Diodes 产品变更说明

欢迎访问我们2016年的产品/制程变更通知（PCN）页面。要查找PCN，请从本页菜单中选择年份。

每个 PCN 皆提供联络人与实施日期、提醒类别与类型、PCN 号码、标题、影响、变更说明，以及 Diodes 所制造且受到产品/制程变更之影响的完整组件列表。若要检视 PCN，请单击 PCN# PDF。

PCN #	Issue Date	Implementation Date	Product Family	Change Type	Related Part Numbers
PCN-2681	2024-05-22	2024-08-22	Discrete Semiconductors	Additional Wafer Sources for Select Discrete Products	DFLU1200 DFLU1400 NMSD200B01 PDU340 PDU420 PDU540 PDU620 PDU620CT UF5GD1 UF5JD1
PCN-2680	2024-04-16	2024-07-15	Analog	Qualified Bill of Material (BOM) - Cu Pillar Bump Optimization.	AP62250 AP62300 AP62300T AP62301
PCN-2679	2024-04-01	2024-04-01	Discrete Semiconductors	Qualification of Additional Wafer Source for Select Discrete Products	B140 B140AF B140B B140S1F B150 B150AF B150B B160 B160AE B160AF B160B B160S1F B220 B220A B220AF B230 B230A B230AF B240 B240A B240AE B240AF B240S1F B245AF B250 B250A B250AF B260 B260A B260AE B260AF B260BE B260S1F B320 B320A B320AE B320AF B320B B330 B330A B330AF B330B B340 B340A B340AE B340AF B340B B340CE B345AF B350 B350A B350AF B350B B360 B360A B360AE B360AF B360B B520C B530C B540C B550C B560C DFLS140 DFLS140L DFLS160 DFLS230LH DFLS240 DFLS240L DFLS260 SDM160S1F
PCN-2678	2024-03-29	2024-09-25	Analog	Device End of Life (EOL)	PT7C4311 PT7C4363BQ PT7C4563BQ
PCN-2676	2024-03-08	2024-06-07	Discrete	Qualification of Additional Diodes Internal Assembly & Test Site (SAT)	BSP75G BSP75N
PCN-2675	2024-03-28	2024-03-28	Analog	Additional Wafer Source SPFAB	AP22653Q AP61100Q AP61102Q AP61300Q AP61302Q AP7315DQ AP7315Q
PCN-2674	2024-03-28	2024-06-26	Analog	Additional Wafer Source SPFAB	AP22652 AP22652A AP22653 AP22653A AP61100 AP61102 AP61200 AP61201 AP61202 AP61203 AP61300 AP61302
PCN-2673	2024-04-05	2024-07-05	Discrete Semiconductors	Lead Frame and Mold Compound changes to enhance select GBU and GBJ packaged products	GBJ15JL GBJ15L06 GBJ25JL GBU15JL GBU15L06 GBU25JL
PCN-2672	2024-03-11	2024-09-07	Analog	Device End of Life (EOL)	AH276Z4 AH284A AH3372 AH3373 AH3376 AH3377 AH3382 AH3562Q AH3572 AH3574 AH3582 AH3772 AH3774 AH3775 AH3776 AH3777 AH3781 AH3782 AH5772 AH921Z3 AH9479Z4 AM4961 AM4961A AM4962 AM4963 AM4964 AP1117 AP1603 AP22850 AP2501 AP2501A AP2821 APX803D APX803E APX809 AZV3001 AZV321 AZV358 FF MD0550002 MD0670001 MD0800001 MD0800002 MD0800003 MD1100002 MD1580001 MD1600001 MD1600002 MD1840002 MD2000001 MD2000002 MD2400003 MD2450001 MD2500001 MD2500007Q MD3300003 MD3300005 MD3300006 MD6600001 MD6600002 MD6660003 MD6660004 MDC500001 MN0920001 MN1600001Q MN1840001 MN2000001 MN2210001Z MN2500006 MN2940001 MN3330001 MN4000001 MN5000004 MNA000001 MNC500001 PI2USB4122 PI3DPX1203 PI3EQX10908A PI3EQX6741ST PI3PCIE3442 PI3USB31531 PI5A3157B
PCN-2671	2024-02-20	2024-05-20	Discrete Semiconductor	Part Marking Change	ZHCS400Q ZLLS400Q
PCN-2670	2024-02-20	2024-05-20	Discrete Semiconductor	Part Marking Change	ZHCS400 ZLLS400 ZLLS410
PCN-2667	2024-02-07	2024-05-07	Analog	Qualified Additional Bill of Material (BOM) - Die Source, Die Revision.	AP7368 FD 3.3V
PCN-2666	2024-02-07	2024-05-07	Analog	Qualified Additional Bill of Material (BOM) - Die Source
PCN-2664	2024-02-23	2024-08-23	Discrete Semiconductor	Device End of Life (EOL)	DBF1510U DBF210 DBF2510 DBF310 DGD2110 DGD2113 DGD2117 DGD2118 DGD2181 DGD21814 DGD2184 DGD2190 DGD21904 DMN3003LCA8 DMN30H14DLY DT1240H-04LP FCX493 FCX495 FCX591A G5E100B GBJ35JL RDBF1510U RDBF151U RDBF152U RDBF154U RDBF156U RDBF158U RDBF251 RDBF2510 RDBF252 RDBF254 RDBF256 RDBF258 RDBF31 RDBF310 RDBF32 RDBF34 RDBF36 RDBF38 SXTA42
PCN-2663	2024-03-08	2024-06-07	Discrete	Qualification of Additional Diodes Internal Assembly & Test Site (SAT)	BSP75GQ BSP75NQ
PCN-2661	2024-02-21	2024-05-21	Discrete Automotive	Qualification of Additional Wafer Source and Wafer Diameter Change	SBR10M100P5Q SBR15U30SP5Q SBR1U200P1Q SBR20A60CTBQ SBR20M150D1Q SBR2M60S1FQ SBR2U60S1FQ SBR3A40SAQ SBR3U40S1FQ SBR3U60P1Q SBR3U60P5Q SBR40U200CTBQ SBR545SAFQ
PCN-2660	2024-03-13	2024-06-13	Discrete Automotive	Qualification of Additional Wafer Source with Wafer Diameter and Mold Compound Changes for Select Discrete Products	BAT40V BAT54S BAT54WS SBR0240LPW SBR0330CW SBR10100CTFP SBR10150CT SBR10150CTE SBR10150CTFP SBR10150CTL SBR10200CT SBR10200CTB SBR10200CTFP SBR10200CTL SBR1060CTFP SBR10U100CTFP SBR10U150CT SBR10U150CTFP SBR10U200CT SBR10U200CTB SBR10U200CTFP SBR10U200P5 SBR10U40CTFP SBR10U60CTFP SBR1A20T5 SBR1A30T5 SBR1U200P1 SBR20100CTFP SBR20150CT SBR20150CTFP SBR2045CTFP SBR2060CTFP SBR20A100CTFP SBR20A150CT SBR20A150CTFP SBR20A200CT SBR20A200CTB SBR20A200CTFP SBR20A45CTFP SBR20A60CTFP SBR20U100CTFP SBR20U150CT SBR20U150CTFP SBR20U60CTFP SBR2A30P1 SBR2A40P1 SBR2A40SA SBR2M30P1 SBR2M60S1F SBR2U100LP SBR2U30P1 SBR2U30SA SBR2U60S1F SBR30150CT SBR30150CTFP SBR30200CT SBR30200CTFP SBR3040CTFP SBR3045CTFP SBR3060CTFP SBR30A100CTFP SBR30A120CTFP SBR30A150CT SBR30A150CTFP SBR30A40CTFP SBR30A45CTFP SBR30A60CTFP SBR3A40SA SBR3A40SAF SBR3M30P1 SBR3U150LP SBR3U20SA SBR3U30P1 SBR3U40P1 SBR3U40S1F SBR3U60P1 SBR40100CTFP SBR40150CT SBR40150CTFP SBR4040CTFP SBR4045CTFP SBR4060CTFP SBR40U150CT SBR40U200CT SBR40U200CTB SBR4U130LP SBR545SAF SBR60A200CT SBR6200CTL SDM03MT40 SDM03MT40A SDM03U40 SDM10M45SD SDM10U45 SDM10U45LP SDM20U40 SDMG0340L SDMG0340LA SDMG0340LC SDMG0340LS SDMK0340L SDMP0340LAT SDMP0340LCT SDMP0340LST SDMP0340LT
PCN-2658	2024-02-12	2024-05-12	Discrete Semiconductor	Wafer Diameter Change from 4 inch to 5 inch at Diodes Internal Wafer Fabrication WX1 in WuXi, China for Select Discrete Products	KBJL1006 KBJL1010 KBJL1508 KBJL1510 KBJL408 KBJL608 MSB40M S1KP1M S1MWFM S5JB S5KP5M TT10M
PCN-2656	2023-12-20	2024-03-20	Discrete Semiconductors	Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products.	AZ23C27Q BZT52C10Q BZT52C10SQ BZT52C11Q BZT52C11SQ BZT52C12Q BZT52C12SQ BZT52C13LPQ BZT52C13Q BZT52C13SQ BZT52C15LPQ BZT52C15Q BZT52C16LPQ BZT52C16Q BZT52C16SQ BZT52C18Q BZT52C18SQ BZT52C20Q BZT52C20SQ BZT52C22Q BZT52C24Q BZT52C24SQ BZT52C27Q BZT52C2V4Q BZT52C2V7Q BZT52C2V7SQ BZT52C3V0SQ BZT52C3V3Q BZT52C3V3SQ BZT52C3V6Q BZT52C3V6SQ BZT52C3V9Q BZT52C3V9SQ BZT52C4V3Q BZT52C4V3SQ BZT52C4V7Q BZT52C4V7SQ BZT52C5V1Q BZT52C5V1SQ BZT52C5V6Q BZT52C5V6SQ BZT52C6V2Q BZT52C6V2SQ BZT52C6V8LPQ BZT52C6V8Q BZT52C7V5Q BZT52C7V5SQ BZT52C8V2Q BZT52C8V2SQ BZT52C9V1LPQ BZT52C9V1Q BZX84C10Q BZX84C11Q BZX84C12Q BZX84C13Q BZX84C15Q BZX84C16Q BZX84C18Q BZX84C20Q BZX84C22Q BZX84C24Q BZX84C27Q BZX84C2V4Q BZX84C2V7Q BZX84C3V0Q BZX84C3V3Q BZX84C3V6Q BZX84C3V9Q BZX84C4V3Q BZX84C4V7Q BZX84C5V1Q BZX84C5V6Q BZX84C6V2Q BZX84C6V8Q BZX84C7V5Q BZX84C8V2Q BZX84C9V1Q DDZ5V6ASFQ DDZ9684Q DDZ9685Q DDZ9689Q DDZ9701Q DFLZ10Q DFLZ11Q DFLZ12Q DFLZ13Q DFLZ15Q DFLZ16Q DFLZ18Q DFLZ20Q DFLZ5V6Q DFLZ6V2Q DFLZ6V8Q DFLZ7V5Q DFLZ8V2Q DFLZ9V1Q MMBZ5221BQ MMBZ5226BQ MMBZ5231BQ MMBZ5232BQ MMBZ5235BQ MMBZ5242BQ MMBZ5244BQ MMBZ5245BQ MMBZ5245BWQ MMBZ5252BQ MMSZ5223BQ MMSZ5225BQ MMSZ5226BQ MMSZ5227BQ MMSZ5228BQ MMSZ5229BQ MMSZ5230BQ MMSZ5231BQ MMSZ5232BQ MMSZ5232BSQ MMSZ5233BQ MMSZ5234BQ MMSZ5235BQ MMSZ5236BQ MMSZ5237BQ MMSZ5239BQ MMSZ5240BQ MMSZ5241BQ MMSZ5242BQ MMSZ5243BQ MMSZ5245BQ MMSZ5246BQ MMSZ5248BQ MMSZ5250BQ MMSZ5251BQ MMSZ5252BQ MMSZ5254BQ UDZ9V1BQ
PCN-2655	2023-11-06	2024-02-06	Discrete	Datasheet Revision Due to Maximum IR Specification Limit Change	SBR15U30SP5Q
PCN-2654	2024-02-15	2024-04-28	Analog	Device End of Life (EOL)	AH211 AH2985 AH3362Q AH3363Q AH3364Q AH3365Q AH3366Q AH3367Q AH3368Q AH3369Q AH3390Q AH3391Q AH3563Q AH3564Q AH3762Q AH3763Q AH3764Q AH3765Q AH3766Q AH3767Q AH3768Q AH3769Q AH5772 AH5773 AH5775 AJH266Z4 AJH276Z4 AJH277AZ4 AL1663RS AL1663S AL3353S AL5892SP AL8823S AL9910 AM4406 AM4406F AM9468 AM9469 AN431 AP131 AP139 AP1506 AP1603 AP2822A AP3031 AP431S AP7217D AP7342 AP7344 AP7346 AS7806A AS7808A AZ431L AZ75232 PI2PCIE2412 PI2SSD3212 PI3C3125 PI3C3306 PI3CH3345 PI3CH400 PI3CH480 PI3CH800 PI3USB3102 PI3WVR12412 PI4MSD5V9545A PI4ULS3V302 PI5A124 PI5A3157B PI5A3166 PI5A3167C PI5A4157 PI5A4599B PI5C3125 PI5C3245 PI5C3251 PI5C3253 PI5C3257 PI5C3305 PI5V330 PI5V330A PI5V331 PI6C10810 PI6C485311 PI6C485352 PI6C485352FAE PI6ULS5V9306 PI6ULS5V9511A PI6ULS5V9515A PI90LVT386 ZXBM5210
PCN-2653	2023-11-06	2024-02-06	Discrete	Transer of Wafer Manufacturing Site for Select Automotive Products	AS1J AS1M DFLR1600Q
PCN-2652	2023-11-06	2024-05-06	Discrete	Device End of Life (EOL)	1N4736A 1N4749A BAS21A FB230H UDZS5V6B
PCN-2651	2023-11-13	2023-11-13	Analog	Qualified Additional Fab Source, Assembly Test Sites, Die Revision, BOM, Datasheet, Tape and Reel Packing Quantity.	AH175 AH49F AP3156 AP3917B AP3917C AP3917D AP4310A APX823 APX824 APX825A AS324 AS339 AZ75232 FL G23270006 G23270013 G23270015 G23270016 G23270023 G23270024 G23270025 PI3CH3305 PI3USB102E PI3VT3306 PI6LC48C21 PI6LC48C51 PI6LC48P0101 PI6LC48P25104 PT7C4302 PT7C4307 PT7C4311 PT7C4337 PT7C4337A PT7C433833A PT7C4339 PT7C4363B PT7C4372A PT7C4511 PT7C4563B US ZXCT1008
PCN-2648	2023-10-19	2024-01-20	Analog	Additional Wafer Source SPFAB	AP22816A AP22816B AP22817A AP22817B AP22818A AP22818B AP7315 AP7340 AP7341
PCN-2647	2023-10-12	2024-01-12	Discrete	Back Metal Composition Change for Select Discrete Products	DMN1002UCA6 DMN1003UCA6 DMN1006UCA6 DMN12M3UCA6 DMN12M7UCA10 DMN12M8UCA10 DMN16M0UCA6 DMN2009UCA4 DMN2030UCA4 DMN22M5UCA10 DMN3006SCA6 DMN3008SCP10
PCN-2645	2023-09-11	2023-12-11	Discrete	Datasheet Revision Due to Maximum VBSUV+ and VCCUV+ Specification Limit Change	DGD05463 DGD05473
PCN-2644	2023-09-27	2023-12-27	Discrete	Lead Frame Type, Die Bond Process, Wire Bond Type and Mold Compound changes to enhance select TO-252 packaged automotive products	MJD31CQ MJD31CUQ MJD32CQ MJD32CUQ ZXT1053AKQ ZXT690BKQ ZXT951KQ ZXTN4004KQ
PCN-2642	2023-09-05	2024-03-05	Analog	Device End of Life (EOL)	AL1696 AL5890 AL8820 AP1501 AP2204 AP3105 AP3302 AP3983E AP3983R AP3987P AP3987T AP4306 AP4312 AP43201H AP7335A AP9101C AP9211 AP9214L AP9221 AP9234L APR3415 APR343 APR34509L APR34709 AS7805AT AS7806A AS7808A AS7809A AS7815A AS7818A AZ494A AZ7500B AZ7500E LSP2008 LSP2015 LSP2031 PI2EQX632E PI3C3125WE PI3C3245 PI3C3384 PI3C3861-A PI3CH1012 PI3CH480 PI3L110 PI3L301D PI3L500-A PI3L720 PI3USB20 PI3V512 PI3V512QE PI3VT3245-A PI4GTL2034 PI4MSD5V9543A PI5C3253 PI5C3257 PI5C3384 PI5C3861 PI5USB2544 PI5V330S PI6C2405A-1 PI6C2405A-1H PI6C2409-1H PI6CX201A PI6ULS5V9511B PI6ULS5V9517A PI6ULS5V9517B PI6ULS5V9617B PI6ULS5V9627A PI7C9X20505GP PI7C9X20508GP PT7C4302 PT7C4307 PT7C4311 PT7C4337AC PT7C4337B PT7C433833 PT7C433833A PT7C4339 PT7C4363B PT7C4511 PT7C4563B PT7M7809 PT7M7811 PT7M7823S PT8A2766I SP6699EK ZNI1000 ZR285 ZR4040-2.5 ZR4040-4.1 ZR4040-5 ZR431 ZRT025 ZRT040 ZRT050 ZTLV431 ZXRE1004 ZXRE330
PCN-2641	2023-09-26	2023-12-26	Discrete	Lead Frame Type, Die Bond Process, Wire Bond Type and Mold Compound changes to enhance select TO-252 packaged products	2DB1182Q 2DB1184Q DXT696BK MJD31C MJD32C MJD340 MJD350 ZXT1053AK ZXT690BK ZXT790AK ZXT849K ZXT953K ZXTN04120HK ZXTN4004K
PCN-2640	2023-09-12	2024-03-13	Discrete	Device End of Life (EOL) - Automotive	1N4148WQ 1N4148WSQ BAS116Q BAS16HTWQ BAS16Q BAV116WSQ BAV170Q BAV199DWQ BAV199Q BAV199WQ BAV70Q BAV70WQ BAV99DWQ BAV99Q BAW156Q BAW56DWQ BAW56Q BAW56WQ BZT52C3V9Q BZT52C5V6TQ BZX84B11 BZX84B13 BZX84B15 BZX84B16 BZX84B18 BZX84B20 BZX84B2V7 BZX84B30 BZX84B33 BZX84B39 BZX84B3V0 BZX84B3V3 BZX84B4V3 BZX84B5V1 BZX84B5V6 BZX84B6V8 BZX84B7V5 BZX84B8V2 DDZ9678 DLD101 MMSZ5232B
PCN-2639	2023-09-26	2023-12-26	Discrete	Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire with Standardization of Assembly Bill of Materials at CAT for Select Automotive Products	2DA1201YQ ADTA114EUAQ ADTA143ZUAQ ADTA144ECAQ ADTC114ECAQ ADTC114EUAQ ADTC114YUAQ ADTC124ECAQ ADTC143TUAQ ADTC143ZCAQ ADTC143ZUAQ ADTC144EUAQ BCP5316Q BCP5416Q BCX5316Q BCX5616Q BCX6825Q DMG1013TQ DMG2302UQ DMG2307LQ DMG3401LSNQ DMG3414UQ DMG6602SVTQ DMN2230UQ DMN3135LVTQ DMN6068SEQ DMN63D8LDWQ DMP1045UQ DMP2100UQ DMP6110SVTQ DXT651Q DXT751Q FCX491AQ FCX491Q FCX558Q FCX591AQ FMMT5401Q FZT491AQ FZT591AQ FZT851Q MMST5551Q MMSTA56Q ZXTN07060BGQ ZXTN25060BZQ ZXTP01500BGQ ZXTP07060BGQ
PCN-2638	2023-09-19	2023-12-19	Discrete	Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site with Standardization of Assembly Bill of Materials at CAT for Select Discrete Products	DMP10H400SE FMMT449 FMMT451 FMMT455 FMMT489 FMMT491 FMMT491A FMMT493 FMMT493A FMMT494 FMMT495 FMMT497 FMMT549 FMMT549A FMMT551 FMMT555 FMMT589 FMMT591 FMMT591A FMMT593 FMMT596 MMDT2222V
PCN-2636	2023-08-29	2023-08-29	Discrete	Device End of Life (EOL)	1N4001 1N4002 1N4003 1N4004 1N4005 1N4006 1N4007 1N4148(LS) 1N4148W(LS) 1N4148WS(LS) 1N5408 BAV70(LS) BAV99(LS) BAW56(LS) DDZ2V4ASF DDZ2V4BSF DGD0506 DGD1503 DGD2190 DGD21904 DLPA004 DLPT05 DMF05LCFLP DMT5012LFVW DPD18AWF DPS1035 DTVS3V3S1UR ES1G(LS) HTMN5130SSD L35L12VCB2 L35L15VCB2 L35L18VCB2 L35L24VCB2 L35L3V3CB2 L35L5V0CB2 L35L8V0CB2 LL4148(LS) PLR0524 SD05 TPD6V8LP ZXMD63N03X ZXTN2097F
PCN-2635	2023-08-10	2023-11-10	Discrete	Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products	SMAZ5V1 SMAZ5V6
PCN-2633	2023-08-16	2023-11-15	Discrete	Additional Wafer Source for Select Discrete Products	GBJ15L06(LS) GBJ25JL(LS) GBU15JL(LS) GBU15L06 GBU25JL(LS) MSB30JL(LS) TT6JL(LS) TT8JL(LS)
PCN-2632	2023-06-13	2023-09-11	Discrete	Addition of A Passivation Layer Over The Top Metal of The Die for Select BJT Products	DMMT5551 DSS5240Y DSS9110Y DXT2010P5 DXT2011P5 DXT2012P5 DXT2013P5 DXT2014P5 DXT5551P5 DXTP03200BP5 DZT5551 FCX605 FCX619 FCX705 FMMT413 FMMT618 FMMT619 FMMT624 FMMT6520 FMMT718 FMMT720 FZT600 FZT600B FZT603 FZT605 FZT705 MMBT5401 MMBT5551 MMDT5401 MMST5401 ZDS1009 ZDT6702 ZUMT619 ZXGD3003E6 ZXT12N20DX ZXT12N50DX ZXT12P40DX ZXT13N20DE6 ZXT13N50DE6 ZXT13P12DE6 ZXTC2045E6 ZXTN04120HK ZXTN04120HP5 ZXTN5551FL ZXTN5551G ZXTP4003G ZXTP4003Z ZXTP5401FL ZXTP5401G
PCN-2631	2023-11-07	2024-02-07	Discrete	Transfer of Wafer Manufacturing Site for Select Discrete Products	1N4001G 1N4002G 1N4003G 1N4004G 1N4005G 1N4006G 1N4007G 1N5400G 1N5401G 1N5402G 1N5404G 1N5406G 1N5407G 1N5408G 2A07G ABS20M ABS20MH D4G D5G D7G DF005M DF005S DF01M DF01S DF02M DF02S DF04M DF04S DF06M DF06S DF08M DF08S DF10M DF10S DF15005S DF1501S DF1502S DF1504S DF1506M DF1506S DF1508M DF1508S DF1510S DF1512S DF1514S DFLR1200 DFLR1400 DFLR1600 FS1ME FS2MD FS2ME GBJ10005 GBJ1001 GBJ1002 GBJ1004 GBJ1006 GBJ1008 GBJ1010 GBJ1502 GBJ1504 GBJ1506 GBJ1508 GBJ1510 GBJ15V10 GBJ2001 GBJ2002 GBJ2004 GBJ2006 GBJ2008 GBJ2010 GBJ25005 GBJ2501 GBJ2502 GBJ2504 GBJ2506 GBJ2508 GBJ2510 GBJ25KH GBJ25V08 GBJ3506 GBJ3508 GBJ3510 GBJ5010 GBJ6005 GBJ601 GBJ602 GBJ604 GBJ606 GBJ608 GBJ610 GBJ801 GBJ802 GBJ804 GBJ806 GBJ808 GBJ810 GBJS3010 GBJS4010 GBL206 GBL208 GBL406 GBL408 GBL410 GBL610 GBP206 GBP208 GBP210 GBP306 GBP308 GBP310 GBP406 GBP406N GBP408 GBP408N GBP410 GBP808N GBP810 GBU10005 GBU1001 GBU1002 GBU1004 GBU1006 GBU1008 GBU1010 GBU10V06 GBU10V08 GBU1506 GBU1508 GBU1510 GBU2508 GBU2510 GBU25KH GBU3008 GBU30T08 GBU4005 GBU401 GBU402 GBU404 GBU406 GBU408 GBU410 GBU6005 GBU601 GBU602 GBU604 GBU606 GBU608 GBU610 GBU8005 GBU801 GBU802 GBU804 GBU806 GBU808 GBU810 HD01 HD02 HD04 HD06 HDS20M KBJ1006G KBJ1008G KBJ1010G KBJ2006G KBJ2008G KBJ401G KBJ402G KBJ404G KBJ406G KBJ408G KBJ410G KBJ601G KBJ604G KBJ606G KBJ608G KBJ610G KBP005G KBP01G KBP02G KBP04G KBP06G KBP08G KBP10G KBP2005G KBP201G KBP202G KBP204G KBP206G KBP208G KBP210G KBP304G KBP306G KBP308G KBP310G KBP404G KBP406G KBP408G KBP410G LT2A07G MSB15M MSB15MH MSB20M MSB22M. MSB25MH MSB30KH MSB30M PDR3G PDR5G S10JC S10KC S10MC S1A S1AB S1B S1BB S1D S1DB S1G S1GB S1J S1JB S1K S1KB S1M S1MB S2A S2AA S2B S2BA S2D S2DA S2G S2GA S2J S2JA S2K S2KA S2M S2MA S2MH S2MHA S3A S3AB S3B S3BB S3D S3DB S3G S3GB S3J S3JB S3K S3KB S3M S3MB S5AC S5BC S5DC S5GC S5JB S5JC S5KB S5KC S5MB S5MC S8JC S8KC S8MC TT10M TT2M TT3M TT410 TT4M TT4V10 TT6M TT8M
PCN-2630	2024-02-20	2024-05-20	Discrete Semiconductors	Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness for Select Products	BZT52C10LP BZT52C11LP BZT52C12LP BZT52C13LP BZT52C15LP BZT52C16LP BZT52C18LP BZT52C20LP BZT52C22LP BZT52C24LP BZT52C2V4LP BZT52C2V7LP BZT52C36LP BZT52C39LP BZT52C3V0LP BZT52C3V3LP BZT52C3V6LP BZT52C3V9LP BZT52C4V3LP BZT52C4V7LP BZT52C5V1LP BZT52C5V6LP BZT52C6V2LP BZT52C6V8LP BZT52C7V5LP BZT52C8V2LP BZT52C9V1LP BZX84C15 DDZ36BSF DDZ4V7BSF DDZ5V6ASF DDZ5V6CSF DDZ6V8ASF DFLT10A DFLT11A DFLT12A DFLT13A DFLT14A DFLT15A DFLT16A DFLT17A DFLT18A DFLT20A DFLT22A DFLT24A DFLT5V0A DFLT6V0A DFLT6V5A DFLT7V0A DFLT7V5A DFLT8V5A DFLT9V0A DFLZ10 DFLZ11 DFLZ12 DFLZ13 DFLZ15 DFLZ16 DFLZ18 DFLZ20 DFLZ5V6 DFLZ6V2 DFLZ6V8 DFLZ7V5 DFLZ8V2 DFLZ9V1 GDZ10LP3 GDZ11LP3 GDZ12LP3 GDZ13LP3 GDZ15LP3 GDZ18LP3 GDZ20LP3 GDZ22LP3 GDZ24LP3 GDZ5V1LP3 GDZ5V6LP3 GDZ6V0LP3 GDZ6V2LP3 GDZ6V8LP3 GDZ7V5LP3 GDZ8V2LP3 GDZ9V1LP3
PCN-2629	2023-05-15	2023-11-15	Discrete	Device End of Life (EOL) - Automotive	AS1A AS1B AS1D AS1G AS1K B240AQ B260Q BAS521Q DFLS160Q PDS560Q ZHCS506Q
PCN-2628	2023-05-11	2023-08-11	Discrete	Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products	DMN22M5UFG DMN3012LEG DMN3013LDG DMN3013LFG DMN3022LDG DMN3022LFG DMP2002UPS DMP2004UFG DMP2005UFG DMP3007SFG DMP32M6SPS DMT10H003SPSW DMT10H009LFG DMT10H015LFG DMT10H017LPD DMT3002LPS DMT3003LFG DMT31M6LPS DMT32M4LFG DMT32M4LPSW DMT32M5LFG DMT4002LPS DMT6002LPS DMT6005LFG DMT6007LFG DMT61M5SPSW DMT8008LFG DMTH10H003SPSW DMTH3002LPS DMTH41M8SPS DMTH43M8LFG DMTH45M5LPDW DMTH45M5LPSW DMTH45M5SPDW DMTH45M5SPSW DMTH6002LPS DMTH6005LFG DMTH61M5SPSW DMTH62M8LPS DMTH62M8SPS DMTH8003SPS DMTH8008LFG DMTH8008SFG
PCN-2624	2023-05-31	2023-08-29	Analog	Qualification of Additional Assembly Test Site CAT – Automotive	AZ9431BQ SE555Q
PCN-2623	2023-05-15	2023-11-15	Discrete	Device End of Life (EOL)	1N4148 B0520LW B0520WS B0530W B0530WS B0540W B0540WS B1100 B1100B B1100LB B120 B130 B130L B130LAW B130LB B140WS B150 B160 B160B B160S1F B170 B170B B180 B180B B2100 B2100A B2100AE B220 B220A B230 B230A B240 B240A B240AE B240AF B240LA B240S1F B250 B250A B260 B260A B260AE B290 B3100B B3100BE B320A B320AE B320AF B320B B330 B330A B330B B340 B340A B340AF B340B B340CE B340LA B340LB B350 B350B B360 B360A B360AE B360AF B360AM B360B B370 B380 B380B B3L30LP B520C B530C B540C B550C B560C BAS40 BAS40BRW BAS40DW BAS40LP BAS40TW BAS40W BAT1000 BAT400D BAT46W BAT54 BAT54A BAT54ATA BAT54AW BAT54CDW BAT54CTA BAT54CW BAT54JW BAT54LP BAT54S BAT54SDW BAT54ST BAT54STA BAT54SW BAT54T BAT54TW BAT54V BAT54W BAT54WS BAT54WT BAT750 BAT760 BAV99BRLP DFLS1100 DFLS1150 DFLS1200 DFLS120L DFLS140L DFLS160 DFLS2100 DFLS230L DFLS260 DML3010LFDS DML3011LFDS DMP1070UCA3 MBR0580S1 MBR2045CT MBR2045CTF MBR2060CT MBR2060CTF MBR230S1F MBR3045CT MBR3045CTF PD3S120L PD3S130H PD3S130L PD3S140 PD3S160 PD3S220L PD3S230H PD3S230L PDS1040 PDS1040L PDS1045 PDS3100 PDS3200 PDS340 PDS360 PDS4150 PDS4200H PDS5100 PDS5100H PDS760 SB380 SBR10100CTL SBR10200CTFP SBR1045CTL SBR12A45SD1 SBR12E45LH1 SBR15300D1 SBR15U100CTL SBR20B100CT SBR20E120CT SBR30A100CT SBR30A40CT SBR30E100CT SBR30E45CT SBR30E45CTB SBR30S30CT SBR40S45CT SBR40U100CT SBR40U120CT SBR40U150CT SBR40U45CT SBR40U60CT SBR40U60CTE SBR60A150CT SBR60A300CT SBR60A60CT SBR6100CTL SBR8A45SP5 SBR8U60P5 SD103ASDM SD103ATW SD103AW SD103AWS SD103BW SD103BWS SD103CW SDM01U50CP3 SDM02M30LP3 SDM02U30LP3 SDM100K30L SDM1100LP SDM1100S1F SDM160S1F SDM1A40LP8 SDM20E40C SDM20U30 SDM20U30LP SDM2100S1F SDM40E20LA SDM40E20LC SDM40E20LS SDT15B150LP5 ZHCS1000TA ZHCS2000TA ZHCS350TA ZHCS400TA ZHCS500TA ZHCS506TA ZHCS750TA ZLLS1000TA ZLLS2000TA ZLLS350TA ZLLS400TA ZLLS400TC ZLLS410TA ZXT11N15DFTA ZXT11N20DFTA
PCN-2622	2023-04-07	2023-07-07	Analog	Qualified Additional Assembly/Test (A/T) Site	US2500010
PCN-2620	2023-05-10	2023-08-10	Discrete	Qualification of Additional Wafer Source and Additional Assembly and Test Site for Select Discrete Products	KBJL1010
PCN-2619	2023-04-12	2023-07-12	Discrete Automotive	Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products	P6SMAJ12ADFQ P6SMAJ15ADFQ P6SMAJ18ADFQ P6SMAJ22ADFQ P6SMAJ24ADFQ P6SMAJ26ADFQ P6SMAJ28ADFQ P6SMAJ30ADFQ P6SMAJ36ADFQ P6SMAJ43ADFQ P6SMAJ5.0ADFQ P6SMAJ6.0ADFQ P6SMAJ64ADFQ P6SMAJ7.5ADFQ RS1JDFQ RS1MDFQ S1MDFQ S2KDFQ S8MCQ SBR545SAFQ US1DWFQ US1JDFQ US1MDFQ US2JDFQ
PCN-2618	2023-03-03	2023-06-03	Discrete Automotive	Qualification of Additional Wafer Source, Lead Frame Structure, and Mold Compound Type Changes for Select Discrete Automotive Products	SBR02U100LPQ SBR0560S1Q SBR1045CTLQ SBR1045D1Q SBR1045SP5Q SBR10A45SP5Q SBR10U200P5Q SBR10U45D1Q SBR10U45SP5Q SBR12U100P5Q SBR15U100CTLQ SBR20M45D1Q SBR2A40P1Q SBR3045CTBQ SBR30A45CTBQ SBR30A60CTBQ SBR3U40P1Q SBR3U60P1Q SBR6100CTLQ SBR660CTLQ SBR8U60P5Q
PCN-2617	2023-05-03	2023-08-03	Discrete	Addition of a Polyimide Wafer Coating Layer and Enhanced ESD Structure for DMP10H4D2S Products	DMP10H4D2S
PCN-2616	2023-06-02	2023-08-31	Discrete Automotive	Addition of A Passivation Layer Over The Top Metal of The Die for Select Automotive BJT Products - Automotive	DXT690BP5Q-13 FMMT619QTA FMMT625QTA FMMT717QTA FMMT720QTA FZT795AQTA MJD31CQ-13 MMST5551Q-7-F ZDT694QTA ZTD09N50DE6QTA ZXGD3003E6QTA ZXTC6717MCQTA ZXTD6717E6QTA ZXTN2080GQTA
PCN-2615	2023-02-02	2023-05-02	Discrete Automotive	Datasheet Revision Due to Maximum VBE(on) Specification Limit Change - Automotive	BC847BVNQ BC847PNQ BC847PNQ-