Diodes Incorporated — Analog and discrete power solutions
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SDM20U30LP

Schottky

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Feature(s)

  • Low-Forward Voltage Drop
  • Guard Ring Construction for Transient Protection
  • Low Capacitance
  • Ultra-Small Surface-Mount Package
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/
  • An automotive-compliant part is available under separate datasheet (SDM20U30LPQ)

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

Yes

Configuration

Single

Power Rating(mW)

250 mW

Peak RepetitiveReverse VoltageVRRM (V)

30 V

Forward Continuous Current IFM (mA)

200 mA

Forward VoltageDrop VF(V)

0.35

@ IF(mA)

20 mA

Maximum ReverseCurrent IR (µA)

150 µA

@ VR (V)

30 V

Capacitance CTOT Typ (pF)

20 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2623 2023-05-15 2023-11-15 Device End of Life (EOL)
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2459 2020-05-28 2020-11-28 Device End of Life (EOL)
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site