Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

Back to MOSFET Master Table

DMC3400SDW

COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET

Datasheet

Contact Sales

Description

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Feature(s)

Low On-Resistance
Low Input Capacitance
Fast Switching Speed
ESD Protected Gate
Totally Lead-Free & Fully RoHS Compliant
Halogen and Antimony Free. “Green” Device

Application(s)

Motor Control
Power Management Functions
DC-DC Converters

Product Specifications

Product Parameters

AEC Qualified	No
Compliance (Only Automotive(Q) supports PPAP)	Standard
Polarity	N+P
ESD Diodes (Y\|N)	Yes
\|V_DS\| (V)	30, 30 V
\|V_GS\| (±V)	20, 20 ±V
\|I_DS\| @T_A = +25°C (A)	0.65, 0.45 A
P_D @T_A = +25°C (W)	0.39 W
R_DS(ON)Max@ V_GS(10V)(mΩ)	400, 900 mΩ
R_DS(ON)Max@ V_GS(4.5V)(mΩ)	700, 1700 mΩ
\|V_GS(TH)\| Max (V)	1.6, 2.6 V
Q_G Typ @ \|V_GS\| = 4.5V (nC)	0.6, 0.6 nC
Q_G Typ @ \|V_GS\| = 10V (nC)	1.4, 1.3 nC
C_ISS Typ (pF)	54, 55 pF
C_ISS Condition @\|V_DS\| (V)	15, 15 V

Technical Documents

SPICE Model

DMC3400SDW.spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2495	2021-03-31	2021-07-01	Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products
PCN-2425	2019-10-04	2020-01-04	Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products.