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SOT363.pngDUAL N-CHANNEL ENHANCEMENT MODE MOSFET
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| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive(Q) supports PPAP) | Standard |
| Polarity | N+N |
| ESD Diodes (Y|N) | Yes |
| |VDS| (V) | 50 V |
| |VGS| (±V) | 20 ±V |
| |IDS| @TA = +25°C (A) | 0.36 A |
| PD @TA = +25°C (W) | 0.31 W |
| RDS(ON)Max@ VGS(10V)(mΩ) | 1600 mΩ |
| RDS(ON)Max@ VGS(4.5V)(mΩ) | 2500 mΩ |
| RDS(ON)Max@ VGS(2.5V)(mΩ) | 4500 mΩ |
| |VGS(TH)| Max (V) | 1.5 V |
| QG Typ @ |VGS| = 4.5V (nC) | 0.6 nC |
| CISS Typ (pF) | 46 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2484 | 2020-11-04 | 2021-02-04 | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using PdCu or Au Bond Wire, And Standardization of Assembly Bill of Materials At The Existing CAT Site for Select Discrete Products |
| PCN-2458 | 2020-07-01 | 2020-10-01 | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2403 | 2019-03-25 | 2019-06-19 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products. |
