Diodes Incorporated

Frequently Asked Questions

Search our knowledge base of commonly asked questions to find answers to your questions about our products and services.

Results for Desktop PC

Do Pericom's Packet Switches Support Industrial Temperature Range (-40oC to +85oC)?

"YES, please refer to the following application notes.

AN219 – GreenPacket PCI Express Packet Switch – Industrial Temperature Support 1.0

AN220 – PI7C9X20303SL-404SL Industrial Temperature Support

AN221 – PI7C9X20303ULA Industrial Temperature Support"


How is the phase error measured in a DDR application?

The phase error is measured from the crosspoint of the input reference signals to the crosspoint of the output signals. For example, Pericom clock driver phase error is measured from CK and CK/ input pins to FBIN and FBIN/ pins. Therefore, all 4 probes of a typical oscilloscope are used.

Is there information regarding Memory Module or DDR product guidelines?

A full detail explanation and product guidelines for memory modules and DDR applications can be found in our Applications section under Memory Modules.

What is the most crucial parameter for a high-speed DDR module register?

It is proven by many real application cases that the short propagation delay is the key parameter for a high-speed DDR register. It was seen that even if a 100ps longer propagation from a register failed the DDR module, the shorter the better. In a high-speed DDR module, there is very little margin left for setup time due to the short duty cycle at high-speed, but also the RC delay from many memory chips driven by one register driver. Pericom's DDR module register  and  are the fastest registers in the market, and are the proven "silver bullet" of resolving DDR module timing problems seen in critical timing system at four corner test.

What is the requirement of the reference clock of Pericom's packet switches?

The reference clock DC specifications and AC timing requirements are shown in the table below. More details can be found in "PCI Express Card Electromechanical Specification Revision 1.1", Chap 2.1.3.