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ZLLS400

40V SURFACE MOUNT SCHOTTKY BARRIER DIODE

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Description

This compact SOD323 packaged Schottky diode offers users an excellent performance combination comprising high-current operation, extremely low leakage and low-forward voltage, ensuring suitability for applications requiring efficient operation at higher temperatures (above +85°C) see Operational Efficiency Chart on page 3.

Feature(s)

  • Low Equivalent On-Resistance
  • Extremely Low Leakage (10µA @30V)
  • High-Current Capability (IF = 0.52A)
  • Low VF, Fast Switching Schottky
  • ZLLS400 Complements Low Temperature Equivalent ZHCS400
  • Package Thermally Rated to +150°C
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • An Automotive Compliant part is available under a separate datasheet (ZLLS400Q)

Application(s)

  • DC–DC converters
  • Mobile telecoms
  • Charging circuits
  • Motor controls

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 0.52 A
@ TerminalTemperature TT (ºC) 25 ºC
Peak RepetitiveReverse VoltageVRRM (V) 40 V
Peak ForwardSurge CurrentIFSM(A) 12 A
Forward VoltageDrop VF(V) 0.8 V
@ IF (A) 1.5 A
Maximum ReverseCurrent IR (µA) 10 µA
@ VR (V) 30 V
Reverse RecoveryTime trr (ns) 3 ns
TotalCapacitance CT (pF) 15 pF

Related Content

Packages

Technical Documents

SPICE Model

MDS Reports

ICP Reports

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2670 2024-02-20 2024-05-20 Part Marking Change
PCN-2562 2022-01-04 2022-04-04 Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products