With a leakage current of less than 0.9μA, the logic devices' static power consumption is low, and a typical power dissipation capacitance of 6pF at 3.6V means dynamic power consumption is also minimized. Operating over the 0.8V to 3.6V range, the 74AUP2G family enables circuit supplies to be reduced to lowest practical levels.
The ultra-low power 74AUP2G logic family is initially comprised of seven different dual gate devices offering combinations of inversion and buffering functions: inverters; inverters with open-drain output; buffers; buffers with open-drain output; Schmitt trigger inverters and Schmitt trigger buffers.
To more closely meet the requirements of next generation product sizing and manufacturing processes, each dual gate logic device is provided in a choice of three different leadless packages: DFN0910, DFN1010 and DFN1410. Measuring just 0.9mm x 1.0mm x 0.35mm, the DFN0910 is one of the world's smallest six- pin packages, enabling both space and weight savings. For further information, visit the Company's website at www.diodes.com.
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor's SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. Diodes' products include diodes, rectifiers, transistors, MOSFETs, protection devices, functional specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors; power management devices, including LED drivers, AC-DC converters and controllers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. Diodes' corporate headquarters, logistics center, and Americas' sales office are located in Plano, Texas. Design, marketing, and engineering centers are located in Plano; San Jose, California; Taipei, Taiwan; Manchester, England; and Neuhaus, Germany. Diodes' wafer fabrication facilities are located in Kansas City, Missouri and Manchester, with four manufacturing facilities located in Shanghai, China, and two joint venture facilities located in Chengdu, China, as well as manufacturing facilities located in Neuhaus and Taipei. Additional engineering, sales, warehouse, and logistics offices are located in Fort Worth, Texas; Taipei; Hong Kong; Manchester; Shanghai; Shenzhen, China; Seongnam-si, South Korea; Suwon, South Korea; Tokyo, Japan; and Munich, Germany, with support offices throughout the world. For further information, including SEC filings, visit Diodes' website at www.diodes.com.
VP, Worldwide Analog Products
Investor Relations Contact:
Leanne K. Sievers
EVP, Investor Relations