Diodes Incorporated
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SDM10K45

Schottky

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Feature(s)

  • Fast Switching Speed
  • Ultra-Small Surface Mount Package
  • For General Purpose Switching Applications
  • High Conductance
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
Power Rating(mW) 200 mW
Peak RepetitiveReverse VoltageVRRM (V) 45 V
Forward Continuous Current IFM (mA) 100 mA
Forward VoltageDrop VF(V) 0.45
@ IF(mA) 10 mA
Maximum ReverseCurrent IR (µA) 1 µA
@ VR (V) 10 V
Capacitance CTOT Typ (pF) N/A pF

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2562 2022-01-04 2022-04-04 Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2459 2020-05-28 2020-11-28 Device End of Life (EOL)
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2418 2019-11-07 2020-05-07 Device End of Life (EOL)
PCN-2339 2018-06-15 2018-09-15 Qualification of Additional Wafer Source for Select Products