Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. PowerDI5060-8

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SBRT20U100SLP

Datasheet

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Description

Packaged in the compact thermally efficient PowerDI® 5060-8 package, the SBRT20U100SLP provides very low V_F and excellent reverse leakage stability at high temperatures. It is ideal for use as a rectifier, freewheel diode or blocking diode in DC-DC converters and AC-DC adaptors.

Feature(s)

Reduced Ultra-Low Forward Voltage Drop (V_F) – Better Efficiency and Cooler Operation
Reduced High Temperature Reverse Leakage – Increased Reliability Against Thermal Runaway Failure in High Temperature Operation
Less than 1.1mm Package Profile – Ideal for Thin Applications
Patented Super Barrier Rectifier Technology (SBR®)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Application(s)

DC-DC converters
AC-DC adaptors

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)	Standard
AEC Qualified	Yes
Configuration	Single
MaximumAverageRectifiedCurrent I_O(A)	20 A
Peak RepetitiveReverse VoltageV_RRM(V)	100 V
Peak ForwardSurge CurrentI_FSM(A)	180 A
Forward VoltageDrop V_F(V)	0.7
@ I_F(A)	20 A
Maximum ReverseCurrent I_R(µA)	300 µA
@ V_R(V)	100 V

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Purchase & Availability

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Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2495	2021-03-31	2021-07-01	Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products