Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
SOT363.pngDual PNP, 150V, 0.2A, SOT363
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| Category | High Voltage Transistor |
|---|---|
| Compliance(Only Automotive supports PPAP) | Standard |
| Polarity | PNP + PNP |
| VCEO, VCES (V) | 150 |
| IC (A) | 0.2 |
| ICM (A) | - |
| PD (W) | 0.2 |
| hFE (Min) | 60 |
| hFE (@ IC) (A) | 0.01 |
| hFE(Min 2) | 50 |
| hFE (@ IC2) (A) | 0.05 |
| VCE(sat) Max (mV) | 200 |
| VCE(SAT) (@ IC/IB) (A/mA) | 0.01/1 |
| VCE(sat) (Max.2) (mV) | 500 |
| VCE(sat) (@ IC/IB2) (A/mA) | 0.05/5 |
| fT (MHz) | 100 |
| RCE(sat) (mΩ) | - |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2632 | 2023-06-13 | 2023-09-11 | Addition of A Passivation Layer Over The Top Metal of The Die for Select BJT Products |
| PCN-2461 | 2020-05-08 | 2021-04-05 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site |
| PCN-2402 | 2019-05-15 | 2019-08-15 | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site and Conversion to Palladium Coated Copper Bond Wire with New Lead Frame Type on Select Products |
