Diodes Incorporated
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SDM100K30L

Schottky

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Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 1 A
@ TerminalTemperature TT (ºC) 25 ºC
Peak RepetitiveReverse VoltageVRRM (V) 30 V
Peak ForwardSurge CurrentIFSM(A) 9 A
Forward VoltageDrop VF(V) 0.48 V
@ IF (A) 1 A
Maximum ReverseCurrent IR (µA) 100 µA
@ VR (V) 20 V
TotalCapacitance CT (pF) 25 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2623 2023-05-15 2023-11-15 Device End of Life (EOL)
PCN-2562 2022-01-04 2022-04-04 Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi