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Product Description

The PI3B3253 is a 3.3V, Dual4:1 Multiplexer/ Demultiplexer with Hi-Z outputs that is pinout compatible with the PI74FCT253T, 74F253, and 74ALS/AS/LS 253. Inputs can be connected to outputs with low On-Resistance (5Ω) with no additional ground bounce noise or propagation delay.

Features

  • Near-Zero propagation delay
  • 5Ω switches connect inputs to outputs
  • Fast Switching Speed: 5.2ns max.
  • Ultra Low Quiescent Power (0.2μA typical)
    • Ideally suited for notebook applications
  • Pin compatible with 74 series 253 logic devices
  • Packaging (Pb-free & Green available):
    • 16-pin 150-mil wide plastic QSOP (Q)
    • 16-pin 173-mil wide plastic TSSOP (L)

Product Specifications

Product Parameters

Configuration Mux:2 4-Channel
Differential Channels N/A
HotInsertion 0
Lanes N/A
OtherFeatures N/A
RailToRail 0
Signal Type Single Ended
Single Ended Channels 4
Type N/A
Voltage 3.3

Related Content

Packages
UQFN (ZHD16) MSL1 PPF
TSSOP (L16) MSL1 Sn
QSOP (Q16) MSL1 Sn

Applications

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Additional Technical Documents are available upon request: 
Application information, Evaluation board, and Other technical documents

Request Documents
Orderable Part Number Status Package Environmental Compliance Packing Buy from Distributor /
Contact Sales
Request Samples
Qty. Carrier
PI3B3253LE Active TSSOP-16 GREEN 96 TUBE Request Sample
PI3B3253LEX Active TSSOP-16 TPGP 2500 T&R Request Sample
PI3B3253QE Active QSOP-16 GREEN 97 TUBE Request Sample
PI3B3253QEX Active QSOP-16 GREEN 2500 T&R Request Sample
PI3B3253ZHDEX Active U-QFN3030-16 GREEN 3500 T&R Request Sample

Environmental Compliance Legend:
LFF: Pb-Free Finish and RoHS 5/6
TLFP: Totally Pb-Free Product and RoHS 6/6
LFGP: Pb-free Finish and Green Product, RoHS 5/6 and Halogen Free
TPGP: Totally Pb-Free and Green Product, RoHS 6/6 and Halogen Free
GREEN: Halogen-free and RoHS compliant
RoHS: RoHS compliant but NOT halogen-free

PCNs

Product Change Notices

PCN # Issue Date Subject
13-04 2013-01-24 Copper wire qualification for copper bond wire process for various TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) packages at Greatek assembly site.
11-21 2011-09-23 Porting some BUS Switch products from Global Foundry 0.35 micron, 3-volt CMOS process (C) to Magnachip (G). Layout optimization (shrink die) was also done without major die re-design
10-01 2010-03-18 Adding Changjiang Electronics Technology Co. (“CJ”) assembly facility in China to our qualified supplier list of IC package subcontract manufacturers.
16-08 2016-05-20 Update some of our package outline drawing dimensions to align with JEDEC standards (with some exceptions) on few packages to accommodate the POD’s of our existing assembly suppliers and own assembly factories
16-12 2016-06-02 Adding two internal assembly and test sites: Diodes Technology (Chengdu) Company Limited (CAT) located in Chengdu, China and Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) (SAT) located in Shanghai, China.
12-27 2012-10-28 Copper wire qualification for copper bond wire process for various TSSOP (L08, L14, L16) and QSOP (Q16) packages at CJ assembly site.
10-03 2010-06-17 Removal of back mark
12-27.A 2013-09-06 Amended PCN # 12-27 which states that these packages: TSSOP (L08, L14, L16) and QSOP (Q16) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire.
16-26 2016-10-31 Adding JCET (Jiangsu Changjiang Electronics Technology Co., Ltd) in Suqian, China as an additional supplier for devices in TSSOP, MSOP, SOIC, QSOP packages.
14-19 2014-09-05 Add Nantong Fujitsu Microelectronics Co. Ltd. (NFME) as approved vendor listing for IC products in the QSOP, TSSOP, MSOP, QFN and LQFP packages.
13-04.A 2013-09-06 Amended PCN # 13-04 which states that these packages: TSSOP (L08, L14, L16, L24), SSOP (H20), QSOP (Q16, Q20, Q24), SOIC (W08, W14, W16) and TQFN (ZL72) will be assembled using copper wire. Pericom has changed the business plan and we now intend to use gold wire only for particular products while the rest remains using copper wire.
16-22 2016-10-07 Change the tape and reel quantity multiple for the following package types from 3,000 to 2,500: TSSOP-8, -14, -16 (L), QSOP-16, -20 (Q), MQSOP-8 (UE), SOICP-8, -14, -16 (W) pins
Change the tape and reel quantity multiple for the following package types from 4,000 to 2,500: MQSOP-8, -10 (U) pins
PCN-2466 2020-07-02 Package Change and Additional Qualified Plating Source
13-25 2013-10-28 Add Nantong Fujitsu Microelectronics Co. Ltd. (NFME) to PTI approved vendor listing for IC products in the SOIC packages.

PDNs

Discontinued parts in this family

Obsolete Part # View PDN Package Comment Note
PI3B3253L PDN 08-0201 L16 Contact Product Sales See other Bus Switch products
PI3B3253LX PDN 08-0201 L16 Contact Product Sales See other Bus Switch products
PI3B3253Q PDN 08-0201 Q16 Contact Product Sales See other Bus Switch products
PI3B3253QX PDN 08-0201 Q16 Contact Product Sales See other Bus Switch products
PI3B3253W PDN 07-0501 W Contact Product Sales See other Bus Switch products
PI3B3253WE PDN 07-0501 W Contact Product Sales See other Bus Switch products