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DMP2305U

P-CHANNEL ENHANCEMENT MODE MOSFET

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Product Specifications

Product Parameters

Qualified to AECQ10x Yes
Automotive Compliant PPAP On Request*
Polarity P
ESD Diodes No
VDS 20 V
VGS 8 ±V
IDS @ TA = +25°C 4.2 A
PD @ TA = +25°C 1.4 W
RDS(ON) Max @ VGS (10V) N/A mΩ
RDS(ON) Max @ VGS (4.5V) 60 mΩ
RDS(ON) Max @ VGS (2.5V) 90 mΩ
RDS(ON) Max @ VGS (1.8V) 113 mΩ
VGS (th) Max 0.9 V
QG Typ @ VGS = 4.5V (nC) 7.6 nC
QG Typ @ VGS = 10V (nC) N/A nC

Related Content

Packages
SOT23

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Authorized Distributor Quantity Inventory Date Buy Online Region
DMP2305U-7 Avnet EU 63000 8/10/2020 Buy Now Germany
DMP2305U-7 Arrow Electronics 748 8/10/2020 Buy Now United States
DMP2305U-7 Arrow/Components Agent Ltd. 4584000 8/10/2020 Buy Now Hong Kong
DMP2305U-7 Avnet 3000 8/10/2020 Buy Now United States
DMP2305U-7 Digi-Key Electronics 153762 8/10/2020 Buy Now United States
DMP2305U-7 Farnell, An Avnet Company 28995 8/10/2020 Buy Now England
DMP2305U-7 Future Electronics 548 8/10/2020 Buy Now Canada
DMP2305U-7 Future Electronics - Asia 105000 8/10/2020 Singapore
DMP2305U-7 Future Electronics - Europe 309000 8/10/2020 England
DMP2305U-7 Future Electronics - Europe 2 8/10/2020 England
DMP2305U-7 Mouser Electronics Inc. 52439 8/10/2020 Buy Now United States
DMP2305U-7 RS Components 1000 8/10/2020 Buy Now England
DMP2305U-7 RS Components Ltd. 1100 8/10/2020 Buy Now Japan
DMP2305UVT-7 Arrow Electronics Central EU 3000 8/10/2020 Buy Now Germany
DMP2305UVT-7 Digi-Key Electronics 27 8/10/2020 Buy Now United States
DMP2305UVT-7 Mouser Electronics Inc. 1985 8/10/2020 Buy Now United States

PCNs

Product Change Notices

PCN # Issue Date Subject
PCN-2458 2020-07-01 Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2374 2018-12-07 Qualification of "Diodes Technology (Cheng Du) Company Limited"
(CAT) as an Additional Assembly & Test Site, Conversion to Palladium Coated Copper Bond Wire with New Molding Compound, and Qualification of Alternative Die Source on Select Products
PCN-2340 2018-04-26 Qualification of Alternate Wafer Sources for Select MOSFET Products