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SOT363

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BAV99DWQ

SURFACE MOUNT SWITCHING DIODE ARRAY

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Description

Surface mount switching diode array.

Feature(s)

  • Fast Switching Speed
  • Small Surface Mount Package
  • Low Reverse Recovery Time for Fast Switching
  • Two “BAV99” Circuits In One Package
  • Totally Lead-Free & Fully RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • Qualified to AEC-Q101 Standards for High Reliability
  • PPAP Capable

Application(s)

  • Automotive

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP) Automotive
AEC Qualified Yes
Configuration Quad, Isolated
Polarity Anode, Cathode
Power Rating(mW) 200 mW
ESD Diodes (Y|N) No
Peak RepetitiveReverse VoltageVRRM (V) 75 V
Reverse RecoveryTime trr (ns) 4 ns
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω 4
V(BR)R (V) Min @IR=100μA 75@2.5?A
Maximum Average Rectifier Current IO (mA) 215 mA
Maximum Peak Forward Surge Current IFSM (A) 2 A
Forward Voltage Drop VF @ IF (mA) 1, 50 mA
Maximum ReverseCurrent IR (µA) 2.5 µA
TotalCapacitance CT (pF) 2 pF
VF(V) Max @ IF=100mA 1
Maximum Reverse Current IR @ VR (V) 75 V
IR(uA) Max @ VR=80V 2.5uA@75V
CT(pF) Max @ VR = 0V, f = 1MHz 2

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2640 2023-09-12 2024-03-13 Device End of Life (EOL) - Automotive
PCN-2462 2020-05-08 2021-04-11 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)