Diodes Menu Close
Back to Transistors 60V to 100V

ZXTP25060BFH

PNP, 60V, 3A, SOT23

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium.

Application(s)

  • MOSFET gate drivers
  • Power switches
  • Motor control
  • Product Specifications

    Product Parameters

    Category Low Saturation Transistor
    Compliance(Only Automotive supports PPAP) Standard
    Polarity PNP
    VCEO, VCES (V) 60
    IC (A) 3
    ICM (A) 9
    PD (W) 1.25
    hFE (Min) 100
    hFE (@ IC) (A) 0.01
    hFE(Min 2) 30
    hFE (@ IC2) (A) 3
    VCE(sat) Max (mV) 135
    VCE(SAT) (@ IC/IB) (A/mA) 0.5/10
    VCE(sat) (Max.2) (mV) 235
    VCE(sat) (@ IC/IB2) (A/mA) 3/300
    fT (MHz) 250
    RCE(sat) (mΩ) 58

    Related Content

    Packages

    Technical Documents

    SPICE Model

    Recommended Soldering Techniques

    TN1.pdf

    Orderable Part Number Buy from Distributor / Contact Sales Request Samples
    ZXTP25060BFH

    ZXTP25060BFH

    Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
    Farnell, An Avnet Company 2231 9/22/2021 England Buy Now
    Request Sample
    ZXTP25060BFHTA

    ZXTP25060BFHTA

    Authorized Distributor Quantity Inventory Date Countries/Regions Buy Online
    Arrow Electronics 2900 9/22/2021 United States Buy Now
    Mouser Electronics Inc. 2946 9/22/2021 South America, North America, Asia, Europe, Middle East Buy Now
    Digi-Key Electronics 11483 9/21/2021 Europe, Asia, North America Buy Now
    Future Electronics - Asia 51000 9/21/2021 Singapore Contact Sales
    Micronetics GmbH 12000 9/20/2021 Germany Contact Sales
    Request Sample

    PCNs

    Product Change Notices

    PCN # Issue Date Implementation Date Subject
    PCN-2305 2018-02-28 2018-05-28 Addition of A Passivation Layer Over The Top Metal of The Die for Selected BJT Devices