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600W SURFACE MOUNT AUTOMOTIVE TRANSIENT VOLTAGE SUPPRESSOR
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Suitable to protect sensitive automotive circuits against surges defined in ISO7637-2 and against electrostatic discharges according to ISO10605.
Compliance with the following standards:
Compliance with the following standards:
| Compliance (Only Automotive Supports PPAP) | Automotive |
|---|---|
| AEC Qualified | Yes |
| Configuration | Unidirectional |
| Breakdown VoltageVBR Min(V) | 11.1 V |
| Reverse Standoff Voltage VRWM(V) | 10 V |
| VESD IEC61000-4-2 Contact Discharge(kV) | 30 kV |
| Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) | 17 V |
| Typ Reverse Leakage Current IR @ VRWM Max(µA) | 5 µA |
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A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2590 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products |
| PCN-2500 | 2021-03-24 | 2021-06-24 | Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for Automotive Products |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2478 | 2020-08-13 | 2021-06-06 | Additional Wafer Source (GFAB) |
| PCN-2466 | 2020-07-02 | 2020-10-02 | Package Change and Additional Qualified Plating Source |
| PCN-2471 | 2020-07-01 | 2020-11-29 | Additional Wafer Source - GFAB |
| PCN-2458 | 2020-07-01 | 2020-10-01 | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2456 | 2020-05-29 | 2020-08-29 | Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site Using Copper or Palladium Coated Copper Bond Wire with Standardization of Assembly Bill of Materials, Or as an Additional Wafer Plating, Back Grinding and Back Metal Process Source, and Qualification of Additional Wafer Source for Select Discrete Products. |
| PCN-2459 | 2020-05-28 | 2020-11-28 | Device End of Life (EOL) |
| PCN-2460 | 2020-05-12 | 2020-05-12 | Qualified Additional Wafer Source and BGBM Source |
