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SDM20U40

Schottky

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Feature(s)

  • Low Forward Voltage Drop
  • Guard Ring Construction for Transient Protection
  • Negligible Reverse Recovery Time
  • Low Reverse Capacitance
  • Ultra-Small Surface-Mount Package
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/
  • An automotive-compliant part is available under separate datasheet (SDM20U40Q)

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

Yes

Configuration

Single

Power Rating(mW)

150 mW

Peak RepetitiveReverse VoltageVRRM (V)

40 V

Forward Continuous Current IFM (mA)

250 mA

Forward VoltageDrop VF(V)

0.37

@ IF(mA)

20 mA

Maximum ReverseCurrent IR (µA)

5 µA

@ VR (V)

30 V

Capacitance CTOT Typ (pF)

50 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2660 2024-03-13 2024-06-13 Qualification of Additional Wafer Source with Wafer Diameter and Mold Compound Changes for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site