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| Qualified to AECQ10x | Yes |
|---|---|
| Compliance (Only Automotive supports PPAP) | On Request* |
| Polarity | P |
| ESD Diodes | No |
| VDS | 20 V |
| VGS | 8 ±V |
| IDS @TA = +25°C | 4.2 A |
| PD @TA = +25°C | 1.4 W |
| RDS(ON)Max @ VGS(10V) | N/A mΩ |
| RDS(ON)Max @ VGS(4.5V) | 60 mΩ |
| RDS(ON)Max @ VGS(2.5V) | 90 mΩ |
| RDS(ON)Max @ VGS(1.8V) | 113 mΩ |
| VGS (th) Max | 0.9 V |
| QG Typ @ VGS = 4.5V | 7.6 nC |
| QG Typ@ VGS = 10V(nC) | N/A nC |
| Orderable Part Number | Buy from Distributor / Contact Sales | Request Samples |
|---|---|---|
| DMP2305U-7 | Request Sample | |
| DMP2305UVT-7 | Request Sample |
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2425 | 2019-10-04 | 2020-01-04 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products. |
| PCN-2458 | 2020-07-01 | 2020-10-01 | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2374 | 2018-12-07 | 2019-03-07 | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Conversion to Palladium Coated Copper Bond Wire with New Molding Compound, and Qualification of Alternative Die Source on Select Products |
| PCN-2340 | 2018-04-26 | 2018-05-26 | Qualification of Alternate Wafer Sources for Select MOSFET Products |
