Diodes Incorporated

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Product Specifications

Product Parameters

@ TerminalTemperature TT (ºC) N/A
AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Automotive
Configuration Single
Maximum Average Rectified Current IO (A) 2
Peak Repetitive Reverse Voltage VRRM (V) 60
Peak Forward Surge Current IFSM (A) 30
Forward VoltageDrop VF(V) 0.7
@ IF (A) 2
Maximum Reverse Current IR (μA) 0.8
@ VR (V) 60
Reverse Recovery Time trr (ns) N/A
Total Capacitance CT (pF) N/A

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Technical Documents

Recommended Soldering Techniques


Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2661 2024-02-21 2024-05-21 Qualification of Additional Wafer Source and Wafer Diameter Change
PCN-2590 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2500 2021-03-24 2021-06-24 Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products