Diodes Incorporated — Analog and discrete power solutions
X3 DFN0603 2

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. X3-DFN0603-2

X3 DFN0603 2

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. X3-DFN0603-2

X3 DFN0603 2

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. X3-DFN0603-2

Back to SDM02M30LP3

SDM02M30LP3

ULTRA-SMALL SURFACE MOUNT SCHOTTKY DIODE

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Description

The SDM02M30LP3 is a Schottky barrier diode optimized for low forward voltage drop and very low reverse leakage current. Encapsulated in the ultra-small DFN-0603 with footprint of 0.18mm2 and ultra-low package profile, this device is designed for saving PCB space in portable electronic devices.

Feature(s)

  • Ultra-Small Leadless Surface Mount Package (0.6mm x 0.3mm)
  • Very Low Reverse Leakage Current
  • Low Forward Voltage
  • Fast Reverse Recovery
  • Low Capacitance

Application(s)

  • Portable Device
  • Mobile Applications
  • LCD and Keypad Backlighting
  • Clamping Protection
  • Reverse Voltage and Current Protection
  • Freewheeling Diode

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)

Standard

AEC Qualified

No

Configuration

Single

Power Rating(mW)

250 mW

Peak RepetitiveReverse VoltageVRRM (V)

30 V

Forward Continuous Current IFM (mA)

100 mA

Forward VoltageDrop VF(V)

0.45

@ IF(mA)

10 mA

Maximum ReverseCurrent IR (µA)

0.4 µA

@ VR (V)

30 V

Capacitance CTOT Typ (pF)

N/A pF

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2623 2023-05-15 2023-11-15 Device End of Life (EOL)
PCN-2477 2020-08-17 2021-05-09 Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site