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Product Description

The PI3B3257 is a 3.3 Volt, Quad 2:1 multiplexer/demultiplexer with three-state outputs that is pinout and function compatible with the PI74FCT257T, 74F257, and 74ALS/AS/LS257. Inputs can be connected to outputs with low On-Resistance (5Ω) with no additional ground bounce noise or propagation delay.

Features

  • Near-Zero propagation delay
  • 5Ω switches connect inputs to outputs
  • Fast Switching Speed: 4.8ns max.
  • Ultra-Low Quiescent Power: 0.1μA typical
    • Ideally suited for notebook applications
  • Pin compatible with 74 series 257 logic devices
  • Packaging (Pb-free & Green avaliable):
    • 16-pin 150 mil wide plastic QSOP (Q)
    • 16-pin 150 mil wide plastic SOIC (W)
    • 16-pin 173 mil wide plastic TSSOP (L)

Product Specifications

Product Parameters

Configuration Mux: Quad 2-Channel
Differential Channels N/A
HotInsertion 0
Lanes N/A
OtherFeatures N/A
RailToRail 0
Signal Type Single Ended
Single Ended Channels 2
Type N/A
Voltage 3.3

Related Content

Packages
UQFN (ZHD16) MSL1 PPF
TSSOP (L16) MSL1 Sn
QSOP (Q16) MSL1 Sn
SOIC (W16) MSL1 Sn

Applications

Technical Documents

Design tool model software

Recommended Soldering Techniques

TN1.pdf

Additional Technical Documents are available upon request: 
Application information, Evaluation board, and Other technical documents

Request Documents
Orderable Part Number Status Package Environmental Compliance Packing Buy from Distributor /
Contact Sales
Request Samples
Qty. Carrier
PI3B3257LE Active TSSOP-16 GREEN 96 TUBE Request Sample
PI3B3257LEX Active TSSOP-16 TPGP 2500 T&R Request Sample
PI3B3257QE Active QSOP-16 GREEN 97 TUBE Request Sample
PI3B3257QEX Active QSOP-16 GREEN 2500 T&R Request Sample
PI3B3257WE Active SO-16 GREEN 48 TUBE Request Sample
PI3B3257WEX Active SO-16 GREEN 2500 T&R Contact Sales Request Sample
PI3B3257ZHDEX Active U-QFN3030-16 GREEN 3500 T&R Request Sample

Environmental Compliance Legend:
LFF: Pb-Free Finish and RoHS 5/6
TLFP: Totally Pb-Free Product and RoHS 6/6
LFGP: Pb-free Finish and Green Product, RoHS 5/6 and Halogen Free
TPGP: Totally Pb-Free and Green Product, RoHS 6/6 and Halogen Free
GREEN: Halogen-free and RoHS compliant
RoHS: RoHS compliant but NOT halogen-free

PCNs

Product Change Notices

PCN # Issue Date Subject
04-14 2004-09-21 The change represents a die layout optimization that reduces chip size by approximately 25%, while using the same 0.35-mm wafer fab process and design rules.
12-27 2012-10-28 Copper wire qualification for copper bond wire process for various TSSOP (L08, L14, L16) and QSOP (Q16) packages at CJ assembly site.
10-01 2010-03-18 Adding Changjiang Electronics Technology Co. (“CJ”) assembly facility in China to our qualified supplier list of IC package subcontract manufacturers.
16-08 2016-05-20 Update some of our package outline drawing dimensions to align with JEDEC standards (with some exceptions) on few packages to accommodate the POD’s of our existing assembly suppliers and own assembly factories
13-04 2013-01-24 Copper wire qualification for copper bond wire process for various TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) packages at Greatek assembly site.
16-12 2016-06-02 Adding two internal assembly and test sites: Diodes Technology (Chengdu) Company Limited (CAT) located in Chengdu, China and Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) (SAT) located in Shanghai, China.
13-04.A 2013-09-06 Amended PCN # 13-04 which states that these packages: TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire.
12-27.A 2013-09-06 Amended PCN # 12-27 which states that these packages: TSSOP (L08, L14, L16) and QSOP (Q16) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire.
10-03 2010-06-17 Removal of back mark
16-22 2016-10-07 Change the tape and reel quantity multiple for the following package types from 3,000 to 2,500: TSSOP-8, -14, -16 (L), QSOP-16, -20 (Q), MQSOP-8 (UE), SOICP-8, -14, -16 (W) pins
Change the tape and reel quantity multiple for the following package types from 4,000 to 2,500: MQSOP-8, -10 (U) pins
11-21 2011-09-23 Porting some BUS Switch products from Global Foundry 0.35 micron, 3-volt CMOS process (C) to Magnachip (G). Layout optimization (shrink die) was also done without major die re-design
16-26 2016-10-31 Adding JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China as an additional supplier for devices in TSSOP, MSOP, SOIC, QSOP packages.
14-19 2014-09-05 Add Nantong Fujitsu Microelectronics Co. Ltd. (NFME) as approved vendor listing for IC products in the QSOP, TSSOP, MSOP, QFN and LQFP packages.
13-25 2013-10-28 Add Nantong Fujitsu Microelectronics Co. Ltd. (NFME) to PTI approved vendor listing for IC products in the SOIC packages.

PDNs

Discontinued parts in this family

Obsolete Part # View PDN Package Comment Note
PI3B3257AQ PDN 08-0201 Q16 Contact Product Sales See other Bus Switch products
PI3B3257Q PDN 08-0201 Q16 Contact Product Sales See other Bus Switch products
PI3B3257W PDN 08-0201 W16 Contact Product Sales See other Bus Switch products