Diodes Incorporated — Analog and discrete power solutions
SOT363

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DMC3400SDW

Complementary Pair Enhancement Mode MOSFET

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Description

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) yet maintain superior switching performance, making it ideal for high-efficiency power-management applications.  

Feature(s)

  • Low On-Resistance
  • Low Input Capacitance
  • Fast Switching Speed
  • ESD Protected Gate
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Application(s)

  • Motor control
  • Power-management functions
  • DC-DC converters

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

No

Polarity

N+P

ESD Diodes (Y|N)

Yes

|VDS| (V)

30, 30 V

|VGS| (±V)

20, 20 ±V

|IDS| @TA = +25°C (A)

0.65, 0.45 A

PD @TA = +25°C (W)

0.39 W

RDS(ON)Max@ VGS(10V)  (mΩ)

400, 900 mΩ

RDS(ON)Max@ VGS(4.5V)  (mΩ)

700, 1700 mΩ

|VGS(TH)| Max (V)

1.6, 2.6 V

QG Typ @ |VGS| = 4.5V (nC)

0.6, 0.6 nC

QG Typ @ |VGS| = 10V (nC)

1.4, 1.3 nC

CISS Typ (pF)

54, 55 pF

CISS Condition @|VDS| (V)

15, 15 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products