Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMA
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMA
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMA
SBR
Log in or register to manage email notifications about changes to datasheets or PCNs for this part.
| Compliance (Only Automotive Supports PPAP) | Standard |
|---|---|
| @ TerminalTemperature TT (ºC) | - |
| AEC Qualified | Yes |
| Configuration | Single |
| Maximum Average Rectified Current IO (A) | 3 |
| Peak Repetitive Reverse Voltage VRRM (V) | 20 |
| Peak Forward Surge Current IFSM (A) | 66 |
| Forward VoltageDrop VF(V) | 0.39 |
| @ IF (A) | 3 |
| Maximum Reverse Current IR (μA) | 500 |
| @ VR (V) | 20 |
| Reverse Recovery Time trr (ns) | - |
| Total Capacitance CT (pF) | 1300 |
Something went wrong with your request. Please try again later. If this problem continues, please contact Diodes support for assistance.
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2660 | 2024-03-13 | 2024-06-13 | Qualification of Additional Wafer Source with Wafer Diameter and Mold Compound Changes for Select Discrete Products |
| PCN-2542 | 2021-08-30 | 2021-11-30 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |
