Diodes Incorporated — Analog and discrete power solutions
Back to Inactive Datasheet Archive

SDT30100VCT (NRND)

NRND = Not Recommended for New Design

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

The SDT30100VCT provides very low VF and extremely excellent reverse leakage stability at high temperatures. It is ideal for use as a rectifier, freewheel or blocking diode.

Feature(s)

  • Low Forward Voltage Drop
  • Low Power Loss
  • Excellent High Temperature Stability
  • Soft, Fast Switching Capability

Application(s)

  • DC-DC Converters
  • AC-DC Adaptors

Specifications & Technical Documents

Product Parameters

@ IF (A)

15

@ TerminalTemperature TT (ºC)

N/A

@ VR (V)

100

Configuration

Dual

Forward VoltageDrop VF(V)

0.72

MaximumAverageRectifiedCurrent IO (A)

30

Maximum ReverseCurrent IR (µA)

100

Peak ForwardSurge CurrentIFSM(A)

200

Peak RepetitiveReverse VoltageVRRM (V)

100

AEC Qualified

No

Related Content

Packages

Applications

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

Something went wrong with your request. Please try again later. If this problem continues, please contact Diodes support for assistance.

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2584 2022-05-19 2022-11-19 Device End of Life (EOL)
PCN-2562 2022-01-04 2022-04-04 Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2450 2020-02-17 2020-05-17 Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products