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SDM1A30CSP (Obsolete)

1A SCHOTTKY BARRIER RECTIFER CHIP SCALE PACKAGE

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Description

The SDM1A30CSP is a 30V 1A Schottky barrier rectifier that is optimized for low forward voltage drop and low-leakage current, housed in a compact chip scale package (CSP) that occupies only 0.6mm2 board space. The low thermal resistance enables designers to meet design challenges of increasing efficiency while also reducing board space.

Feature(s)

  • Off Board Profile of 0.275mm — More than 30% Thinner than DFN1006
  • Low Forward Voltage (VF) Minimizes Conduction Losses and Improves Efficiency
  • Reduced High Temperature Reverse Leakage; Increased Reliability Against Thermal Runaway Failure in High Temperature Operation

Application(s)

  • Blocking Diode
  • Boost Diode
  • Switching Diode
  • Reverse Protection Diode

Product Specifications

Product Parameters

@ IF (A) 1
@ TerminalTemperature TT (ºC) N/A
@ VR (V) 30
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
Forward VoltageDrop VF(V) 0.525
MaximumAverageRectifiedCurrent IO (A) 1
Maximum ReverseCurrent IR (µA) 100
Peak ForwardSurge CurrentIFSM(A) 15
Peak RepetitiveReverse VoltageVRRM (V) 30
AEC Qualified No

Related Content

Packages

Applications

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2600 2022-10-03 2023-04-03 Device End of Life (EOL)
PCN-2560 2021-12-16 2021-12-16 Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT)

FAQs

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