Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOT363
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOT363
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOT363
multi-chip
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| Compliance (Only Automotive Supports PPAP) | Standard |
|---|---|
| AEC Qualified | No |
| R1 / R2 (KΩ) | No KΩ |
| MaximumVCEO/VCC (V) | -60 V |
| MaximumIO/IC (mA) | -600 mA |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2461 | 2020-05-08 | 2021-04-05 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site |
