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Diodes manufactures its dual transistor products using separate die which are wire bonded to the lead frames. They are not monolithic devices.
Diodes manufactures both matched and non-matched dual transistor products.
Please see the appropriate Data Sheets for Diodes' specific matching specifications.
Basically, UL Listings (Certification) are for assemblies or certain Discretes (Power Semiconductors) designed to go on power mains such as TVSs (Transient Voltage Suppressors) and Bridge Rectifiers. Most of our Bridge Rectifiers, and TVS in SMB and SMC are listed. SMA TVS are not listed. For all other discretes, UL has no listing program for them.
Spice model for simulation is available upon request. Please contact Diodes Customer Support.
Customers may continue to buy products that have not been "converted" subject to availability in either format, with SnPb Lead Finish or Lead Free. If other products are converted, advanced notification will be given. Should a major customer require product with SnPb plating after a general product conversion, a Customer Special Part Number may have to be generated. The length of time the old product will remain available to you will be by special agreement. (Pricing may then be reviewed.) A Lifetime buy may be offered on a package / Customer basis.
Green molding compound changes are by date code. Once stock is exhausted, the device will not be available in the old compound even if SnPb finish.
Yes you can, the PCI-X specification is backward compatible with this bridge, and it will work at 66 MHz speed.
The lead-free solder finishes are backwards compatible with Pb-containing solders. Soldering profiles may need to be adjusted slightly depending on the many design and usage variables.
The Diodes Glass Passivation Process (GPP) for Rectifier Dice occurs in the wafer form after the Wafer Diffusion (P+) Process.
Immediately after the Diffusion Process, the wafer is masked with a photoresist film and the dice are pattern etched through the junction plane, this operation is called mesa etching.
The exposed p-n junction surface is then passivated in a two-layer process.
The wafers are then masked with a photoresist film and the top (Anode) Contact Metallization Layer of sintered nickel is applied (see figure 1).
Figure 1. Cross Section of GPP Die
Note: This process is typical to our GPP rectifier die; however, particular processes and materials used may vary depending on the specific device. Please contact a Diodes Incorporated Applications Engineer for more detailed information regarding a specific device.
Products with SnPb solder finishes are no longer available.
Yes. Please see Pericom's Quality Policy Manual.
Please go to the Media & Downloads page. From there please click on the tab called "FCP Support Documents".
In that section, you should be able to access all the links related to each product, in terms of reflow, test circuits and tape and reel information. We apologize for the inconvenience.
Each product family where the Lead Finish is being converted to Pb Free has been or will be re-qualified by subjecting a family sample to the following tests (typical):
Preconditioning (PC) followed by:
The PI7C7300D is "hot-swap friendly", which essentially means it can interface to a hot-swap power controller. But by itself cannot withstand Vcc=0V and live signals at the I/O pins -- in this mode, current will flow through our bridge. Therefore, if ever there is a possibility of this happening, we require a hot-swap power controller and switches for isolation. If you do not need to pre-charge your switched signals, then the less costly or PI3C32X245 switches are appropriate for the signal switches. Most of our customers use this switch in their applications.
Diodes Incorporated's sales representatives and distributors can be found in the Contact Us section of our site.
The PI7C8152B was intended to be a pin compatible drop-in replacement to the Intel 21152. The drivers that currently work for the Intel device will function with our device as well. The PI7C8152B does not require any external drivers, but instead utilizes the embedded drivers in Windows. The only issue that may come up is that if your software is looking specifically for the Intel device and vendor ID's, it will need to be modified. The PI7C8152B has an added feature, it can work at 66 MHz. our device ID and vendor ID are different from Intel's.
The PI7C8150B was intended to be a pin compatible drop-in replacement to the Intel 21150. The drivers that currently work for the Intel device will function with our device as well. The PI7C8150B does not require any external drivers, but instead utilizes the embedded drivers in Windows. The only issue that may come up is that if your software is looking specifically for the Intel device and vendor ID's, it will need to be modified. Our device and vendor ID's are different from Intel's.
Diodes defines "Green" products as those which are RoHS compliant and contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br Cl) and <1000ppm antimony compounds. Further information about Diodes' "Green" Policy can be found on our website.
Please see the Pericom Date Code Policy.
Product package labeling clearly states the status of the parts. Please see Document AP02006.pdf for complete labeling information.
The sheen of Matte Tin vs. SnPb Finish is visibly different. It is not possible to tell Green from non-Green products once put into use.
This bridge is designed to Intel 21154BE capabilities (power management support at pin D11, 2KV ESD rating, 0.35 micron process, and more robust tolerances for 3.3V/5V power start up sequence.) The bridge also can be used in designs intended for 21154 versions AC, AE, and BC also.
|Banner and/or Watermark||Qualification Status||Sample Status||Website Location|
|"New Product Banner"||Must be Qualified||Production||Catalog and Search|
|"Not Recommended For New Design, Use XXXXX" Watermark
(See Note 1)
|Qualified||Limited Distribution||Inactive Data Sheet Archive Only|
|"Discontinued (Date) Use XXXXX" Watermark (See Note 1)||N/A||No Distribution||Inactive Data Sheet Archive Only|
TCXO means "Temperature Compensated Crystal Oscillator" A TCXO is essentially a quartz crystal integrated with compensation electronic circuitry sensitive to temperature variation. The compensation circuitry helps TCXO maintain high frequency stability over temperature (0.5ppm - 5ppm)
Removal of halogens and antimony compounds is brought about by a change of molding compounds only. No electrical or performance changes are made for this conversion. All these ratings remain the same.
Eliminating Pb from Lead plating is just one step towards a "Green Product". Diodes Incorporated is taking additional steps to remove halogens and antimony compounds and will announce each change with the appropriate mechanism: i.e., New Product Announcement or Product Change Notice (PCN).
At Diodes, we strive to continuously improve the environmental friendliness of our products and meet the demands of our Customers for such. A Material Content List is available for most products. Please request this report through your Sales Representative or email email@example.com.
Diodes Incorporated's products defined as "Lead Free" contain no purposefully added Lead either internally or externally. Only trace elements may remain.
These products will have no external Lead, but will still contain internal Lead in the form of high temperature die bonding solder, glass encapsulation or glass die passivation. Lead in these types of materials are currently RoHS exempt.
In 2006, Diodes eliminated most SnPb plated versions of products. In addition, more and more products were introduced in a “Green” format. Diodes, Inc.’s Green products do not contain Halogens or Sb compounds.
Over time, as demand warrants, the traditional non-green products will be discontinued. This will be announced by a Product Change Notice (PCN). Demand will affect which packages are discontinued first.
Finished products are manufactured in the Republic of China, Europe, Malaysia and Taiwan.
(From http://www.intel.com/design/bridge/index.htm ) The Intel 21154 has (in bytes). Primary write = 88 bytes , read = 72 bytes, Delayed entries =3 secondary write= 152 bytes . read =152 bytes, Delayed entries= 3 . For the Diodes' PI7C8154: (posted write buffer and delayed transaction buffer data size for FIFOs) primary write= 128+128 bytes. Read= 128+128 bytes. Delayed entries= 8. The same for the secondary. Thus the Diodes' 8154 has MORE FIFO buffering than Intel.
At Diodes Incorporated, dash numbers / letters are appended to our product part numbers (example: ZMM5250B-7) to indicate package type and reel size, as listed below.
A = Ammo Pack
B = Bulk Packaging
T = Tape & Reel
U = Tube Packaging
7 = 7-inch Reel
13 = 13-inch Reel
F = Pb Free or Pb Free Lead Finish (as noted on associated data sheets)
L = (Analog) Pb Free
G = (Analog) Pb Free and Green
TA, TC = Refers to the tape and reel option of the part. Note: These suffixes are not shown on our Data Sheets and other marketing materials. They are not needed for part number searches on our website.
According to the hot-swap specification revision 1.0., the bridge should be connected to early power. All other chips on the board should be connected to switched power, which comes later, driven from the Hot-swap controller.
Finished products are built in the Republic of China, Peoples Republic of China and Hungary.
Please see Pericom's Product Quality & Reliability Page.
To find Inactive (Non-active) and Obsolete devices on our website, go to our Products pulldown menu and select:
At the top right of our Diodes' homepage, you will see the Cross Reference part number-entry field.
On our Package Outlines page, you may view "Suggest Pad Layout" specifications for each Surface Mount package [Package Outlines].
At our Quality pulldown menu, select "PCN" to locate PCNs, the most recent are listed at the top; you may select them by year at right.
Please see our "Package Outlines" page in the Design section and view our package dimensions for
You may dimensional drawings for our packages in the "Package Outlines" page
There are many uses for this chip including:
1) To alleviate the excessive loading on the motherboard. This chip can be used on a server board, or a main board in a system that needs many I/O cards connected to it; these I/O cards can be Ethernet, Fiberchannel, SCSI, or any other PCI I/O cards. PCI specification rev 2.2 allows you to have as many as 4 slots @ 33 MHz slots and two 66 MHz slots. If your system requires more then 4 slots, then you need to add a PCI-to-PCI Bridge. This bridge will take one load only, but it will allow you to add four additional slots on the other side. See Figure 1 of Application Note 55 available on the web.
2) If you have more than one PCI interface chip on an add-in card. If you are designing an intelligent add-in card that requires a CPU and an I/O chip like Ethernet, SCSI, or Fiberchannel, then you will have two or more PCI loads, in this case you must have a PCI-to-PCI bridge on the card. The PCI specification rev 2.2 allows only one PCI Load connected to the PCI Edge connector. See Figure 3 of Application Note 55 available on the web.
3) If you have many types of interfaces, and you would like to isolate each application’s traffic to a specific bus (example: you have couple of Ethernet chips on your system that need to be 32-bit and 66 MHz and have two low-performance 32-bit applications like modem cards running at 33 MHz). In this case, to isolate the two distinct applications you would add one bridge for the 66 MHz high-speed I/O interfaces, and another bridge for the low-speed applications. The benefit is that the high speed I/O card does not have to wait for the low-speed application to finish its transfer. You will also have one bus running at 66 MHz and another slow bus running at 33 MHz.
Data Sheets will contain ordering information for each version of a component where more than one version is available. Also, the Features Section will indicate when a Lead Free Version of a product is available or if a product is Lead Free by design, and it is Green. The Mechanical Data Section will have a notation regarding the type of Lead Finish plating.
There will not be any specification changes other than to reflect the Lead Free and Molding Compound. Products will continue to be qualified to 260ºC solder re-flow profiles. Moisture Sensitivity Level (MSL) will remain 1 unless specifically announced otherwise on an individual product. Reliability and Qualification Testing will remain as is before with the exception of additional Solderability Testing using Pb Free solders. No major changes should be necessary in customer's processes except for solder profile adjustments.
Conversion will be governed by demand.
There are many variables that impact pricing. While we have experienced a slight manufacturing cost increase for Green product versions, we do not anticipate any immediate change of pricing because of these changes.
Yes, part numbers have changed in most cases for Lead Free. A part number suffix is used to designate Lead Free or Lead Free Finish versions of a product when there was a former version containing Lead. The suffix used is an "-F." Part numbers have not changed to indicate Green status.
Examples: To order a Dual Surface Mount Switching Diode in a SOT-323 package (BAV99W) with SnPb Lead Finish on a 7" reel, you would formerly order a "BAV99W-7". To order the Lead Free Version of this device on a 7" reel, you would order a "BAV99W-7-F".
To order a 1 Amp, 400 Volt Standard Recovery Rectifier in an SMA package (S1G) on Tape and Reel (13" reel), you would formerly order an "S1GT-13". To order the same product with Lead Free Lead Finish, you would order "S1GT-13-F".
Please see our data sheets for specific product ordering information and to determine the Green conversion.