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DMT6007LFGQ

N-CHANNEL ENHANCEMENT MODE MOSFET

Datasheet

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Description

This MOSFET is designed to meet the stringent requirements of automotive applications. It is qualified to AEC-Q101, supported by a PPAP and is ideal for use in: brushless DC motor controls, DC-DC converters, and load switches.

Feature(s)

Low R_DS(ON)– Ensures On-State Losses are Minimized
Excellent Q_gd ×R_DS(ON)Product (FOM)
Small Form Factor Thermally Efficient Package Enables Higher Density End Products
100% Unclamped Inductive Switching, Test in Production – Ensures More Reliable and Robust End Application
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
The DMT6007LFGQ is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Application(s)

Brushless DC motor controls
DC-DC converters
Load switches

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive(Q) supports PPAP)	Automotive
Polarity	N
ESD Diodes (Y\|N)	No
\|V_DS\| (V)	60 V
\|V_GS\| (±V)	20 ±V
\|I_DS\| @T_A = +25°C (A)	15 A
\|I_DS\| @T_C = +25°C (A)	80 A
P_D @T_A = +25°C (W)	2.2 W
P_D @T_C = +25°C (W)	62.5 W
R_DS(ON)Max@ V_GS(10V)(mΩ)	6 mΩ
R_DS(ON)Max@ V_GS(4.5V)(mΩ)	8.5 mΩ
\|V_GS(TH)\| Max (V)	2 V
Q_G Typ @ \|V_GS\| = 4.5V (nC)	19.3 nC
Q_G Typ @ \|V_GS\| = 10V (nC)	41.3 nC
C_ISS Typ (pF)	2090 pF
C_ISS Condition @\|V_DS\| (V)	30 V

Technical Documents

SPICE Model

DMT6007LFGQ.spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2570	2022-03-02	2022-06-02	Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu Bond Wire, New Mold Compound Type, and New Die Attach Material for Select Automotive Products