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SOT363

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOT363

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BC847PNQ

Complementary, 45V, 0.1A, SOT363

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Description

This Bipolar Junction Transistor (BJT) is designed to meet the stringent requirements of Automotive Applications.

Feature(s)

  • Two Internally Isolated NPN/PNP Transistors in One Package
  • Ideal for Medium Power Amplification and Switching
  • Ultra-small Surface Mount Package
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. "Green" Device (Note 3)
  • The BC847PNQ is suitable for automotive applications
  • requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Automotive

Category

Small Signal Transistor

Polarity

NPN + PNP

RCE(sat) (mΩ)

-

VCEO, VCES (V)

45

IC (A)

0.1

ICM (A)

0.2

PD (W)

0.2

hFE (Min)

200, 220

hFE (@ IC) (A)

0.002

hFE (@ IC2) (A)

-

VCE(sat) Max (mV)

250, 300

VCE(SAT) (@ IC/IB) (A/mA)

0.01/0.5

VCE(sat) (Max.2) (mV)

600, 650

VCE(sat) (@ IC/IB2) (A/mA)

0.1/5

fT (MHz)

100

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2615 2023-02-02 2023-05-02 Datasheet Revision Due to Maximum VBE(on) Specification Limit Change - Automotive
PCN-2462 2020-05-08 2021-04-11 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)