Diodes Incorporated — Analog and discrete power solutions
SMC

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SMCJ30CAQ

1500W Surface Mount Transient Voltage Suppressor

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Description

Suitable to protect sensitive automotive circuits against surges defined in ISO7637-2 and against electrostatic discharges according to ISO10605.

Compliance with following standards:

  • ISO10605, C = 150pF, R = 330Ω:
    • 30kV (Air Discharge)
    • 30kV (Contact Discharge)
  • ISO7637-2
    • Pulse 1: VS = -100V
    • Pulse 2a: VS = +50V
    • Pulse 3a: VS = -150V
    • Pulse 3b: VS = +100V

Feature(s)

  • 1500W Peak Pulse Power Dissipation
  • 5V to 200V Standoff Voltages
  • Glass Passivated Die Construction
  • Unidirectional and Bidirectional Versions Available
  • Excellent Clamping Capability
  • Fast Response Time
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • The SMCJ5.0(C)AQ – SMCJ200(C)AQ are suitable for automotive applications requiring specific change control; these parts are AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities.

https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Automotive
Configuration Single (Bi-Directional)
Power Rating (W) 1500 W
Reverse Standoff Voltage VRWM(V) 30 V
Breakdown VoltageVBR Min(V) 33.3 V
BreakdownVoltageVBR Max (V) 36.8 V
Maximum Reverse Leakage CurrentIR @ VRWM Max (µA) 5 µA
Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) 48.4 V

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2702 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Automotive Products
PCN-2590 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2532 2021-10-04 2022-01-04 Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) on Select Automotive Products
PCN-2500 2021-03-24 2021-06-24 Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products
PCN-2404 2019-05-21 2019-08-21 Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Automotive Products