The PI6C557-03 is a spread spectrum clock generator supporting PCI Express and Ethernet requirements. The device is used for PC or embedded systems to substantially reduce Electromagnetic Interference (EMI).
The PI6C557-03 provides two differential (HCSL) spread spectrum outputs. The PI6C557-03 is configured to select spread and clock selection. Using Diodes' patented Phase-Locked Loop (PLL) techniques, the device takes a 25MHz crystal input and produces two pairs of differential outputs (HCSL) at 25MHz, 100MHz, 125MHz and 200MHz clock frequencies. It also provides spread selection of ±0.25%, -0.5%, -0.75%, and no spread.
- 16-pin, 173 mils wide TSSOP
| Supply Voltage | 3.3 |
|---|---|
| Jitter | 85 |
| Skew | 100 |
| Output Frequency | 100 |
| Input Type(s) | CMOS, Differential |
| Output Type(s) | HCSL |
| Number of Outputs | 2 |
| Function | Generator |
| Temperature | -40 to 85 |
| Orderable Part Number | Status | Package | Environmental Compliance | Packing | Buy from Distributor / Contact Sales |
Request Samples | |
|---|---|---|---|---|---|---|---|
| Qty. | Carrier | ||||||
| PI6C557-03LE | Not Recommended for New Design (NRND) | TSSOP-16 | Lead-Fre | 96 | TUBE | ||
| PI6C557-03LEX | Active | TSSOP-16 | GREEN | 2500 | T&R | Request Sample | |
Environmental Compliance Legend:
GREEN: Halogen-free and RoHS compliant
RoHS: RoHS compliant but NOT halogen-free
| PCN # | Issue Date | Subject |
|---|---|---|
| 13-04 | 2013-01-24 | Copper wire qualification for copper bond wire process for various TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) packages at Greatek assembly site. |
| PCN-2325 (Advance Notice) | 2018-04-20 | Fab Porting from Global Foundries to MagnaChip |
| PCN-2415 | 2019-06-28 | Device End of Life (EOL) |
| 16-12 | 2016-06-02 | Adding two internal assembly and test sites: Diodes Technology (Chengdu) Company Limited (CAT) located in Chengdu, China and Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) (SAT) located in Shanghai, China. |
| 13-04.A | 2013-09-06 | Amended PCN # 13-04 which states that these packages: TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire. |
| 16-22 | 2016-10-07 | Change the tape and reel quantity multiple for the following package types from 3,000 to 2,500: TSSOP-8, -14, -16 (L), QSOP-16, -20 (Q), MQSOP-8 (UE), SOICP-8, -14, -16 (W) pins Change the tape and reel quantity multiple for the following package types from 4,000 to 2,500: MQSOP-8, -10 (U) pins |
| PCN-2322 (Advance Notice) | 2018-03-19 | Fab Porting from Global Foundries to MagnaChip |
| 10-03 | 2010-06-17 | Removal of back mark |
| 10-01 | 2010-03-18 | Adding Changjiang Electronics Technology Co. (“CJ”) assembly facility in China to our qualified supplier list of IC package subcontract manufacturers. |
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