Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOT563
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOT563
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOT563
Schottky
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Compliance (Only Automotive Supports PPAP) |
Standard |
|---|---|
AEC Qualified |
Yes |
Configuration |
Dual, Isolated |
Power Rating(mW) |
150 mW |
Peak RepetitiveReverse VoltageVRRM (V) |
30 V |
Forward Continuous Current IFM (mA) |
200 mA |
Forward VoltageDrop VF(V) |
0.32 |
@ IF(mA) |
1 mA |
Maximum ReverseCurrent IR (µA) |
2 µA |
@ VR (V) |
25 V |
Capacitance CTOT Typ (pF) |
10 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2623 | 2023-05-15 | 2023-11-15 | Device End of Life (EOL) |
| PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2461 | 2020-05-08 | 2021-04-05 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site |
