Diodes Incorporated — Analog and discrete power solutions
PowerDI5060 8

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. PowerDI5060-8

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SBRT20U50SLP

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Description

Packaged in the compact thermally efficient POWERDI5060-8 package, the SBRT20U50SLP provides very low VF and excellent reverse leakage stability at high temperatures.

Feature(s)

  • Reduced Ultra-Low Forward Voltage Drop (VF); Better Efficiency and Cooler Operation
  • Reduced High Temperature Reverse Leakage; Increased Reliability Against Thermal Runaway Failure in High-Temperature Operation
  • Less than 1.1mm Package Profile – Ideal for Thin Applications
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free “Green” Device (Note 3)
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/
  • An automotive-compliant part is available under a separate datasheet (SBRT20U50SLPQ).

Application(s)

  • DC-DC Converters
  • AC-DC Adaptors

 

Specifications & Technical Documents

Product Parameters

AEC Qualified

Yes

Compliance (Only Automotive Supports PPAP)

Standard

Product Type

Super Barrier Rectifier

Configuration

Single

Maximum Average Rectified Current IO (A)

20

Peak Forward Surge Current IFSM (A)

200

Peak Repetitive Reverse Voltage VRRM (V)

50

Forward VoltageDrop VF(V)

0.5

@ IF (A)

20

Maximum Reverse Current IR (μA)

500

@ VR (V)

50

Total Capacitance CT (pF)

350

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2770 2025-10-30 2025-10-30 Add Fab Site Code, Country of Diffusion (COD) and Assembly Site Origin (ASO) on Product and Shipping Labels for all Diodes Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products