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Diodes 产品变更说明

 

欢迎使用我们的产品/制程变更通知 (PCN) 页面,时间可追溯至 2002 年。为了找到 PCN,请在本页的选单中选择年份。

每个 PCN 皆提供联络人与实施日期、提醒类别与类型、PCN 号码、标题、影响、变更说明,以及 Diodes 所制造且受到产品/制程变更之影响的完整组件列表。若要检视 PCN,请单击 PCN# PDF。

若要自动接收 PCN 通知/电子邮件提醒

PCN # Issue Date Implementation Date Product Family Change Type
PCN-2514 2021-03-09 2021-06-09 Analog Additional Wafer Source JKFAB
PCN-2513 2021-03-08 2021-06-08 Analog - Automotive Additional Wafer Source GFAB - Automotive
PCN-2512 2021-04-16 2021-07-16 Analog Semiconductors Qualified Additional Assembly & Test (A/T) Site
PCN-2510 2021-02-26 2021-05-26 Analog Semiconductors Qualified Additional A/T Sites, Fab Site and Data Sheet Change
PCN-2509 2021-02-09 2021-05-09 Analog Semiconductors (Automotive) Qualified Additional FL Series Package (Automotive)
PCN-2508 2021-03-17 2021-03-18 Discrete Change Date Code Marking Information from “YM” (Year/Month) to “YW” (Year/Week)
PCN-2507 2021-02-03 2021-05-03 Discrete and Analog Semiconductors Qualification of Additional Wafer Backside Material Supplier
PCN-2506 2021-02-09 2021-05-09 Analog Semiconductors Qualified Additional FL Series Package
PCN-2505 2021-01-26 2021-07-26 Analog Device End of Life (EOL)
PCN-2502 2021-03-15 2021-09-15 Discrete Device End of Life (EOL)
PCN-2501 2021-01-13 2021-04-13 Analog Semiconductors Qualified Additional A/T Sites
PCN-2500 2021-03-24 2021-06-24 Discrete Semiconductors Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products
PCN-2498 2021-04-07 2021-04-07 Discrete Qualification of Additional Wafer Source, and Additional Assembly and Test (A/T) Site for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Discrete Semiconductors Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2493 2020-12-28 2021-03-28 Analog Semiconductors Qualified Additional A/T Sites and Bill of Materials (BOM)
PCN-2492 2020-11-04 2021-05-04 Analog Device End of Life (EOL)
PCN-2491 2020-11-17 2021-05-17 Discrete Device End of Life (EOL)
PCN-2490 2020-10-22 2021-01-22 Analog Additional Wafer Source (LiteOn Semiconductor Corp.)
PCN-2488 2020-10-20 2021-01-20 Analog Fab Porting from Global Foundries to MagnaChip, Assembly Site Transfer, and BOM Change
PCN-2487 2020-10-07 2021-01-07 Analog Fab Porting from Global Foundries to Magnachip, Assembly & Test Site Transfer, and Datasheet Change
PCN-2485 2020-12-04 2021-03-04 Discrete (Automotive) Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Qualification of Additional Wafer Source for Select Discrete Automotive Products
PCN-2484 2020-11-04 2021-02-04 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Standardization of Assembly Bill of Materials At The Existing CAT Site for Select Discrete Products
PCN-2481 2020-08-26 2021-02-26 Analog Device End of Life (EOL)
PCN-2480 2020-10-21 2021-01-21 Analog Semiconductors Additional Qualified (AT) Assembly Test Site SIMAT
PCN-2478 2020-08-11 2020-11-23 Discrete - Automotive Additional Wafer Source (GFAB)
PCN-2477 2020-08-17 2021-05-09 Discrete Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2475 2020-08-06 2020-11-06 Discrete Qualification of Assembly & Test Site Transfer for Select Discrete Products
PCN-2474 2020-12-16 2021-03-16 Discrete Qualification of Additional Wafer Source for Select Discrete Products
PCN-2472 2020-08-13 2021-02-13 Discrete - Automotive Device End of Life (EOL) - Automotive
PCN-2471 2020-07-01 2020-11-29 Analog Semiconductors Additional Wafer Source - GFAB
PCN-2466 2020-07-02 2020-10-02 Analog Semiconductors Package Change and Additional Qualified Plating Source
PCN-2465 2020-07-02 2020-10-02 Analog - Automotive Additional Qualified Plating Source - Automotive
PCN-2464 2020-04-28 2020-10-28 Analog Device End of Life (EOL)
PCN-2462 2020-05-08 2021-04-11 Discrete - Automotive Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)
PCN-2461 2020-05-08 2021-04-05 Discrete Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2460 2020-05-12 2020-05-12 Discrete Semiconductors Qualified Additional Wafer Source and BGBM Source
PCN-2459 2020-05-28 2020-11-28 Discrete Device End of Life (EOL)
PCN-2458 2020-07-01 2020-10-01 Discrete Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2457 2020-05-27 2020-08-27 Discrete - Automotive Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, and Change to Palladium Coated Copper Bond Wire, and New Mold Compound on Select Automotive Products
PCN-2456 2020-05-29 2020-08-29 Discrete Semiconductors Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site Using Copper or Palladium Coated Copper Bond Wire with Standardization of Assembly Bill of Materials, Or as an Additional Wafer Plating, Back Grinding and Back Metal Process Source, and Qualification of Additional Wafer Source for Select Discrete Products.
PCN-2455 2020-03-11 2020-06-11 Analog Semiconductors New Die Revision Change
PCN-2453 2020-04-07 2020-10-07 Discrete Device End of Life (EOL)
PCN-2450 2020-02-17 2020-05-17 Discrete Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2449 2020-02-14 2020-05-14 Discrete Qualification of Additional Wafer Sources for Select Discrete Products
PCN-2448 2020-02-05 2020-08-05 Analog Device End of Life (EOL)
PCN-2447 2020-01-30 2020-04-30 Analog Additional Qualified (FAB) Wafer Fab Source, (A/T) Assembly/Test Site, and (BOM) Bill of Materials
PCN-2446 2020-01-24 2020-01-24 Discrete Change Date Code Marking Information from “YM” (Year/Month) to “YW” (Year/Week)
PCN-2439 2019-12-05 2020-03-05 Discrete Semiconductors Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Using Gold
Bond Wire, and as an Additional Wafer Back Grinding and Back Metal Process Source on Select MOSFET Products
PCN-2438 2020-02-13 2020-05-13 Analog Semiconductors Data Sheet Change and Additional Qualified Package BOM
PCN-2436 2019-11-14 2020-05-14 Analog Device End of Life (EOL)