL) |
| PCN-2592 | 2022-09-12 | 2022-12-12 | Discrete Semiconductors | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site Using PdCu Bond Wire and New Lead Frame for Select Products |
| PCN-2591 | 2022-06-21 | 2022-09-21 | Discrete Semiconductors | Change of Lead Frame Type for Select Automotive Products |
| PCN-2590 | 2022-06-01 | 2022-09-01 | Discrete - Automotive | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products |
| PCN-2589 | 2022-05-11 | 2022-08-11 | Discrete - Automotive | Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH) - Automotive |
| PCN-2588 | 2022-06-01 | 2022-09-01 | Discrete | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2587 | 2022-05-13 | 2022-11-13 | Analog | Device End of Life (EOL) |
| PCN-2586 | 2022-06-08 | 2022-09-08 | Analog - Automotive | Qualified Additional Wafer Fab Backend IMD Material and Process - Automotive |
| PCN-2585 | 2022-06-08 | 2022-09-08 | Analog Semiconductors | Qualified Additional Assembly/Test (A/T) Sites, Wafer Fab IMD Backend, and Package Outline Dimension Change |
| PCN-2584 | 2022-05-19 | 2022-11-19 | Discrete | Device End of Life (EOL) |
| PCN-2582 | 2022-05-17 | 2022-08-17 | Discrete Semiconductors | Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH) |
| PCN-2581 | 2022-05-10 | 2022-08-10 | Discrete | Additional Wafer Source for Select Discrete Products |
| PCN-2579 | 2022-08-29 | 2023-02-28 | Discrete | Device End of Life (EOL) |
| PCN-2578 | 2022-04-26 | 2022-06-30 | Discrete | Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan, and Device End of Life (EOL) |
| PCN-2576 | 2022-03-01 | 2022-06-01 | Discrete - Automotive | Wafer Diameter Change from 6 inch to 8 inch at Diodes Internal BCD (Shanghai) Micro-Electronics Limited (SFAB2) in Shanghai, China for Select Automotive Products |
| PCN-2575 | 2022-04-05 | 2022-07-05 | Analog Semiconductors | Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH) |
| PCN-2574 | 2022-04-05 | 2022-07-05 | Analog - Automotive | Qualified Additional Bill of Material (BOM) - Lead Frame Raw Material (C19400 FH) |
| PCN-2572 | 2022-02-15 | 2022-02-15 | Discrete | Qualification of Additional Wafer Source |
| PCN-2571 | 2022-03-17 | 2022-06-17 | Discrete | Qualification of Additional Diodes Internal Assembly & Test Site (SAT) |
| PCN-2570 | 2022-03-02 | 2022-06-02 | Discrete - Automotive | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire, New Mold Compound Type, and New Die Attach Material for Select Automotive Products |
| PCN-2568 | 2022-03-29 | 2022-03-29 | Analog Semiconductors | Qualified Additional Assembly & Test (A/T) Sites, Bill of Material, and updated Data Sheets for Package Outline Dimension Change |
| PCN-2567 | 2022-03-30 | 2022-09-30 | Analog Semiconductors | Device End of Life (EOL) |
| PCN-2566 | 2022-03-31 | 2022-09-30 | Discrete | Device End of Life (EOL) |
| PCN-2564 | 2021-12-30 | 2021-12-30 | Discrete | Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Discrete Products |
| PCN-2563 | 2021-12-29 | 2022-03-29 | Discrete - Automotive | Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Automotive Products |
| PCN-2562 | 2022-01-04 | 2022-04-04 | Discrete | Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products |
| PCN-2561 | 2022-02-17 | 2022-08-17 | Discrete | Device End of Life (EOL) |
| PCN-2560 | 2021-12-16 | 2021-12-16 | Discrete | Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT) |
| PCN-2559 | 2021-12-01 | 2022-03-01 | Discrete | Wafer Diameter Change from 3 inch to 4 inch at Diodes Shanghai Seefull Electronic Co., Ltd. (SSEC FAB) on Select Products |
| PCN-2558 | 2021-11-12 | 2022-05-12 | Analog | Device End of Life (EOL) |
| PCN-2556 | 2021-11-22 | 2022-05-22 | Discrete | Device End of Life (EOL) |
| PCN-2555 | 2021-11-11 | 2022-05-11 | Analog | Device End of Life (EOL) |
| PCN-2554 | 2021-11-15 | 2022-02-15 | Analog Semiconductors | Qualified Additional Assembly & Test (A/T) Sites, Bill of Material (BOM) and updated Data Sheets for Package Outline Dimension Change |
| PCN-2553 | 2021-11-12 | 2022-02-12 | Discrete Semiconductors | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site with Standardization of Assembly Bill of Materials at CAT for Select Discrete Products |
| PCN-2552 | 2021-12-15 | 2021-12-15 | Discrete | Add Product Ordering Information on Device Data Sheets for Select Lite-On Semiconductor (LSC) Brand Products |
| PCN-2551 | 2021-11-10 | 2022-05-10 | Discrete | Device End of Life (EOL) |
| PCN-2550 | 2021-12-20 | 2022-06-20 | Discrete | Device End of Life (EOL) |
| PCN-2549 | 2021-10-19 | 2022-04-19 | Discrete | Device End of Life (EOL) |
| PCN-2548 | 2021-10-08 | 2022-01-08 | Analog Semiconductors | Additional Wafer Source (JKFAB), New Bill of Materials (BOM) with PdCu Bond Wire, and Assembly/Test (A/T) Site (CAT) |
| PCN-2546 | 2021-09-23 | 2021-12-23 | Discrete | Transfer Assembly and Test Line to Diodes Subcontractor Eris Technology Corp. (ERIS) in Taiwan for Select Lite-On Semiconductor (LSC) Brand Automotive Products. |
| PCN-2545 | 2021-10-05 | 2022-01-05 | Discrete - Automotive | Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products |
| PCN-2544 | 2021-10-05 | 2022-01-05 | Discrete | Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Products |
| PCN-2543 | 2021-08-30 | 2021-11-30 | Discrete | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products in SMA Package |
| PCN-2542 | 2021-08-30 | 2021-11-30 | Discrete | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |
| PCN-2540 | 2021-08-08 | 2021-11-08 | Analog Semiconductors | Qualified Additional Fab Site, Assembly/Test (A/T) Sites, Bill of Material (BOM) and updated Device Data Sheets |
