Diodes Incorporated
SOT363

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

SOT363.png
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MMDT5551

Dual NPN, 160V, 0.2A, SOT363

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Feature(s)

  • Epitaxial Planar Die Construction
  • Complementary PNP Type – MMDT5401
  • Ideal for Medium Power Amplification and Switching
  • Ultra-Small Surface-Mount Package
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

Category High Voltage Transistor
Compliance(Only Automotive supports PPAP) Standard
Polarity NPN + NPN
VCEO, VCES (V) 160
IC (A) 0.2
ICM (A) -
PD (W) 0.2
hFE (Min) 80
hFE (@ IC) (A) 0.01
hFE(Min 2) 30
hFE (@ IC2) (A) 0.05
VCE(sat) Max (mV) 150
VCE(SAT) (@ IC/IB) (A/mA) 0.01/1
VCE(sat) (Max.2) (mV) 200
VCE(sat) (@ IC/IB2) (A/mA) 0.05/5
fT (MHz) 100
RCE(sat) (mΩ) -

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2402 2019-05-15 2019-08-15 Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site and Conversion to Palladium Coated Copper Bond Wire with New Lead Frame Type on Select Products