Diodes Incorporated
SOT363

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SOT363.png
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BSS8402DW

COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET

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Description

This MOSFET has been designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Feature(s)

• Low On-Resistance
• Low Gate Threshold Voltage
• Low Input Capacitance
• Fast Switching Speed
• Low Input/Output Leakage
• Complementary Pair
• Totally Lead-Free & Fully RoHS Compliant 
• Halogen and Antimony Free. “Green” Device 
• Qualified to AEC-Q101 Standards for High Reliability

Application(s)

• General Purpose Interfacing Switch
• Power Management Functions
• Analog Switch

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N+P
ESD Diodes (Y|N) No
|VDS| (V) 60, 50 V
|VGS| (±V) 20, 20 ±V
|IDS| @TA = +25°C (A) 0.115, 0.13 A
PD @TA = +25°C (W) 0.2 W
RDS(ON)Max@ VGS(4.5V)(mΩ) 7500, 10000 mΩ
|VGS(TH)| Max (V) 2.5, 2 V
CISS Typ (pF) 50, 45 pF
CISS Condition @|VDS| (V) 25, 20 V

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2533 2021-09-02 2022-03-02 Device End of Life (EOL)
PCN-2498 2021-04-07 2021-04-07 Qualification of Additional Wafer Source, and Additional Assembly and Test (A/T) Site for Select Discrete Products
PCN-2458 2020-07-01 2020-10-01 Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.