Diodes Incorporated

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  • Case: SMC
  • Case Material: Molded Plastic.
  • UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020D
  • Terminals: Lead-Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208
  • Polarity: Cathode Band or Cathode Notch
  • Weight: 0.21 grams (Approximate)


  • Glass Passivated Die Construction
  • High Current Capability
  • Ultra-Fast Recovery Time for High Efficiency
  • Maximum Operating Junction Temperature of +175°C
  • Lead Free Finish; RoHS Compliant
  • Halogen and Antimony Free. “Green” Device


  • Power Supplies
  • Lighting Ballasts

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Standard
AEC Qualified No
Configuration Single
Power Rating (W) 5.4 W
MaximumAverageRectifiedCurrent IO(A) 3 A
Maximum Peak Forward Surge Current IFSM (A) 120 A
Peak RepetitiveReverse VoltageVRRM (V) 1000 V
Forward Voltage Drop VF (V) 1.8 V
@ IF (A) 3 A
Maximum ReverseCurrent IR (µA) 10 µA
@ VR (V) 1000 V
Reverse Recovery Time trr (ns) 85 ns
TotalCapacitance CT (pF) 25 pF

Related Content



Technical Documents

Recommended Soldering Techniques


Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2588 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products
PCN-2398 2019-05-21 2019-08-21 Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products
PCN-2337 2018-06-04 2018-05-04 Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products


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