Diodes Incorporated
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DGD2101 (Obsolete)


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The DGD2101 is a high voltage/high speed gate driver capable of driving N-Channel MOSFETs and IGBTs in a high-side/low-side configuration. High voltage processing techniques enable the DGD2101’s high-side to switch to 600V in a bootstrap operation. The 50ns (max) propagation delay matching between the high and the low side drivers allows high frequency switching.

The DGD2101 logic inputs are compatible with standard TTL and CMOS levels (down to 3.3V) for easy interfacing with controlling devices. The driver outputs feature high pulse current buffers designed for minimum driver cross conduction. The low-side gate driver and logic share a common ground.

The DGD2101 is available in a space saving 8-pin SO package, the operating temperature extends from -40°C to +125°C.


  • Floating High-Side Driver in Bootstrap Operation to 600V
  • Drives Two N-Channel MOSFETs or IGBTs in High-side/Low-side Configuation
  • Outputs Tolerant to Negative Transients
  • Wide Low-side Gate Driver and Logic Supply: 10V to 20V
  • Logic Inputs CMOS and TTL Compatible (Down to 3.3V)
  • Schmitt Triggered Logic Inputs with Internal Pull Down
  • Undervoltage Lockout for VCC
  • Space Saving SO-8 Package Available
  • Extended Temperature Range: -40°C to +125°C
  • Totally Lead-Free & Fully RoHS Compliant
  • Halogen and Antimony free. “Green” Device


  • Motor Control
  • AC-DC Power Supplies

Product Specifications

Product Parameters

Inputs HIN, LIN
Offset Voltage Max (V) 600
Output Current IO- (Typ) (mA) 600
Output Current IO+ (Typ) (mA) 290
tF (Typ) (ns) 35
tOFF (Typ) (ns) 150
tON (Typ) (ns) 160
tR (Typ) (ns) 70

Related Content



Technical Documents

Evaluation Boards and User Guides

Recommended Soldering Techniques


Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2502 2021-03-15 2021-09-15 Device End of Life (EOL)