Diodes Incorporated — Analog and discrete power solutions
SMC

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMC

SMC

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMC

SMC

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMC

Back to Power Line Protection

SMCJ200A

1500W Surface-Mount Transient Voltage Suppressor

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Feature(s)

  • 1500W Peak Pulse Power Dissipation
  • 0V to 200V Standoff Voltages
  • Glass Passivated Die Construction
  • Unidirectional and Bidirectional Versions Available
  • Excellent Clamping Capability
  • Fast Response Time
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • An automotive-compliant part is available under separate datasheet (SMCJ5.0(C)AQ – SMCJ110(C)AQ)

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP) Standard
AEC Qualified No
Configuration Uni-Directional
Max Peak Pulse Current IPP@10X 1000μs Max(A) 4.6
Breakdown VoltageVBR Min(V) 224 V
Reverse Standoff Voltage VRWM(V) 200 V
VESD IEC61000-4-2 Contact Discharge(kV) 30 kV
Channel Input CapacitanceCT Typ (pF) N/A pF
Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) 324 V
Typ Reverse Leakage Current IR @ VRWM Max(µA) 1 µA

Related Content

Packages

Protocols

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

Something went wrong with your request. Please try again later. If this problem continues, please contact Diodes support for assistance.

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2701 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products
PCN-2588 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products