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DMP2305U

P-CHANNEL ENHANCEMENT MODE MOSFET

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Product Specifications

Product Parameters

Qualified to AEC-Q10x Yes
Compliance (Only Automotive supports PPAP) On Request
Polarity P
ESD Diodes (Y|N) No
VDS (V) 20 V
VGS (±V) 8 ±V
IDS @TA = +25°C (A) 4.2 A
PD @TA = +25°C (W) 1.4 W
RDS(ON)Max @ VGS(4.5V)(mΩ) 60 mΩ
RDS(ON)Max @ VGS(2.5V)(mΩ) 90 mΩ
RDS(ON)Max @ VGS(1.8V)(mΩ) 113 mΩ
VGS (th) Max (V) 0.9 V
QG Typ @ VGS = 4.5V (nC) 7.6 nC

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Orderable Part Number Buy from Distributor / Contact Sales Request Samples
DMP2305U-7

DMP2305U-7

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Future Electronics - Europe 2 9/18/2021 England Contact Sales
Farnell, An Avnet Company 4 9/17/2021 England Buy Now
Farnell, An Avnet Company 4 9/17/2021 England Buy Now
Request Sample
DMP2305UVT-7

DMP2305UVT-7

Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
Arrow Electronics Central EU 2900 9/19/2021 Europe Buy Now
Request Sample

PCNs

Product Change Notices

PCN # Issue Date Implementation Date Subject
PCN-2458 2020-07-01 2020-10-01 Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.
PCN-2374 2018-12-07 2019-03-07 Qualification of "Diodes Technology (Cheng Du) Company Limited"
(CAT) as an Additional Assembly & Test Site, Conversion to Palladium Coated Copper Bond Wire with New Molding Compound, and Qualification of Alternative Die Source on Select Products
PCN-2340 2018-04-26 2018-05-26 Qualification of Alternate Wafer Sources for Select MOSFET Products