Diodes Incorporated — Analog and discrete power solutions
V DFN5045 12

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. V-DFN5045-12

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DMHC10H170SFJ

100V Complementary Enhancement Mode MOSFET H-Bridge

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Description

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Feature(s)

  • Low On-Resistance
  • Low Input Capacitance
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Application(s)

  • High-Efficiency Bridge Rectifiers

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

Yes

Polarity

2N2P

ESD Diodes (Y|N)

No

|VDS| (V)

100 V

|VGS| (±V)

20 ±V

|IDS| @TA = +25°C (A)

2.3, 2.9 A

PD @TA = +25°C (W)

2.1 W

RDS(ON)Max@ VGS(10V)  (mΩ)

250, 160 mΩ

RDS(ON)Max@ VGS(4.5V)  (mΩ)

300, 200 mΩ

|VGS(TH)| Min (V)

1, 1 V

|VGS(TH)| Max (V)

3, 3 V

QG Typ @ |VGS| = 10V (nC)

17.5, 9.7 nC

CISS Typ (pF)

1239, 1167 pF

CISS Condition @|VDS| (V)

25 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products