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DMP2305U

P-CHANNEL ENHANCEMENT MODE MOSFET

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Product Specifications

Product Parameters

Qualified to AECQ10x Yes
Compliance (Only Automotive supports PPAP) On Request*
Polarity P
ESD Diodes No
VDS 20 V
VGS 8 ±V
IDS @TA = +25°C 4.2 A
PD @TA = +25°C 1.4 W
RDS(ON)Max @ VGS(10V) N/A mΩ
RDS(ON)Max @ VGS(4.5V) 60 mΩ
RDS(ON)Max @ VGS(2.5V) 90 mΩ
RDS(ON)Max @ VGS(1.8V) 113 mΩ
VGS (th) Max 0.9 V
QG Typ @ VGS = 4.5V 7.6 nC
QG Typ@ VGS = 10V(nC) N/A nC

Related Content

Packages
SOT23

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMP2305U-7

DMP2305U-7

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Future Electronics - Europe 2 4/22/2021 England Contact Sales
RS Components Ltd. 500 4/22/2021 Japan Buy Now
Request Sample
DMP2305UVT-7

DMP2305UVT-7

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow Electronics Central EU 3000 4/23/2021 Europe Buy Now
Mouser Electronics Inc. 1780 4/23/2021 South America, North America, Asia, Europe, Middle East Buy Now
Request Sample

PCNs

Product Change Notices

PCN # Issue Date Implementation Date Subject
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.
PCN-2458 2020-07-01 2020-10-01 Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2374 2018-12-07 2019-03-07 Qualification of "Diodes Technology (Cheng Du) Company Limited"
(CAT) as an Additional Assembly & Test Site, Conversion to Palladium Coated Copper Bond Wire with New Molding Compound, and Qualification of Alternative Die Source on Select Products
PCN-2340 2018-04-26 2018-05-26 Qualification of Alternate Wafer Sources for Select MOSFET Products