TT10M

10A Standard Recovery Bridge Rectifier

Datasheet

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Feature(s)

Glass Passivated Die Construction
Ideal for Printed Circuit Board
Reliable Low Cost Construction Utilizing Molded Plastic Technique
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Forward VoltageDrop V_F(V)	1.05
TotalCapacitance C_T(pF)	50 pF
MaximumAverageRectifiedCurrent I_O(A)	10 A
Peak RepetitiveReverse VoltageV_RRM(V)	1000 V
Maximum Peak Forward Surge Current I_{FSM (A)}	200 A
Maximum ReverseCurrent I_R(µA)	5 µA

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2658	2024-02-12	2024-05-12	Wafer Diameter Change from 4 inch to 5 inch at Diodes Internal Wafer Fabrication WX1 in WuXi, China for Select Discrete Products
PCN-2631	2023-11-07	2024-02-07	Transfer of Wafer Manufacturing Site for Select Discrete Products