Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
SOT563.pngComplementary, 50V, 0.1A, SOT563
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| Compliance (Only Automotive supports PPAP) | No |
|---|---|
| Category | R1 Only |
| Compliance(Only Automotive supports PPAP) | Standard |
| IC Max (mA) | 100 |
| Maximum OutputCurrent ICM | 100 |
| MaximumPD | 150 |
| PD (mW) | 150 |
| Polarity | NPN + PNP |
| Product Type | NPN + PNP |
| AEC Qualified | Yes |
| R1 Bias Resistor(kΩ) | 0.22 |
| R1 Typ (kΩ) | 0.22 |
| R2 Bias Resistor(kΩ) | N/A |
| R2 Typ (kΩ) | N/A |
| Series | R1 Only |
| VCEO | 50 |
| VCEO (V) | 50 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2582 | 2022-05-17 | 2022-08-17 | Qualified Additional Bill of Material (BOM) – Lead Frame Raw Material (C19400 XSH) |
| PCN-2587 | 2022-05-13 | 2022-11-13 | Device End of Life (EOL) |
| PCN-2512 | 2021-04-16 | 2021-07-16 | Qualified Additional Assembly & Test (A/T) Site |
| PCN-2498 | 2021-04-07 | 2021-04-07 | Qualification of Additional Wafer Source, and Additional Assembly and Test (A/T) Site for Select Discrete Products |
| PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2502 | 2021-03-15 | 2021-09-15 | Device End of Life (EOL) |
| PCN-2461 | 2020-05-08 | 2021-04-05 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site |
