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PI6C557-03

100MHz, 125MHz Dual PCIe Clock Generator

Product Description

The PI6C557-03 is a spread spectrum clock generator supporting PCI Express and Ethernet requirements. The device is used for PC or embedded systems to substantially reduce Electromagnetic Interference (EMI).

The PI6C557-03 provides two differential (HCSL) spread spectrum outputs. The PI6C557-03 is configured to select spread and clock selection. Using Diodes' patented Phase-Locked Loop (PLL) techniques, the device takes a 25MHz crystal input and produces two pairs of differential outputs (HCSL) at 25MHz, 100MHz, 125MHz and 200MHz clock frequencies. It also provides spread selection of ±0.25%, -0.5%, -0.75%, and no spread.

Features

  • LVDS compatible output  
  • Supply voltage of 3.3V ±10%  
  • 25MHz input frequency  
  • HCSL outputs, 0.7V Current mode differential pair  
  • Jitter 60ps cycle-to-cycle (typ)  
  • Spread of ±0.25%, -0.5%, -0.75%, and no spread    
  • Industrial temperature range
  • Packaging: (Pb-free and Green)

        - 16-pin, 173 mils wide TSSOP

Product Specifications

Product Parameters

Supply Voltage 3.3
Jitter 85
Skew 100
Output Frequency 100
Input Type(s) CMOS, Differential
Output Type(s) HCSL
Number of Outputs 2
Function Generator
Temperature -40 to 85

Related Content

Packages
TSSOP (L16) MSL1 Sn

Applications

Technical Documents

Recommended Soldering Techniques
Orderable Part Number Status Package Environmental Compliance Packing Buy from Distributor /
Contact Sales
Request Samples
Qty. Carrier
PI6C557-03LEX Active TSSOP-16 GREEN 2500 T&R Request Sample

Environmental Compliance Legend:
GREEN: Halogen-free and RoHS compliant
RoHS: RoHS compliant but NOT halogen-free

PCNs

Product Change Notices

PCN # Issue Date Subject
13-04.A 2013-09-06 Amended PCN # 13-04 which states that these packages: TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire.
13-04 2013-01-24 Copper wire qualification for copper bond wire process for various TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) packages at Greatek assembly site.
16-12 2016-06-02 Adding two internal assembly and test sites: Diodes Technology (Chengdu) Company Limited (CAT) located in Chengdu, China and Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) (SAT) located in Shanghai, China.
PCN-2325 (Advance Notice) 2018-04-20 Fab Porting from Global Foundries to MagnaChip
PCN-2415 2019-06-28 Device End of Life (EOL)
16-22 2016-10-07 Change the tape and reel quantity multiple for the following package types from 3,000 to 2,500: TSSOP-8, -14, -16 (L), QSOP-16, -20 (Q), MQSOP-8 (UE), SOICP-8, -14, -16 (W) pins
Change the tape and reel quantity multiple for the following package types from 4,000 to 2,500: MQSOP-8, -10 (U) pins
PCN-2322 (Advance Notice) 2018-03-19 Fab Porting from Global Foundries to MagnaChip
10-01 2010-03-18 Adding Changjiang Electronics Technology Co. (“CJ”) assembly facility in China to our qualified supplier list of IC package subcontract manufacturers.
10-03 2010-06-17 Removal of back mark